ATE341100T1 - Tragbarer silizium chip - Google Patents
Tragbarer silizium chipInfo
- Publication number
- ATE341100T1 ATE341100T1 AT03735886T AT03735886T ATE341100T1 AT E341100 T1 ATE341100 T1 AT E341100T1 AT 03735886 T AT03735886 T AT 03735886T AT 03735886 T AT03735886 T AT 03735886T AT E341100 T1 ATE341100 T1 AT E341100T1
- Authority
- AT
- Austria
- Prior art keywords
- silicon chip
- semiconductor die
- portable silicon
- portable
- package body
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- A—HUMAN NECESSITIES
- A41—WEARING APPAREL
- A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
- A41D1/00—Garments
- A41D1/002—Garments adapted to accommodate electronic equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Measuring Fluid Pressure (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/184,510 US6646336B1 (en) | 2002-06-28 | 2002-06-28 | Wearable silicon chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE341100T1 true ATE341100T1 (de) | 2006-10-15 |
Family
ID=29400894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT03735886T ATE341100T1 (de) | 2002-06-28 | 2003-06-06 | Tragbarer silizium chip |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6646336B1 (de) |
| EP (1) | EP1520296B1 (de) |
| JP (1) | JP4704749B2 (de) |
| KR (1) | KR100992001B1 (de) |
| CN (1) | CN100511654C (de) |
| AT (1) | ATE341100T1 (de) |
| AU (1) | AU2003236971A1 (de) |
| DE (1) | DE60308682T2 (de) |
| WO (1) | WO2004003999A1 (de) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2905518B1 (fr) * | 2006-08-29 | 2008-12-26 | Commissariat Energie Atomique | Puce microelectronique a faces laterales munies de rainures et procede de fabrication |
| JP5519217B2 (ja) * | 2009-08-31 | 2014-06-11 | 帝人デュポンフィルム株式会社 | 偏光子支持基材用フィルム |
| WO2012145865A1 (zh) * | 2011-04-29 | 2012-11-01 | Yang Chang-Ming | 布料电子化的产品及方法 |
| US11443160B2 (en) | 2019-09-18 | 2022-09-13 | Sensormatic Electronics, LLC | Systems and methods for laser tuning and attaching RFID tags to products |
| US10970613B1 (en) | 2019-09-18 | 2021-04-06 | Sensormatic Electronics, LLC | Systems and methods for providing tags adapted to be incorporated with or in items |
| US11055588B2 (en) | 2019-11-27 | 2021-07-06 | Sensormatic Electronics, LLC | Flexible water-resistant sensor tag |
| GB2593479B (en) * | 2020-03-24 | 2024-04-03 | Prevayl Innovations Ltd | Article with semiconductor package and method |
| GB2589568A (en) | 2019-11-28 | 2021-06-09 | Prevayl Ltd | Sensor device, system and wearable article |
| US11694057B2 (en) | 2020-01-03 | 2023-07-04 | Sensormatic Electronics, LLC | RFID tag and method of making same |
| US11755874B2 (en) | 2021-03-03 | 2023-09-12 | Sensormatic Electronics, LLC | Methods and systems for heat applied sensor tag |
| US11869324B2 (en) | 2021-12-23 | 2024-01-09 | Sensormatic Electronics, LLC | Securing a security tag into an article |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3414666A (en) * | 1963-10-14 | 1968-12-03 | Electromechanical Devices Inc | Weaved electronic equipment |
| JPH01191455A (ja) * | 1988-01-27 | 1989-08-01 | Hitachi Ltd | 半導体装置 |
| JPH06268101A (ja) * | 1993-03-17 | 1994-09-22 | Hitachi Ltd | 半導体装置及びその製造方法、電子装置、リ−ドフレ−ム並びに実装基板 |
| ES2188615T3 (es) * | 1993-05-28 | 2003-07-01 | Andrew R Ferber | Conjuntos, accesorios y dispositivos luminosos, sonoros y que funcionan con corriente que presenta composiciones conductoras. |
| US5592408A (en) * | 1994-01-03 | 1997-01-07 | Security People, Inc. | Identification card and access control device |
| JPH08139258A (ja) * | 1994-11-08 | 1996-05-31 | Hitachi Ltd | 半導体装置 |
| JPH09232467A (ja) * | 1996-02-26 | 1997-09-05 | Matsushita Electric Works Ltd | プリント配線板の製造方法 |
| JP2891665B2 (ja) * | 1996-03-22 | 1999-05-17 | 株式会社日立製作所 | 半導体集積回路装置およびその製造方法 |
| EP1005671A2 (de) * | 1996-11-01 | 2000-06-07 | ViA, Inc. | Biegsamer tragbarer rechner |
| KR100280398B1 (ko) | 1997-09-12 | 2001-02-01 | 김영환 | 적층형 반도체 패키지 모듈의 제조 방법 |
| US6180881B1 (en) * | 1998-05-05 | 2001-01-30 | Harlan Ruben Isaak | Chip stack and method of making same |
| IT1304379B1 (it) * | 1998-09-08 | 2001-03-15 | Renato Guerra | Giacca o tuta sportiva o da lavoro od indumento in genere dotata disegnaletica luminosa intermittente direzionale. |
| US6393745B1 (en) * | 1998-09-24 | 2002-05-28 | Emiko Miki | Display media back pack and method of visual display |
| RU2134465C1 (ru) * | 1998-12-08 | 1999-08-10 | Таран Александр Иванович | Однокристальный модуль ис |
| US6493933B1 (en) * | 1999-10-18 | 2002-12-17 | Massachusetts Institute Of Technology | Method of making flexible electronic circuitry |
| JP3471690B2 (ja) * | 1999-12-16 | 2003-12-02 | 沖電気工業株式会社 | 半導体素子の実装方法 |
| JP3723565B2 (ja) * | 2003-10-21 | 2005-12-07 | 広瀬 秀男 | 電子衣料 |
-
2002
- 2002-06-28 US US10/184,510 patent/US6646336B1/en not_active Expired - Lifetime
-
2003
- 2003-06-06 DE DE60308682T patent/DE60308682T2/de not_active Expired - Lifetime
- 2003-06-06 CN CNB038151278A patent/CN100511654C/zh not_active Expired - Lifetime
- 2003-06-06 JP JP2004517073A patent/JP4704749B2/ja not_active Expired - Lifetime
- 2003-06-06 WO PCT/IB2003/002557 patent/WO2004003999A1/en active IP Right Grant
- 2003-06-06 AT AT03735886T patent/ATE341100T1/de not_active IP Right Cessation
- 2003-06-06 EP EP03735886A patent/EP1520296B1/de not_active Expired - Lifetime
- 2003-06-06 KR KR1020047021441A patent/KR100992001B1/ko active IP Right Grant
- 2003-06-06 AU AU2003236971A patent/AU2003236971A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| AU2003236971A1 (en) | 2004-01-19 |
| WO2004003999A1 (en) | 2004-01-08 |
| JP4704749B2 (ja) | 2011-06-22 |
| DE60308682D1 (de) | 2006-11-09 |
| JP2005531925A (ja) | 2005-10-20 |
| CN1666333A (zh) | 2005-09-07 |
| CN100511654C (zh) | 2009-07-08 |
| KR20050024423A (ko) | 2005-03-10 |
| US6646336B1 (en) | 2003-11-11 |
| DE60308682T2 (de) | 2007-08-30 |
| EP1520296B1 (de) | 2006-09-27 |
| EP1520296A1 (de) | 2005-04-06 |
| KR100992001B1 (ko) | 2010-11-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |