JP4811108B2 - 被覆層の厚み計量機構およびそれを用いた被覆層形成装置 - Google Patents
被覆層の厚み計量機構およびそれを用いた被覆層形成装置 Download PDFInfo
- Publication number
- JP4811108B2 JP4811108B2 JP2006130924A JP2006130924A JP4811108B2 JP 4811108 B2 JP4811108 B2 JP 4811108B2 JP 2006130924 A JP2006130924 A JP 2006130924A JP 2006130924 A JP2006130924 A JP 2006130924A JP 4811108 B2 JP4811108 B2 JP 4811108B2
- Authority
- JP
- Japan
- Prior art keywords
- coating layer
- thickness
- base
- base material
- detection unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Physical Vapour Deposition (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Description
図1に本発明の計量機構の一例を含んだ真空蒸着被覆処理装置を模式的に示す。導電性フィルムである基材1は、図の右手の真空室2の外に置かれた供給側ローラ(図示せず)から真空室内に置かれた処理基地のローラ3に送られ、Siなどの蒸着層がその表面に形成された後、図の左手の真空室の外に置かれた回収側ローラ(図示せず)に巻き取り回収される。供給側ローラは、例えば、電磁式のトルク制御機構を介してモータで搬送方向とは逆方向の引張応力T1を受け、これを基材1に伝えるように設定されている。他方回収側ローラは、電磁式のトルク制御機構を介してモータで搬送方向の引張応力T2を受け、これを基材1に伝えるように設定されている。処理基地のローラ3は、サーボモータ(図示せず)でこれらの張力の差を常時適正な範囲内に制御するように設定されている。なお同ローラへの基材1の接触角(ローラに基材が摺接する外周部に対応する中心角。すなわち図の破線で示すθ)を決めて被覆処理を行う場合には、両検出部の基地の外側に適宜ガイドローラなどを配置する。本実施例では真空室外の供給側と回収側にガイドローラ(図示せず)を設置して、同ローラへのテープの接触角が、ほぼ220度になるようにした。
実施例1で用いた幅130mmで厚み10μm、長さ500m、その表面粗さがRaで2μmの純銅箔の基材を用意した。実施例1とほぼ同じ搬送条件とし、検知部の張力T3を200MPaに設定して、表2の「被覆層」の材質欄に記載の各種材質の層を平均厚み5μm程度で基材面に蒸着させた。
2、真空室
3、処理基地ローラ
4、検知部
5、ローラの軸芯
6、CCDカメラ
7、基材の外径
8、検知部
10、制御器
41、ピンチローラ
42、ピンチローラ
43、静電容量式変位計
81、ピンチローラ
82、ピンチローラ
83、静電容量式変位計
91、フィールドスルー(中継地点)
92、フィールドスルー(中継地点)
93、電気的連絡部
94、電気的連絡部
Claims (6)
- 導電性長尺基材を搬送しつつ被覆処理基地で該基材上に被覆層を形成する装置に備えられた該被覆層の厚みを連続的に確認する計量機構であって、該被覆層の静電容量値を計量する検知部が、前記処理部の前後に配置され、該検知部での該基材にかかる張力が、該基地での該基材にかかる張力よりも大きく設定された計量機構。
- 前記検知部での前記基材にかかる張力が、7ないし400MPaの範囲内にある請求項1に記載の計量機構。
- 前記基材の表面粗さが、Raで0.1ないし2μmである請求項1または2に記載の計量機構。
- 請求項1ないし3のいずれかの計量機構を用いた被覆層形成装置。
- 前記検知部および前記被覆処理基地が真空室内に、該検知部の電気制御部が該真空室外に、フィールドスルー部が該真空室の隔壁に、それぞれ置かれ、該検知部と該制御部との間が電気的連絡部で繋がれており、該電気的連絡部と該フィールドスルー部の特性インピーダンスが、互いに整合されている請求項4に記載の被覆層形成装置。
- 前記計量機構で確認された被覆層の厚みと該計量機構内に記録された該被覆層の厚み制御範囲との比較情報を、基地の該被覆層を形成する製造要因の制御系にヒードバックし、厚みが所望の範囲内に制御される請求項5に記載の被覆層形成装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006130924A JP4811108B2 (ja) | 2006-05-10 | 2006-05-10 | 被覆層の厚み計量機構およびそれを用いた被覆層形成装置 |
KR1020070044011A KR20070109858A (ko) | 2006-05-10 | 2007-05-07 | 피복층의 두께계량기구 및 그것을 이용한 피복층형성장치 |
US11/797,796 US7946247B2 (en) | 2006-05-10 | 2007-05-08 | Coating layer thickness measurement mechanism and coating layer forming apparatus using the same |
TW096116387A TWI403689B (zh) | 2006-05-10 | 2007-05-09 | 被覆層之厚度計量機構及使用它之被覆層形成裝置 |
CN2007101032550A CN101078613B (zh) | 2006-05-10 | 2007-05-10 | 涂层厚度测量机构和利用该机构的涂层形成设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006130924A JP4811108B2 (ja) | 2006-05-10 | 2006-05-10 | 被覆層の厚み計量機構およびそれを用いた被覆層形成装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007302929A JP2007302929A (ja) | 2007-11-22 |
JP4811108B2 true JP4811108B2 (ja) | 2011-11-09 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006130924A Expired - Fee Related JP4811108B2 (ja) | 2006-05-10 | 2006-05-10 | 被覆層の厚み計量機構およびそれを用いた被覆層形成装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7946247B2 (ja) |
JP (1) | JP4811108B2 (ja) |
KR (1) | KR20070109858A (ja) |
CN (1) | CN101078613B (ja) |
TW (1) | TWI403689B (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010081673A (ja) * | 2008-09-24 | 2010-04-08 | Sanyo Electric Co Ltd | バッテリシステム及びバッテリパック |
US20110056729A1 (en) * | 2009-09-09 | 2011-03-10 | Cochlear Limited | Insulated conductive element having a substantially continuous barrier layer formed through continuous vapor deposition |
