PL3790041T3 - Element wstępnego wyrównywania płytki i sposób wstępnego wyrównywania płytki - Google Patents

Element wstępnego wyrównywania płytki i sposób wstępnego wyrównywania płytki

Info

Publication number
PL3790041T3
PL3790041T3 PL20194650.6T PL20194650T PL3790041T3 PL 3790041 T3 PL3790041 T3 PL 3790041T3 PL 20194650 T PL20194650 T PL 20194650T PL 3790041 T3 PL3790041 T3 PL 3790041T3
Authority
PL
Poland
Prior art keywords
wafer
aligner
aligning
wafer pre
Prior art date
Application number
PL20194650.6T
Other languages
English (en)
Inventor
John Charles Rogers
Margaret Kathleen SWIECICKI
Original Assignee
Kabushiki Kaisha Yaskawa Denki
Yaskawa America, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Yaskawa Denki, Yaskawa America, Inc. filed Critical Kabushiki Kaisha Yaskawa Denki
Publication of PL3790041T3 publication Critical patent/PL3790041T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/41—Refractivity; Phase-affecting properties, e.g. optical path length
    • G01N21/43—Refractivity; Phase-affecting properties, e.g. optical path length by measuring critical angle
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
PL20194650.6T 2019-09-06 2020-09-04 Element wstępnego wyrównywania płytki i sposób wstępnego wyrównywania płytki PL3790041T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962896866P 2019-09-06 2019-09-06
US17/005,378 US11929277B2 (en) 2019-09-06 2020-08-28 Wafer pre-aligner and method of pre-aligning wafer

Publications (1)

Publication Number Publication Date
PL3790041T3 true PL3790041T3 (pl) 2023-02-06

Family

ID=72381028

Family Applications (1)

Application Number Title Priority Date Filing Date
PL20194650.6T PL3790041T3 (pl) 2019-09-06 2020-09-04 Element wstępnego wyrównywania płytki i sposób wstępnego wyrównywania płytki

Country Status (9)

Country Link
US (1) US11929277B2 (pl)
EP (1) EP3790041B1 (pl)
JP (1) JP2021044548A (pl)
KR (1) KR20210029691A (pl)
CN (1) CN112466802A (pl)
DK (1) DK3790041T3 (pl)
ES (1) ES2928291T3 (pl)
PL (1) PL3790041T3 (pl)
SG (1) SG10202008623SA (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102501318B1 (ko) * 2022-04-07 2023-02-16 양희찬 웨이퍼 이동암
EP4273911A1 (de) 2022-05-03 2023-11-08 Werner Lieb GmbH Haltevorrichtung und verfahren zum halten und/oder transportieren von werkstücken und/oder bauteilen, optional mit werkzeugfrei auswechselbaren saugerelementen
JP2024054636A (ja) * 2022-10-05 2024-04-17 川崎重工業株式会社 ロボットシステム、アライナおよび半導体基板のアライメント方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2694468B2 (ja) 1989-12-20 1997-12-24 東京エレクトロン株式会社 位置検出方法および検査装置
JPH10256350A (ja) * 1997-03-06 1998-09-25 Toshiba Corp 半導体製造方法及びその装置
JP2000021956A (ja) 1998-07-02 2000-01-21 Mecs Corp ノッチ合わせ機
US6275742B1 (en) * 1999-04-16 2001-08-14 Berkeley Process Control, Inc. Wafer aligner system
EP1463106B1 (en) 2001-11-14 2011-01-05 Rorze Corporation Wafer positioning method
US6932558B2 (en) * 2002-07-03 2005-08-23 Kung Chris Wu Wafer aligner
US8634633B2 (en) * 2003-11-10 2014-01-21 Brooks Automation, Inc. Wafer center finding with kalman filter
JP4636934B2 (ja) 2005-05-09 2011-02-23 タツモ株式会社 基板角度位置補正装置
CN100355055C (zh) 2005-10-28 2007-12-12 清华大学 硅晶圆预对准控制方法
JP5689704B2 (ja) * 2010-08-08 2015-03-25 日本電産サンキョー株式会社 モータ制御装置およびモータ制御方法
CN103199046B (zh) 2012-01-05 2015-09-09 沈阳新松机器人自动化股份有限公司 晶圆缺口边缘中心预对准方法
WO2015123222A1 (en) * 2014-02-12 2015-08-20 Kla-Tencor Corporation Wafer notch detection
JP6568986B1 (ja) * 2018-06-28 2019-08-28 平田機工株式会社 アライメント装置、半導体ウエハ処理装置、およびアライメント方法

Also Published As

Publication number Publication date
DK3790041T3 (da) 2022-10-31
EP3790041B1 (en) 2022-08-10
US20210074566A1 (en) 2021-03-11
ES2928291T3 (es) 2022-11-16
SG10202008623SA (en) 2021-04-29
US11929277B2 (en) 2024-03-12
CN112466802A (zh) 2021-03-09
JP2021044548A (ja) 2021-03-18
KR20210029691A (ko) 2021-03-16
EP3790041A1 (en) 2021-03-10
TW202115606A (zh) 2021-04-16

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