PL3775328T3 - Urządzenie do wytwarzania kryształów AIII-BV oraz płytki podłożowe z nich wykonane i wolne od naprężeń szczątkowych oraz dyslokacji - Google Patents
Urządzenie do wytwarzania kryształów AIII-BV oraz płytki podłożowe z nich wykonane i wolne od naprężeń szczątkowych oraz dyslokacjiInfo
- Publication number
- PL3775328T3 PL3775328T3 PL20730425.4T PL20730425T PL3775328T3 PL 3775328 T3 PL3775328 T3 PL 3775328T3 PL 20730425 T PL20730425 T PL 20730425T PL 3775328 T3 PL3775328 T3 PL 3775328T3
- Authority
- PL
- Poland
- Prior art keywords
- aiii
- dislocations
- crystals
- free
- manufacturing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
- C30B11/002—Crucibles or containers for supporting the melt
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/42—Gallium arsenide
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
- C30B11/003—Heating or cooling of the melt or the crystallised material
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B13/00—Single-crystal growth by zone-melting; Refining by zone-melting
- C30B13/14—Crucibles or vessels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3421—Arsenides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3451—Structure
- H10P14/3452—Microstructure
- H10P14/3458—Monocrystalline
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102019208389.7A DE102019208389A1 (de) | 2019-06-07 | 2019-06-07 | Verfahren zur Herstellung von Restspannungs- und versetzungsfreien AIII-BV-Substratwafern |
| PCT/EP2020/065375 WO2020245215A1 (en) | 2019-06-07 | 2020-06-03 | Device and method of manufacturing aiii-bv-crystals and substrate wafers manufactured thereof free of residual stress and dislocations |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3775328T3 true PL3775328T3 (pl) | 2024-03-25 |
Family
ID=70977534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL20730425.4T PL3775328T3 (pl) | 2019-06-07 | 2020-06-03 | Urządzenie do wytwarzania kryształów AIII-BV oraz płytki podłożowe z nich wykonane i wolne od naprężeń szczątkowych oraz dyslokacji |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11965266B2 (pl) |
| EP (2) | EP3775328B1 (pl) |
| JP (3) | JP7329541B2 (pl) |
| KR (3) | KR102628746B1 (pl) |
| CN (2) | CN116856061A (pl) |
| DE (1) | DE102019208389A1 (pl) |
| PL (1) | PL3775328T3 (pl) |
| TW (3) | TWI768366B (pl) |
| WO (1) | WO2020245215A1 (pl) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019208389A1 (de) * | 2019-06-07 | 2020-12-10 | Freiberger Compound Materials Gmbh | Verfahren zur Herstellung von Restspannungs- und versetzungsfreien AIII-BV-Substratwafern |
| CN113423876B (zh) * | 2019-07-10 | 2023-12-22 | 住友电气工业株式会社 | 砷化镓单晶基板 |
| JP7146988B1 (ja) * | 2021-03-19 | 2022-10-04 | Dowaエレクトロニクス株式会社 | GaAsウエハの製造方法およびGaAsウエハ群 |
| CN114111688B (zh) * | 2021-07-29 | 2023-08-25 | 深圳市中图仪器股份有限公司 | 正交轴系统的正交性的测量装置和方法 |
| WO2023054202A1 (ja) * | 2021-09-29 | 2023-04-06 | Dowaエレクトロニクス株式会社 | GaAsウエハ、GaAsウエハ群及びGaAsインゴットの製造方法 |
| WO2024142270A1 (ja) * | 2022-12-27 | 2024-07-04 | 住友電気工業株式会社 | ヒ化ガリウム単結晶基板およびその製造方法 |
| DE102023200457A1 (de) * | 2023-01-20 | 2024-07-25 | Freiberger Compound Materials Gesellschaft mit beschränkter Haftung | Vorrichtung und Verfahren zur Herstellung von AIII-BV-Verbindungshalbleiter-Einkristallen sowie AIII-BV-Verbindungshalbleiter-Einkristall und -Wafer |
