NO20080334L - Metode for a fremstille en kapasitiv akselerasjonssensor, og kapasitiv akselerasjonssensor - Google Patents

Metode for a fremstille en kapasitiv akselerasjonssensor, og kapasitiv akselerasjonssensor

Info

Publication number
NO20080334L
NO20080334L NO20080334A NO20080334A NO20080334L NO 20080334 L NO20080334 L NO 20080334L NO 20080334 A NO20080334 A NO 20080334A NO 20080334 A NO20080334 A NO 20080334A NO 20080334 L NO20080334 L NO 20080334L
Authority
NO
Norway
Prior art keywords
acceleration sensor
capacitive acceleration
capacitive
producing
acceleration
Prior art date
Application number
NO20080334A
Other languages
English (en)
Norwegian (no)
Inventor
Heikki Kuisma
Original Assignee
Vti Technologies Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vti Technologies Oy filed Critical Vti Technologies Oy
Publication of NO20080334L publication Critical patent/NO20080334L/no

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
    • G01P2015/0831—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49007—Indicating transducer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Sensors (AREA)
NO20080334A 2005-06-17 2008-01-16 Metode for a fremstille en kapasitiv akselerasjonssensor, og kapasitiv akselerasjonssensor NO20080334L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20055323A FI119299B (fi) 2005-06-17 2005-06-17 Menetelmä kapasitiivisen kiihtyvyysanturin valmistamiseksi ja kapasitiivinen kiihtyvyysanturi
PCT/FI2006/050257 WO2006134232A1 (en) 2005-06-17 2006-06-13 Method of manufacturing a capacitive acceleration sensor, and a capacitive acceleration sensor

Publications (1)

Publication Number Publication Date
NO20080334L true NO20080334L (no) 2008-03-14

Family

ID=34778459

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20080334A NO20080334L (no) 2005-06-17 2008-01-16 Metode for a fremstille en kapasitiv akselerasjonssensor, og kapasitiv akselerasjonssensor

Country Status (10)

