DE60308682D1 - Tragbarer silizium chip - Google Patents

Tragbarer silizium chip

Info

Publication number
DE60308682D1
DE60308682D1 DE60308682T DE60308682T DE60308682D1 DE 60308682 D1 DE60308682 D1 DE 60308682D1 DE 60308682 T DE60308682 T DE 60308682T DE 60308682 T DE60308682 T DE 60308682T DE 60308682 D1 DE60308682 D1 DE 60308682D1
Authority
DE
Germany
Prior art keywords
silicon chip
semiconductor die
portable silicon
portable
package body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60308682T
Other languages
English (en)
Other versions
DE60308682T2 (de
Inventor
George Marmaropoulos
Heerden Clive Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Application granted granted Critical
Publication of DE60308682D1 publication Critical patent/DE60308682D1/de
Publication of DE60308682T2 publication Critical patent/DE60308682T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • A—HUMAN NECESSITIES
    • A41—WEARING APPAREL
    • A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D1/00—Garments
    • A41D1/002—Garments adapted to accommodate electronic equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Measuring Fluid Pressure (AREA)
  • Led Device Packages (AREA)
DE60308682T 2002-06-28 2003-06-06 Tragbarer silizium chip Expired - Lifetime DE60308682T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US184510 2002-06-28
US10/184,510 US6646336B1 (en) 2002-06-28 2002-06-28 Wearable silicon chip
PCT/IB2003/002557 WO2004003999A1 (en) 2002-06-28 2003-06-06 Wearable silicon chip

Publications (2)

Publication Number Publication Date
DE60308682D1 true DE60308682D1 (de) 2006-11-09
DE60308682T2 DE60308682T2 (de) 2007-08-30

Family

ID=29400894

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60308682T Expired - Lifetime DE60308682T2 (de) 2002-06-28 2003-06-06 Tragbarer silizium chip

Country Status (9)

Country Link
US (1) US6646336B1 (de)
EP (1) EP1520296B1 (de)
JP (1) JP4704749B2 (de)
KR (1) KR100992001B1 (de)
CN (1) CN100511654C (de)
AT (1) ATE341100T1 (de)
AU (1) AU2003236971A1 (de)
DE (1) DE60308682T2 (de)
WO (1) WO2004003999A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2905518B1 (fr) * 2006-08-29 2008-12-26 Commissariat Energie Atomique Puce microelectronique a faces laterales munies de rainures et procede de fabrication
JP5519217B2 (ja) * 2009-08-31 2014-06-11 帝人デュポンフィルム株式会社 偏光子支持基材用フィルム
WO2012145865A1 (zh) * 2011-04-29 2012-11-01 Yang Chang-Ming 布料电子化的产品及方法
US10783424B1 (en) 2019-09-18 2020-09-22 Sensormatic Electronics, LLC Systems and methods for providing tags adapted to be incorporated with or in items
US11443160B2 (en) 2019-09-18 2022-09-13 Sensormatic Electronics, LLC Systems and methods for laser tuning and attaching RFID tags to products
US11055588B2 (en) 2019-11-27 2021-07-06 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
GB2589568A (en) 2019-11-28 2021-06-09 Prevayl Ltd Sensor device, system and wearable article
GB2593479B (en) * 2020-03-24 2024-04-03 Prevayl Innovations Ltd Article with semiconductor package and method
US11694057B2 (en) 2020-01-03 2023-07-04 Sensormatic Electronics, LLC RFID tag and method of making same
US11755874B2 (en) 2021-03-03 2023-09-12 Sensormatic Electronics, LLC Methods and systems for heat applied sensor tag
US11869324B2 (en) 2021-12-23 2024-01-09 Sensormatic Electronics, LLC Securing a security tag into an article

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3414666A (en) * 1963-10-14 1968-12-03 Electromechanical Devices Inc Weaved electronic equipment
JPH01191455A (ja) * 1988-01-27 1989-08-01 Hitachi Ltd 半導体装置
JPH06268101A (ja) * 1993-03-17 1994-09-22 Hitachi Ltd 半導体装置及びその製造方法、電子装置、リ−ドフレ−ム並びに実装基板
CA2162581C (en) * 1993-05-28 1999-08-24 Andrew R. Ferber Light, audio and current related assemblies, attachments and devices with conductive compositions
US5592408A (en) * 1994-01-03 1997-01-07 Security People, Inc. Identification card and access control device
JPH08139258A (ja) * 1994-11-08 1996-05-31 Hitachi Ltd 半導体装置
JPH09232467A (ja) * 1996-02-26 1997-09-05 Matsushita Electric Works Ltd プリント配線板の製造方法
JP2891665B2 (ja) * 1996-03-22 1999-05-17 株式会社日立製作所 半導体集積回路装置およびその製造方法
WO1998020403A2 (en) * 1996-11-01 1998-05-14 Via, Inc. Flexible wearable computer system
KR100280398B1 (ko) * 1997-09-12 2001-02-01 김영환 적층형 반도체 패키지 모듈의 제조 방법
US6180881B1 (en) * 1998-05-05 2001-01-30 Harlan Ruben Isaak Chip stack and method of making same
IT1304379B1 (it) * 1998-09-08 2001-03-15 Renato Guerra Giacca o tuta sportiva o da lavoro od indumento in genere dotata disegnaletica luminosa intermittente direzionale.
US6393745B1 (en) * 1998-09-24 2002-05-28 Emiko Miki Display media back pack and method of visual display
RU2134465C1 (ru) * 1998-12-08 1999-08-10 Таран Александр Иванович Однокристальный модуль ис
JP2003512734A (ja) 1999-10-18 2003-04-02 マサチューセッツ・インスティテュート・オブ・テクノロジー 可撓性電子回路及びその製造方法
JP3471690B2 (ja) * 1999-12-16 2003-12-02 沖電気工業株式会社 半導体素子の実装方法
JP3723565B2 (ja) * 2003-10-21 2005-12-07 広瀬 秀男 電子衣料

Also Published As

Publication number Publication date
KR20050024423A (ko) 2005-03-10
JP4704749B2 (ja) 2011-06-22
ATE341100T1 (de) 2006-10-15
WO2004003999A1 (en) 2004-01-08
DE60308682T2 (de) 2007-08-30
KR100992001B1 (ko) 2010-11-04
JP2005531925A (ja) 2005-10-20
US6646336B1 (en) 2003-11-11
EP1520296B1 (de) 2006-09-27
AU2003236971A1 (en) 2004-01-19
EP1520296A1 (de) 2005-04-06
CN1666333A (zh) 2005-09-07
CN100511654C (zh) 2009-07-08

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Legal Events

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