| CN119768572A (zh) * | 2023-04-18 | 2025-04-04 | 住友电气工业株式会社 | 磷化铟单晶衬底以及磷化铟单晶的制造方法 |
| CN121443782A (zh) * | 2023-10-04 | 2026-01-30 | 住友电气工业株式会社 | 砷化镓单晶的制造方法、砷化镓单晶衬底的制造方法、砷化镓单晶衬底以及砷化镓单晶 |
| JPWO2025079255A1 (pl) * | 2023-10-13 | 2025-04-17 | ||
| KR20250069793A (ko) | 2023-11-11 | 2025-05-20 | 손준우 | 자동 회전 슬리퍼 |
| DE102024202321A1 (de) | 2024-03-12 | 2025-09-18 | Forschungsverbund Berlin E.V. | Verbesserte dotierte InP-Kristalle |
| JP7790635B1 (ja) * | 2024-11-27 | 2025-12-23 | 住友電気工業株式会社 | リン化インジウム基板およびリン化インジウム結晶の製造方法 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58194792A (ja) * | 1982-05-04 | 1983-11-12 | Mitsubishi Monsanto Chem Co | 無機化合物単結晶の製造方法 |
| FR2546912B1 (fr) | 1983-06-06 | 1987-07-10 | Commissariat Energie Atomique | Procede et dispositif d'elaboration d'un monocristal |
| JP3391503B2 (ja) * | 1993-04-13 | 2003-03-31 | 同和鉱業株式会社 | 縦型ボート法による化合物半導体単結晶の製造方法 |
| JP3656261B2 (ja) | 1994-10-24 | 2005-06-08 | 住友電気工業株式会社 | GaAs結晶の熱処理方法 |
| JP3201305B2 (ja) * | 1996-04-26 | 2001-08-20 | 住友電気工業株式会社 | Iii−v族化合物半導体結晶の製造方法 |
| US6572700B2 (en) | 1997-12-26 | 2003-06-03 | Sumitomo Electric Industries, Ltd. | Semiconductor crystal, and method and apparatus of production thereof |
| JP3797824B2 (ja) | 1998-07-07 | 2006-07-19 | 三菱化学株式会社 | p型GaAs単結晶およびその製造方法 |
| JP2000203981A (ja) * | 1999-01-13 | 2000-07-25 | Kobe Steel Ltd | 多連型単結晶製造装置 |
| DE19912486A1 (de) | 1999-03-19 | 2000-09-28 | Freiberger Compound Mat Gmbh | Verfahren und Vorrichtung zur Herstellung von Einkristallen sowie Kristallkeim |
| WO2003005417A2 (en) * | 2001-07-05 | 2003-01-16 | Axt, Inc. | Method and apparatus for growing semiconductor crystals with a rigid support |
| US7175707B2 (en) * | 2003-03-24 | 2007-02-13 | Hitachi Cable Ltd. | P-type GaAs single crystal and its production method |
| EP1634981B1 (en) * | 2003-05-07 | 2020-06-24 | Sumitomo Electric Industries, Ltd. | Indium phosphide substrate, indium phosphide single crystal and process for producing them |
| TWI281520B (en) | 2003-07-17 | 2007-05-21 | Showa Denko Kk | InP single crystal, GaAs single crystal, and method for producing thereof |
| JP2005132717A (ja) * | 2003-10-10 | 2005-05-26 | Showa Denko Kk | 化合物半導体単結晶およびその製造方法 |
| JP2005298254A (ja) * | 2004-04-09 | 2005-10-27 | Hitachi Cable Ltd | 化合物半導体単結晶成長用容器及びそれを用いた化合物半導体単結晶の製造方法 |
| US7214269B2 (en) | 2004-10-15 | 2007-05-08 | Hitachi Cable, Ltd. | Si-doped GaAs single crystal substrate |
| JP4146829B2 (ja) * | 2004-11-18 | 2008-09-10 | 日本電信電話株式会社 | 結晶製造装置 |
| WO2006106644A1 (ja) | 2005-03-31 | 2006-10-12 | Dowa Electronics Materials Co., Ltd. | SiドープGaAs単結晶インゴットおよびその製造方法、並びに、当該SiドープGaAs単結晶インゴットから製造されたSiドープGaAs単結晶ウェハ |
| US7566641B2 (en) | 2007-05-09 | 2009-07-28 | Axt, Inc. | Low etch pit density (EPD) semi-insulating GaAs wafers |
| KR100868726B1 (ko) * | 2007-05-11 | 2008-11-13 | 엑스탈테크놀로지 주식회사 | 갈륨비소 잉곳 생산을 위한 수직 브리지만 장치 및 방법 |
| DE102007026298A1 (de) * | 2007-06-06 | 2008-12-11 | Freiberger Compound Materials Gmbh | Anordnung und Verfahren zur Herstellung eines Kristalls aus der Schmelze eines Rohmaterials sowie Einkristall |