Country Link
US (1) US7426863B2 (fi)
EP (1) EP1891450B1 (fi)
JP (1) JP5215847B2 (fi)
KR (1) KR101286028B1 (fi)
CN (2) CN101198874A (fi)
CA (1) CA2610185A1 (fi)
FI (1) FI119299B (fi)
IL (1) IL187938A0 (fi)
NO (1) NO20080334L (fi)
WO (1) WO2006134232A1 (fi)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006058747A1 (de) * 2006-12-12 2008-06-19 Robert Bosch Gmbh Mikromechanischer z-Sensor
US7610809B2 (en) * 2007-01-18 2009-11-03 Freescale Semiconductor, Inc. Differential capacitive sensor and method of making same
US7578190B2 (en) * 2007-08-03 2009-08-25 Freescale Semiconductor, Inc. Symmetrical differential capacitive sensor and method of making same
US8079262B2 (en) * 2007-10-26 2011-12-20 Rosemount Aerospace Inc. Pendulous accelerometer with balanced gas damping
US8136400B2 (en) * 2007-11-15 2012-03-20 Physical Logic Ag Accelerometer
US20110113880A1 (en) * 2008-05-15 2011-05-19 Continental Teves Ag & Co. Ohg Micromechanical acceleration sensor
DE102008040855B4 (de) * 2008-07-30 2022-05-25 Robert Bosch Gmbh Dreiachsiger Beschleunigungssensor
US8171793B2 (en) * 2008-07-31 2012-05-08 Honeywell International Inc. Systems and methods for detecting out-of-plane linear acceleration with a closed loop linear drive accelerometer
DE102008043788A1 (de) * 2008-11-17 2010-05-20 Robert Bosch Gmbh Mikromechanisches Bauelement
WO2010061777A1 (ja) 2008-11-25 2010-06-03 パナソニック電工株式会社 加速度センサ
JP4965546B2 (ja) * 2008-11-25 2012-07-04 パナソニック株式会社 加速度センサ
DE102009000167A1 (de) * 2009-01-13 2010-07-22 Robert Bosch Gmbh Sensoranordnung
DE102009000594A1 (de) 2009-02-04 2010-08-05 Robert Bosch Gmbh Beschleunigungssensor und Verfahren zum Betreiben eines Beschleunigungssensors
JP2010210417A (ja) * 2009-03-10 2010-09-24 Panasonic Electric Works Co Ltd 加速度センサ
JP2010210429A (ja) * 2009-03-10 2010-09-24 Panasonic Electric Works Co Ltd 加速度センサ
JP2010210424A (ja) * 2009-03-10 2010-09-24 Panasonic Electric Works Co Ltd 加速度センサ
JP5426906B2 (ja) * 2009-03-10 2014-02-26 パナソニック株式会社 加速度センサ
US7736931B1 (en) 2009-07-20 2010-06-15 Rosemount Aerospace Inc. Wafer process flow for a high performance MEMS accelerometer
WO2011019879A1 (en) * 2009-08-13 2011-02-17 Endevco Corporation Proof mass for maximized, bi-directional and symmetric damping in high g-range acceleration sensors
DE102009029248B4 (de) * 2009-09-08 2022-12-15 Robert Bosch Gmbh Mikromechanisches System zum Erfassen einer Beschleunigung
US8322216B2 (en) * 2009-09-22 2012-12-04 Duli Yu Micromachined accelerometer with monolithic electrodes and method of making the same
JP2011112389A (ja) * 2009-11-24 2011-06-09 Panasonic Electric Works Co Ltd 加速度センサ
JP2011112392A (ja) * 2009-11-24 2011-06-09 Panasonic Electric Works Co Ltd 加速度センサ
JP5716149B2 (ja) * 2009-11-24 2015-05-13 パナソニックＩｐマネジメント株式会社 加速度センサ
JP2011112390A (ja) * 2009-11-24 2011-06-09 Panasonic Electric Works Co Ltd 加速度センサ
JP5789737B2 (ja) 2009-11-24 2015-10-07 パナソニックＩｐマネジメント株式会社 加速度センサ
EP2506018A4 (en) 2009-11-24 2013-06-19 Panasonic Corp ACCELERATION SENSOR
KR101283683B1 (ko) * 2009-12-14 2013-07-08 한국전자통신연구원 수직축 방향 가속도계
US8418556B2 (en) * 2010-02-10 2013-04-16 Robert Bosch Gmbh Micro electrical mechanical magnetic field sensor utilizing modified inertial elements
CN102918401B (zh) 2010-06-15 2014-04-16 株式会社村田制作所 力学传感器
IT1401001B1 (it) * 2010-06-15 2013-07-05 Milano Politecnico Accelerometro capacitivo triassiale microelettromeccanico
WO2012037540A2 (en) 2010-09-18 2012-03-22 Fairchild Semiconductor Corporation Micromachined monolithic 3-axis gyroscope with single drive
WO2012037536A2 (en) 2010-09-18 2012-03-22 Fairchild Semiconductor Corporation Packaging to reduce stress on microelectromechanical systems
CN103221795B (zh) 2010-09-20 2015-03-11 快捷半导体公司 包括参考电容器的微机电压力传感器
JP2012088120A (ja) * 2010-10-18 2012-05-10 Seiko Epson Corp 物理量センサー素子、物理量センサーおよび電子機器
CN102156201B (zh) * 2010-11-30 2013-01-30 电子科技大学 一种基于soi工艺及微组装技术的三轴电容式微加速度计
DE102011011160B4 (de) * 2011-01-05 2024-01-11 Robert Bosch Gmbh Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil
US8539836B2 (en) * 2011-01-24 2013-09-24 Freescale Semiconductor, Inc. MEMS sensor with dual proof masses
US9229026B2 (en) 2011-04-13 2016-01-05 Northrop Grumman Guaidance and Electronics Company, Inc. Accelerometer systems and methods
US8724832B2 (en) 2011-08-30 2014-05-13 Qualcomm Mems Technologies, Inc. Piezoelectric microphone fabricated on glass
US8824706B2 (en) 2011-08-30 2014-09-02 Qualcomm Mems Technologies, Inc. Piezoelectric microphone fabricated on glass
US8811636B2 (en) 2011-11-29 2014-08-19 Qualcomm Mems Technologies, Inc. Microspeaker with piezoelectric, metal and dielectric membrane
DE102011057110A1 (de) * 2011-12-28 2013-07-04 Maxim Integrated Products, Inc. MEMS-Beschleunigungssensor
EP2802884B1 (en) 2012-01-12 2016-06-08 Murata Electronics Oy Accelerator sensor structure and use thereof
US9062972B2 (en) * 2012-01-31 2015-06-23 Fairchild Semiconductor Corporation MEMS multi-axis accelerometer electrode structure
US8978475B2 (en) 2012-02-01 2015-03-17 Fairchild Semiconductor Corporation MEMS proof mass with split z-axis portions
JP2013181855A (ja) 2012-03-02 2013-09-12 Seiko Epson Corp 物理量センサーおよび電子機器
US9488693B2 (en) 2012-04-04 2016-11-08 Fairchild Semiconductor Corporation Self test of MEMS accelerometer with ASICS integrated capacitors
EP2647952B1 (en) 2012-04-05 2017-11-15 Fairchild Semiconductor Corporation Mems device automatic-gain control loop for mechanical amplitude drive
EP2648334B1 (en) 2012-04-05 2020-06-10 Fairchild Semiconductor Corporation Mems device front-end charge amplifier
EP2647955B8 (en) 2012-04-05 2018-12-19 Fairchild Semiconductor Corporation MEMS device quadrature phase shift cancellation
JP5942554B2 (ja) * 2012-04-11 2016-06-29 セイコーエプソン株式会社 物理量センサーおよび電子機器
US9625272B2 (en) 2012-04-12 2017-04-18 Fairchild Semiconductor Corporation MEMS quadrature cancellation and signal demodulation
JP6002481B2 (ja) * 2012-07-06 2016-10-05 日立オートモティブシステムズ株式会社 慣性センサ
DE102013014881B4 (de) 2012-09-12 2023-05-04 Fairchild Semiconductor Corporation Verbesserte Silizium-Durchkontaktierung mit einer Füllung aus mehreren Materialien
US9470709B2 (en) 2013-01-28 2016-10-18 Analog Devices, Inc. Teeter totter accelerometer with unbalanced mass
US9297825B2 (en) 2013-03-05 2016-03-29 Analog Devices, Inc. Tilt mode accelerometer with improved offset and noise performance
WO2014156119A1 (ja) * 2013-03-27 2014-10-02 株式会社デンソー 物理量センサ
JP5783222B2 (ja) * 2013-03-27 2015-09-24 株式会社デンソー 加速度センサ
JP5900398B2 (ja) * 2013-03-27 2016-04-06 株式会社デンソー 加速度センサ
JP5783201B2 (ja) * 2013-03-27 2015-09-24 株式会社デンソー 容量式物理量センサ
EP3128333B1 (en) * 2014-04-03 2018-06-27 Hitachi Automotive Systems, Ltd. Acceleration sensor
EP3139178B1 (en) 2014-04-28 2019-06-12 Hitachi Automotive Systems, Ltd. Acceleration detection device
JP6262629B2 (ja) * 2014-09-30 2018-01-17 株式会社日立製作所 慣性センサ
US10073113B2 (en) 2014-12-22 2018-09-11 Analog Devices, Inc. Silicon-based MEMS devices including wells embedded with high density metal
US10078098B2 (en) 2015-06-23 2018-09-18 Analog Devices, Inc. Z axis accelerometer design with offset compensation
JP6631108B2 (ja) * 2015-09-15 2020-01-15 セイコーエプソン株式会社 物理量センサー、センサーデバイス、電子機器および移動体
KR101915954B1 (ko) * 2016-06-29 2018-11-08 주식회사 신성씨앤티 멤스 기반의 3축 가속도 센서
US10732196B2 (en) * 2017-11-30 2020-08-04 Invensense, Inc. Asymmetric out-of-plane accelerometer
EP4116718A1 (en) * 2021-07-05 2023-01-11 Murata Manufacturing Co., Ltd. Seesaw accelerometer

