FR2829874B1 - Systeme a semi-conducteur a boitier et enveloppe - Google Patents

Systeme a semi-conducteur a boitier et enveloppe

Info

Publication number
FR2829874B1
FR2829874B1 FR0210409A FR0210409A FR2829874B1 FR 2829874 B1 FR2829874 B1 FR 2829874B1 FR 0210409 A FR0210409 A FR 0210409A FR 0210409 A FR0210409 A FR 0210409A FR 2829874 B1 FR2829874 B1 FR 2829874B1
Authority
FR
France
Prior art keywords
envelope
housing
semiconductor system
package
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0210409A
Other languages
English (en)
Other versions
FR2829874A1 (fr
Inventor
Dai Nakajima
Yoshihiro Kashiba
Hideaki Chuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2829874A1 publication Critical patent/FR2829874A1/fr
Application granted granted Critical
Publication of FR2829874B1 publication Critical patent/FR2829874B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FR0210409A 2001-09-20 2002-08-20 Systeme a semi-conducteur a boitier et enveloppe Expired - Fee Related FR2829874B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001287031A JP4177571B2 (ja) 2001-09-20 2001-09-20 半導体装置

Publications (2)

Publication Number Publication Date
FR2829874A1 FR2829874A1 (fr) 2003-03-21
FR2829874B1 true FR2829874B1 (fr) 2005-11-11

Family

ID=19109906

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0210409A Expired - Fee Related FR2829874B1 (fr) 2001-09-20 2002-08-20 Systeme a semi-conducteur a boitier et enveloppe

Country Status (4)

Country Link
US (1) US6867484B2 (fr)
JP (1) JP4177571B2 (fr)
DE (1) DE10238037B4 (fr)
FR (1) FR2829874B1 (fr)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6791172B2 (en) * 2001-04-25 2004-09-14 General Semiconductor Of Taiwan, Ltd. Power semiconductor device manufactured using a chip-size package
JP4363190B2 (ja) 2004-01-08 2009-11-11 株式会社豊田自動織機 半導体装置及びその製造方法
JP4583122B2 (ja) * 2004-09-28 2010-11-17 三菱電機株式会社 半導体装置及びその製造方法
DE102005013762C5 (de) * 2005-03-22 2012-12-20 Sew-Eurodrive Gmbh & Co. Kg Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters
US8829661B2 (en) * 2006-03-10 2014-09-09 Freescale Semiconductor, Inc. Warp compensated package and method
US20070212813A1 (en) * 2006-03-10 2007-09-13 Fay Owen R Perforated embedded plane package and method
JP4760585B2 (ja) * 2006-07-18 2011-08-31 三菱電機株式会社 電力用半導体装置
US9373563B2 (en) * 2007-07-20 2016-06-21 Infineon Technologies Ag Semiconductor assembly having a housing
US8154114B2 (en) 2007-08-06 2012-04-10 Infineon Technologies Ag Power semiconductor module
US8018047B2 (en) * 2007-08-06 2011-09-13 Infineon Technologies Ag Power semiconductor module including a multilayer substrate
JP4930406B2 (ja) * 2008-02-18 2012-05-16 株式会社安川電機 パワー半導体装置及びこれを用いたインバータ装置
TW201011869A (en) * 2008-09-10 2010-03-16 Cyntec Co Ltd Chip package structure
JP5644440B2 (ja) * 2010-12-03 2014-12-24 富士電機株式会社 パワー半導体モジュール
WO2013121491A1 (fr) 2012-02-13 2013-08-22 パナソニック株式会社 Dispositif à semi-conducteur et son procédé de fabrication
JP5656907B2 (ja) * 2012-04-11 2015-01-21 三菱電機株式会社 パワーモジュール
US9437508B2 (en) 2012-05-15 2016-09-06 Panasonic Intellectual Property Management Co., Ltd. Method for manufacturing semiconductor device and semiconductor device
US9572291B2 (en) 2012-05-22 2017-02-14 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device and method for manufacturing same
WO2014046058A1 (fr) 2012-09-20 2014-03-27 ローム株式会社 Dispositif semi-conducteur de module de puissance et dispositif onduleur, procédé de production de dispositif semi-conducteur de module de puissance et moule
US9397018B2 (en) * 2013-01-16 2016-07-19 Infineon Technologies Ag Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit
DE102013102829B4 (de) * 2013-03-20 2017-10-19 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul und Anordnung hiermit
JP6152893B2 (ja) 2013-09-30 2017-06-28 富士電機株式会社 半導体装置、半導体装置の組み立て方法、半導体装置用部品及び単位モジュール
US9196510B2 (en) 2013-11-12 2015-11-24 Infineon Technologies Ag Semiconductor package comprising two semiconductor modules and laterally extending connectors
JP6246051B2 (ja) * 2014-04-17 2017-12-13 三菱電機株式会社 電力半導体装置およびその製造方法
JP6526323B2 (ja) * 2016-04-04 2019-06-05 三菱電機株式会社 パワーモジュール、パワー半導体装置及びパワーモジュール製造方法
EP3872851A1 (fr) * 2020-02-27 2021-09-01 Infineon Technologies Austria AG Capuchon de protection pour emballage avec matériau d'interface thermique
CN116936486B (zh) 2020-10-14 2024-04-05 罗姆股份有限公司 半导体模块
CN116936561B (zh) 2020-10-14 2024-05-03 罗姆股份有限公司 半导体模块
DE202021004377U1 (de) 2020-10-14 2024-01-05 Rohm Co., Ltd. Halbleitermodul

