PL3790041T3 - Element wstępnego wyrównywania płytki i sposób wstępnego wyrównywania płytki - Google Patents

Element wstępnego wyrównywania płytki i sposób wstępnego wyrównywania płytki

Info

Publication number
PL3790041T3
PL3790041T3 PL20194650.6T PL20194650T PL3790041T3 PL 3790041 T3 PL3790041 T3 PL 3790041T3 PL 20194650 T PL20194650 T PL 20194650T PL 3790041 T3 PL3790041 T3 PL 3790041T3
Authority
PL
Poland
Prior art keywords
wafer
aligner
aligning
wafer pre
Prior art date
Application number
PL20194650.6T
Other languages
English (en)
Inventor
John Charles Rogers
Margaret Kathleen SWIECICKI
Original Assignee
Kabushiki Kaisha Yaskawa Denki
Yaskawa America, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Yaskawa Denki, Yaskawa America, Inc. filed Critical Kabushiki Kaisha Yaskawa Denki
Publication of PL3790041T3 publication Critical patent/PL3790041T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/41—Refractivity; Phase-affecting properties, e.g. optical path length
    • G01N21/43—Refractivity; Phase-affecting properties, e.g. optical path length by measuring critical angle
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
PL20194650.6T 2019-09-06 2020-09-04 Element wstępnego wyrównywania płytki i sposób wstępnego wyrównywania płytki PL3790041T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962896866P 2019-09-06 2019-09-06
US17/005,378 US11929277B2 (en) 2019-09-06 2020-08-28 Wafer pre-aligner and method of pre-aligning wafer

Publications (1)

Publication Number Publication Date
PL3790041T3 true PL3790041T3 (pl) 2023-02-06

Family

ID=72381028

Family Applications (1)

Application Number Title Priority Date Filing Date
PL20194650.6T PL3790041T3 (pl) 2019-09-06 2020-09-04 Element wstępnego wyrównywania płytki i sposób wstępnego wyrównywania płytki

Country Status (10)

Country Link
US (1) US11929277B2 (pl)
EP (1) EP3790041B1 (pl)
JP (1) JP7665305B2 (pl)
KR (1) KR102793608B1 (pl)
CN (1) CN112466802B (pl)
DK (1) DK3790041T3 (pl)
ES (1) ES2928291T3 (pl)
PL (1) PL3790041T3 (pl)
SG (1) SG10202008623SA (pl)
TW (1) TWI833988B (pl)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113889429B (zh) * 2021-12-06 2022-04-15 杭州众硅电子科技有限公司 一种用于晶圆的寻位装置、寻位方法及晶圆计速方法
KR102501318B1 (ko) * 2022-04-07 2023-02-16 양희찬 웨이퍼 이동암
EP4273911A1 (de) 2022-05-03 2023-11-08 Werner Lieb GmbH Haltevorrichtung und verfahren zum halten und/oder transportieren von werkstücken und/oder bauteilen, optional mit werkzeugfrei auswechselbaren saugerelementen
CN115332137B (zh) * 2022-08-15 2025-03-14 北京北方华创微电子装备有限公司 反应腔室和晶圆对准方法
JP2024054636A (ja) 2022-10-05 2024-04-17 川崎重工業株式会社 ロボットシステム、アライナおよび半導体基板のアライメント方法
US12046501B2 (en) 2022-10-06 2024-07-23 Kawasaki Jukogyo Kabushiki Kaisha Substrate handling apparatus and method of handling substrate
CN115831845A (zh) * 2022-12-21 2023-03-21 绍兴中芯集成电路制造股份有限公司 晶圆预对准装置及晶圆预对准方法
CN120998831B (zh) * 2025-10-22 2026-01-13 视睿（杭州）信息科技有限公司 一种晶圆扫描运动控制方法和系统

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JP2694468B2 (ja) 1989-12-20 1997-12-24 東京エレクトロン株式会社 位置検出方法および検査装置
US5513948A (en) * 1991-05-17 1996-05-07 Kensington Laboratories, Inc. Universal specimen prealigner
JPH0645226A (ja) * 1992-07-24 1994-02-18 Canon Inc 位置決め装置及びそれを用いた半導体素子の製造方法
JPH10256350A (ja) * 1997-03-06 1998-09-25 Toshiba Corp 半導体製造方法及びその装置
JP2000021956A (ja) 1998-07-02 2000-01-21 Mecs Corp ノッチ合わせ機
US6275742B1 (en) * 1999-04-16 2001-08-14 Berkeley Process Control, Inc. Wafer aligner system
JP3528785B2 (ja) * 2000-11-20 2004-05-24 株式会社安川電機 ウエハプリアライメント装置およびウエハエッジ位置検出方法
WO2003043077A1 (fr) * 2001-11-14 2003-05-22 Rorze Corporation Procede et appareil de positionnement de plaquette, systeme de traitement et procede de positionnement de l'axe du siege de plaquette d'un appareil de positionnement de plaquette
JP4258828B2 (ja) * 2002-06-06 2009-04-30 株式会社安川電機 ウエハプリアライメント装置および方法
US6932558B2 (en) * 2002-07-03 2005-08-23 Kung Chris Wu Wafer aligner
US8634633B2 (en) * 2003-11-10 2014-01-21 Brooks Automation, Inc. Wafer center finding with kalman filter
JP4636934B2 (ja) 2005-05-09 2011-02-23 タツモ株式会社 基板角度位置補正装置
CN100355055C (zh) 2005-10-28 2007-12-12 清华大学 硅晶圆预对准控制方法
TWI315455B (en) * 2006-06-23 2009-10-01 Littelfuse Concord Semiconductor Inc A structure and exposure method of double sided dual exposure mask aligner
JP5689704B2 (ja) * 2010-08-08 2015-03-25 日本電産サンキョー株式会社 モータ制御装置およびモータ制御方法
JP2012069590A (ja) * 2010-09-21 2012-04-05 Tokyo Electron Ltd ウエハの位置合わせ装置及びウエハの位置合わせ方法
CN103199046B (zh) 2012-01-05 2015-09-09 沈阳新松机器人自动化股份有限公司 晶圆缺口边缘中心预对准方法
JP6057640B2 (ja) * 2012-09-19 2017-01-11 住友精密工業株式会社 アライメント装置およびそのための回転条件調整方法および装置、並びに基板処理装置
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JP2016152284A (ja) * 2015-02-17 2016-08-22 キヤノン株式会社 位置決め装置、リソグラフィー装置、および基板位置決め方法
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CN112490168B (zh) * 2020-12-16 2025-04-15 福州大学 一种自动定位并校准晶圆中心的装置及方法

Also Published As

Publication number Publication date
EP3790041B1 (en) 2022-08-10
US20210074566A1 (en) 2021-03-11
SG10202008623SA (en) 2021-04-29
KR102793608B1 (ko) 2025-04-08
CN112466802B (zh) 2025-07-25
ES2928291T3 (es) 2022-11-16
TWI833988B (zh) 2024-03-01
KR20210029691A (ko) 2021-03-16
EP3790041A1 (en) 2021-03-10
CN112466802A (zh) 2021-03-09
TW202115606A (zh) 2021-04-16
US11929277B2 (en) 2024-03-12
DK3790041T3 (da) 2022-10-31
JP7665305B2 (ja) 2025-04-21
JP2021044548A (ja) 2021-03-18

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