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH642461A5 (fr) * 1981-07-02 1984-04-13 Centre Electron Horloger Accelerometre.
US4699006A (en) * 1984-03-19 1987-10-13 The Charles Stark Draper Laboratory, Inc. Vibratory digital integrating accelerometer
US4736629A (en) * 1985-12-20 1988-04-12 Silicon Designs, Inc. Micro-miniature accelerometer
US5095762A (en) * 1988-07-14 1992-03-17 University Of Hawaii Multidimensional force sensor
DE3824695A1 (de) * 1988-07-20 1990-02-01 Fraunhofer Ges Forschung Mikromechanischer beschleunigungssensor mit kapazitiver signalwandlung und verfahren zu seiner herstellung
DE4126100A1 (de) * 1991-08-07 1993-02-18 Univ Chemnitz Tech Mikromechanischer drehbeschleunigungssensor
JPH05142251A (ja) * 1991-11-22 1993-06-08 Omron Corp 角加速度センサ
FR2694403B1 (fr) * 1992-07-31 1994-10-07 Sagem Accéléromètre pendulaire électrostatique à électrode de test et procédé de fabrication d'un tel accéléromètre.
JP3234652B2 (ja) * 1992-10-14 2001-12-04 キヤノン株式会社 加速度センサおよびその製造方法
JPH07306223A (ja) * 1994-05-13 1995-11-21 Omron Corp 加速度センサ
CA2149933A1 (en) * 1994-06-29 1995-12-30 Robert M. Boysel Micro-mechanical accelerometers with improved detection circuitry
US5659195A (en) * 1995-06-08 1997-08-19 The Regents Of The University Of California CMOS integrated microsensor with a precision measurement circuit
DE19541388A1 (de) * 1995-11-07 1997-05-15 Telefunken Microelectron Mikromechanischer Beschleunigungssensor
JPH11261080A (ja) * 1998-03-13 1999-09-24 Omron Corp 半導体素子及びその実装構造
ATE221212T1 (de) * 1998-10-28 2002-08-15 Fraunhofer Ges Forschung Mikromechanisches bauelement mit schwingkörper
JP2000275272A (ja) * 1999-03-23 2000-10-06 Mitsubishi Electric Corp 半導体加速度センサ及びその製造方法
US6230566B1 (en) * 1999-10-01 2001-05-15 The Regents Of The University Of California Micromachined low frequency rocking accelerometer with capacitive pickoff
DE69925837T2 (de) * 1999-10-29 2005-10-27 Sensonor Asa Mikromechanischer Sensor
DE10225714A1 (de) * 2002-06-11 2004-01-08 Eads Deutschland Gmbh Mehrachsiger monolithischer Beschleunigungssensor
FI119528B (fi) * 2003-02-11 2008-12-15 Vti Technologies Oy Kapasitiivinen kiihtyvyysanturirakenne
US7140250B2 (en) * 2005-02-18 2006-11-28 Honeywell International Inc. MEMS teeter-totter accelerometer having reduced non-linearty