| DE102008032628A1 (de) * | 2008-07-11 | 2010-01-28 | Freiberger Compound Materials Gmbh | Verfahren zur Herstellung von dotierten Galliumarsenidsubstratwafern mit niedrigem optischen Absorptionskoeffizienten |
| JP2010064936A (ja) * | 2008-09-12 | 2010-03-25 | Hitachi Cable Ltd | 半導体結晶の製造方法 |
| KR100945668B1 (ko) * | 2008-12-11 | 2010-03-05 | (주)포티조 | Vgf법에 의한 갈륨비소 단결정 성장방법 |
| JP2011251892A (ja) * | 2010-05-07 | 2011-12-15 | Sumitomo Electric Ind Ltd | InP単結晶およびその製造方法 |
| JP6503642B2 (ja) * | 2014-06-09 | 2019-04-24 | 住友電気工業株式会社 | 結晶成長用坩堝 |
| EP3508621A4 (en) * | 2017-07-04 | 2020-04-22 | Sumitomo Electric Industries, Ltd. | GALLIUM ARSENIDE CRYSTAL BODY AND GALLIUM ARSENIDE CRYSTAL SUBSTRATE |
| CN109206980B (zh) * | 2018-10-31 | 2021-10-29 | 传美讯电子科技(珠海)有限公司 | 一种uv喷墨白色墨水 |
| DE102019208389A1 (de) * | 2019-06-07 | 2020-12-10 | Freiberger Compound Materials Gmbh | Verfahren zur Herstellung von Restspannungs- und versetzungsfreien AIII-BV-Substratwafern |
| US11608569B2 (en) * | 2020-02-28 | 2023-03-21 | Axt, Inc. | Low etch pit density, low slip line density, and low strain indium phosphide |
-
2019
- 2019-06-07 DE DE102019208389.7A patent/DE102019208389A1/de active Pending
-
2020
- 2020-06-03 KR KR1020227032693A patent/KR102628746B1/ko active Active
- 2020-06-03 EP EP20730425.4A patent/EP3775328B1/en active Active
- 2020-06-03 PL PL20730425.4T patent/PL3775328T3/pl unknown
- 2020-06-03 KR KR1020217016136A patent/KR102546061B1/ko active Active
- 2020-06-03 US US17/059,772 patent/US11965266B2/en active Active
- 2020-06-03 KR KR1020237041105A patent/KR102842541B1/ko active Active
- 2020-06-03 EP EP23186595.7A patent/EP4249650B1/en active Active
- 2020-06-03 TW TW109118710A patent/TWI768366B/zh active
- 2020-06-03 WO PCT/EP2020/065375 patent/WO2020245215A1/en not_active Ceased
- 2020-06-03 CN CN202310868230.9A patent/CN116856061A/zh active Pending
- 2020-06-03 JP JP2020563910A patent/JP7329541B2/ja active Active
- 2020-06-03 CN CN202010496246.8A patent/CN112048770B/zh active Active
- 2020-06-03 TW TW109206980U patent/TWM616656U/zh unknown
- 2020-06-03 TW TW110110272A patent/TWI774282B/zh active
-
2022
- 2022-06-02 JP JP2022090346A patent/JP7510969B2/ja active Active
-
2024
- 2024-06-24 JP JP2024101479A patent/JP2024111297A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP3775328B1 (en) | 2023-11-08 |
| TW202100818A (zh) | 2021-01-01 |
| EP4249650A2 (en) | 2023-09-27 |
| US20220106702A1 (en) | 2022-04-07 |
| TWM616656U (zh) | 2021-09-11 |
| EP4249650A3 (en) | 2023-10-25 |
| TWI768366B (zh) | 2022-06-21 |
| CN112048770A (zh) | 2020-12-08 |
| CN116856061A (zh) | 2023-10-10 |
| KR102546061B1 (ko) | 2023-06-21 |
| KR20230165390A (ko) | 2023-12-05 |
| KR20220132063A (ko) | 2022-09-29 |
| JP7329541B2 (ja) | 2023-08-18 |
| TW202132632A (zh) | 2021-09-01 |
| JP2022119962A (ja) | 2022-08-17 |
| DE102019208389A1 (de) | 2020-12-10 |
| TWI774282B (zh) | 2022-08-11 |
| JP2024111297A (ja) | 2024-08-16 |
| EP4249650B1 (en) | 2025-11-05 |
| EP3775328A1 (en) | 2021-02-17 |
| CN112048770B (zh) | 2023-08-29 |
| JP7510969B2 (ja) | 2024-07-04 |
| KR20210082508A (ko) | 2021-07-05 |
| US11965266B2 (en) | 2024-04-23 |
| KR102842541B1 (ko) | 2025-08-05 |
| KR102628746B1 (ko) | 2024-01-24 |
| JP2021533057A (ja) | 2021-12-02 |
| WO2020245215A1 (en) | 2020-12-10 |
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