US8726492B2 (en) * | 2009-09-09 | 2014-05-20 | Cochlear Limited | Insulated conductive element having a substantially continuous barrier layer formed through multiple coatings |
US8545926B2 (en) * | 2009-09-09 | 2013-10-01 | Cochlear Limited | Method of forming insulated conductive element having substantially continuously coated sections separated by uncoated gaps |
US8460746B2 (en) * | 2009-09-09 | 2013-06-11 | Cochlear Limited | Method of forming insulated conductive element having a substantially continuous barrier layer formed via relative motion during deposition |
CN102080949B (zh) * | 2009-12-01 | 2013-11-06 | 无锡华润上华半导体有限公司 | 硅外延膜厚测量方法及装置 |
WO2012072120A1 (en) * | 2010-11-30 | 2012-06-07 | Applied Materials Inc. | Apparatus and method for monitoring a deposition of one or more layers in a deposition device |
CN102493146B (zh) * | 2011-11-26 | 2013-02-13 | 南通全技纺织涂层有限公司 | 智能型功能涂层织物涂层厚度在线检测与自适应控制装置 |
JP5958092B2 (ja) * | 2012-05-31 | 2016-07-27 | ソニー株式会社 | 成膜装置及び成膜方法 |
CN102954781B (zh) * | 2012-11-16 | 2015-02-18 | 黄石山力兴冶薄板有限公司 | 镀层测厚仪双重保护装置 |
KR20150061593A (ko) * | 2013-11-27 | 2015-06-04 | 시바우라 메카트로닉스 가부시끼가이샤 | 도포 장치, 도포 방법, 표시 장치용 부재의 제조 장치 및 표시 장치용 부재의 제조 방법 |
CN103981505B (zh) * | 2014-05-06 | 2016-04-13 | 京东方科技集团股份有限公司 | 一种监控装置 |
CN104152855A (zh) * | 2014-07-11 | 2014-11-19 | 苏州诺耀光电科技有限公司 | 一种薄膜厚度检测机构 |
CN107475683B (zh) * | 2017-08-23 | 2019-06-18 | 京东方科技集团股份有限公司 | 一种镀膜设备及其检测方法 |
GB2575786B (en) | 2018-07-20 | 2021-11-03 | Dyson Technology Ltd | Stack for an energy storage device |
CN110257792B (zh) * | 2019-06-20 | 2021-11-23 | 上海超导科技股份有限公司 | 生长第二代高温超导带材阻挡层复合膜的镀膜机构及装置 |
CN115491663B (zh) * | 2022-11-21 | 2023-03-24 | 常州翊迈新材料科技有限公司 | 燃料电池金属极板涂层厚度在线监控装置 |
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JPS61264514A (ja) | 1985-05-17 | 1986-11-22 | Matsushita Electric Ind Co Ltd | 薄膜製造装置 |
JPS61278032A (ja) | 1985-05-31 | 1986-12-08 | Hitachi Maxell Ltd | 磁気記録媒体の製造方法およびその装置 |
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US5948166A (en) * | 1996-11-05 | 1999-09-07 | 3M Innovative Properties Company | Process and apparatus for depositing a carbon-rich coating on a moving substrate |
JPH10318957A (ja) | 1997-05-19 | 1998-12-04 | Sony Corp | 成膜装置 |
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JP2004303292A (ja) * | 2003-03-28 | 2004-10-28 | Dainippon Printing Co Ltd | 情報記録媒体の製造方法及び製造装置 |
JP2005023384A (ja) * | 2003-07-03 | 2005-01-27 | Hitachi Metals Ltd | めっき用基材 |
TWI251661B (en) * | 2005-02-02 | 2006-03-21 | China Steel Corp | Measuring system and methodology for profile of steel bloom |
-
2006
- 2006-05-10 JP JP2006130924A patent/JP4811108B2/ja not_active Expired - Fee Related
-
2007
- 2007-05-07 KR KR1020070044011A patent/KR20070109858A/ko not_active Application Discontinuation
- 2007-05-08 US US11/797,796 patent/US7946247B2/en not_active Expired - Fee Related
- 2007-05-09 TW TW096116387A patent/TWI403689B/zh not_active IP Right Cessation
- 2007-05-10 CN CN2007101032550A patent/CN101078613B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20070261638A1 (en) | 2007-11-15 |
TWI403689B (zh) | 2013-08-01 |
KR20070109858A (ko) | 2007-11-15 |
CN101078613B (zh) | 2012-07-04 |
JP2007302929A (ja) | 2007-11-22 |
TW200745509A (en) | 2007-12-16 |
CN101078613A (zh) | 2007-11-28 |
US7946247B2 (en) | 2011-05-24 |
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