Also Published As

Publication number Publication date
KR101286028B1 (ko) 2013-07-18
FI20055323A (fi) 2007-03-05
CN103823082A (zh) 2014-05-28
WO2006134232A1 (en) 2006-12-21
FI119299B (fi) 2008-09-30
JP2008544243A (ja) 2008-12-04
IL187938A0 (en) 2008-03-20
CA2610185A1 (en) 2006-12-21
JP5215847B2 (ja) 2013-06-19
EP1891450A1 (en) 2008-02-27
CN101198874A (zh) 2008-06-11
US20070000323A1 (en) 2007-01-04
EP1891450B1 (en) 2013-08-14
EP1891450A4 (en) 2011-07-27
KR20080031283A (ko) 2008-04-08
CN103823082B (zh) 2017-11-10
US7426863B2 (en) 2008-09-23
FI20055323A0 (fi) 2005-06-17

Similar Documents

Publication Publication Date Title
NO20080334L (no) Metode for a fremstille en kapasitiv akselerasjonssensor, og kapasitiv akselerasjonssensor
NO20051918L (no) Fremgangsmate for kontroll/overvakning av seismiske kilder
TW200606409A (en) Force sensor, force detection system and force detection program
BRPI0814064A2 (pt) Instrumental cirúrgico minimamente invasivo, método de operar um instrumental minimamente invasivo, e instrumental minimamente invasivo
TW200737026A (en) Transforming metrology data from a semiconductor treatment system using multivariate analysis
WO2007084516A3 (en) Membranes for an analyte sensor
NO20062455L (no) Streamerstyringorienteringsinnretningsbestemmelsesapparatur og metode
WO2007001866A3 (en) Hand cleanliness
GB2452864A (en) Sensor system
WO2008141243A3 (en) Device and methods for calibrating analyte sensors
DE602004001227D1 (de) Nukleinsäure-biosensor
AU2012282773A8 (en) Combined force and proximity sensing
ATE456788T1 (de) Optischer sensor
WO2007128737A3 (en) Method and device to fractionate stem cells
NO20061601L (no) Bevegelseskompenserte seismiske havbunnssensorer og fremgangsmater for bruk i seismisk datainnsamling pa havbunnen
ATE514953T1 (de) Intelligente kommunizierende sportgeräte
TW200739242A (en) Displacement measurement system, lithographic apparatus and device manufacturing method
WO2008057172A3 (en) Organic compounds
MX2008009737A (es) Metodo para la determinacion de cargas/daño en una estructura mecanica.
EP2120114A3 (en) Electronic device and method providing improved bedtime mode of operation
WO2008105973A3 (en) Gas sensor test system and methods related thereto
ATE512930T1 (de) Nanomikrofon bzw. -drucksensor
ATE510443T1 (de) Zugangspunkt und sensor eines drahtlosen computernetzes
WO2007070191A3 (en) Graphical user interface
MX2008003081A (es) Metodos para medir el contenido de humedad en la piel.

Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application