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236591B2 (ja) 1979-08-27 1990-08-17 Kyoto Pharma Ind Kinonjudotai
DE3631963A1 (de) * 1986-09-19 1988-03-31 Siemens Ag Verfahren zum erstellen einer flachbaugruppe
FR2648620B1 (fr) * 1989-06-16 1994-05-20 Thomson Hybrides Circuit hybride fonctionnant sous haute tension
JPH0476046A (ja) 1990-07-19 1992-03-10 Sumitomo Chem Co Ltd 熱可塑性樹脂組成物
JP2894071B2 (ja) * 1992-03-09 1999-05-24 株式会社日立製作所 半導体装置
TW212261B (en) * 1992-03-09 1993-09-01 Matsushita Electric Ind Co Ltd Electronic circuit device and manufacturing method
US5338974A (en) * 1993-03-17 1994-08-16 Spectrian, Inc. RF power transistor package
JP2875139B2 (ja) * 1993-07-15 1999-03-24 株式会社東芝 半導体装置の製造方法
US5612570A (en) * 1995-04-13 1997-03-18 Dense-Pac Microsystems, Inc. Chip stack and method of making same
EP1028520A4 (fr) * 1996-09-06 2000-08-16 Hitachi Ltd Dispositif a semi-conducteur
JPH10223819A (ja) * 1997-02-13 1998-08-21 Nec Kyushu Ltd 半導体装置
JPH10289970A (ja) 1997-04-16 1998-10-27 Takachiho Denki Kk モールド電子部品
US5869353A (en) * 1997-11-17 1999-02-09 Dense-Pac Microsystems, Inc. Modular panel stacking process
US6080932A (en) * 1998-04-14 2000-06-27 Tessera, Inc. Semiconductor package assemblies with moisture vents
FR2780577B1 (fr) * 1998-06-26 2000-09-15 Valeo Equip Electr Moteur Sous-ensemble a composants electroniques pour un alternateur de vehicule automobile
JP3888228B2 (ja) * 2002-05-17 2007-02-28 株式会社デンソー センサ装置

Also Published As

Publication number Publication date
JP4177571B2 (ja) 2008-11-05
US20030197255A1 (en) 2003-10-23
JP2003100987A (ja) 2003-04-04
FR2829874A1 (fr) 2003-03-21
US6867484B2 (en) 2005-03-15
DE10238037A1 (de) 2003-04-30
DE10238037B4 (de) 2014-02-13

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20160429