PH31026A - Metal electronic package with reduced seal width. - Google Patents

Metal electronic package with reduced seal width.

Info

Publication number
PH31026A
PH31026A PH47026A PH47026A PH31026A PH 31026 A PH31026 A PH 31026A PH 47026 A PH47026 A PH 47026A PH 47026 A PH47026 A PH 47026A PH 31026 A PH31026 A PH 31026A
Authority
PH
Philippines
Prior art keywords
cavity
seal width
electronic package
package
metal electronic
Prior art date
Application number
PH47026A
Other languages
English (en)
Inventor
Derek E Tyler
Mahulikar Deepak
Anthony M Pasqualoni
Jeffrey S Braden
Paul R Hoffman
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of PH31026A publication Critical patent/PH31026A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
PH47026A 1992-10-13 1993-10-07 Metal electronic package with reduced seal width. PH31026A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/959,571 US5324888A (en) 1992-10-13 1992-10-13 Metal electronic package with reduced seal width

Publications (1)

Publication Number Publication Date
PH31026A true PH31026A (en) 1997-12-29

Family

ID=25502156

Family Applications (1)

Application Number Title Priority Date Filing Date
PH47026A PH31026A (en) 1992-10-13 1993-10-07 Metal electronic package with reduced seal width.

Country Status (10)

Country Link
US (2) US5324888A (ko)
EP (1) EP0664924A4 (ko)
JP (1) JPH08502389A (ko)
KR (1) KR950703795A (ko)
AU (1) AU5132693A (ko)
CA (1) CA2145076A1 (ko)
MX (1) MX9306317A (ko)
PH (1) PH31026A (ko)
TW (1) TW241389B (ko)
WO (1) WO1994009512A1 (ko)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5585600A (en) * 1993-09-02 1996-12-17 International Business Machines Corporation Encapsulated semiconductor chip module and method of forming the same
US5455456A (en) * 1993-09-15 1995-10-03 Lsi Logic Corporation Integrated circuit package lid
DE4405710A1 (de) * 1994-02-23 1995-08-24 Bosch Gmbh Robert Vorrichtung mit einer Trägerplatte und Verfahren zum Aufbringen eines Passivierungsgels
AU2103895A (en) * 1994-04-05 1995-10-23 Olin Corporation Cavity filled metal electronic package
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US5324888A (en) 1994-06-28
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WO1994009512A1 (en) 1994-04-28
EP0664924A1 (en) 1995-08-02
KR950703795A (ko) 1995-09-20
JPH08502389A (ja) 1996-03-12
US5399805A (en) 1995-03-21
CA2145076A1 (en) 1994-04-28
TW241389B (ko) 1995-02-21

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