MY192472A - Photosensitive resin composition and photosensitive resin laminate - Google Patents

Photosensitive resin composition and photosensitive resin laminate

Info

Publication number
MY192472A
MY192472A MYUI2019000585A MYUI2019000585A MY192472A MY 192472 A MY192472 A MY 192472A MY UI2019000585 A MYUI2019000585 A MY UI2019000585A MY UI2019000585 A MYUI2019000585 A MY UI2019000585A MY 192472 A MY192472 A MY 192472A
Authority
MY
Malaysia
Prior art keywords
photosensitive resin
resin composition
support film
laminate
resin laminate
Prior art date
Application number
MYUI2019000585A
Other languages
English (en)
Inventor
Takayuki Matsuda
Go Nishizawa
Jun Miyazaki
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of MY192472A publication Critical patent/MY192472A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laminated Bodies (AREA)
MYUI2019000585A 2016-12-07 2017-12-05 Photosensitive resin composition and photosensitive resin laminate MY192472A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016237556 2016-12-07
JP2017058855 2017-03-24
PCT/JP2017/043680 WO2018105620A1 (ja) 2016-12-07 2017-12-05 感光性樹脂組成物及び感光性樹脂積層体

Publications (1)

Publication Number Publication Date
MY192472A true MY192472A (en) 2022-08-22

Family

ID=62491417

Family Applications (1)

Application Number Title Priority Date Filing Date
MYUI2019000585A MY192472A (en) 2016-12-07 2017-12-05 Photosensitive resin composition and photosensitive resin laminate

Country Status (6)

Country Link
JP (2) JP6985291B2 (ko)
KR (2) KR102458384B1 (ko)
CN (1) CN109690404B (ko)
MY (1) MY192472A (ko)
TW (1) TWI666521B (ko)
WO (1) WO2018105620A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI780648B (zh) * 2020-04-03 2022-10-11 日商旭化成股份有限公司 感光性元件、及抗蝕圖案之形成方法
US20240012326A1 (en) 2021-01-29 2024-01-11 Asahi Kasei Kabushiki Kaisha Photosensitive element, and method for forming resist pattern

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001013681A (ja) * 1999-06-28 2001-01-19 Hitachi Chem Co Ltd 感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
CN1630680A (zh) * 2002-01-10 2005-06-22 东丽株式会社 双轴取向热塑性树脂薄膜
JP2003345000A (ja) * 2002-05-29 2003-12-03 Teijin Dupont Films Japan Ltd フォトレジスト用積層フィルム
KR101307124B1 (ko) * 2005-08-03 2013-09-10 도아고세이가부시키가이샤 감광성 수지 조성물, 솔더 레지스트용 조성물 및 감광성 건식 필름
US8092980B2 (en) * 2007-01-31 2012-01-10 Hitachi Chemical Company, Ltd. Photosensitive element
JP5223923B2 (ja) * 2008-07-31 2013-06-26 日立化成株式会社 感光性エレメント、これを用いたレジストパターンの形成方法及びプリント配線板の製造方法
JP2010249884A (ja) 2009-04-10 2010-11-04 Dupont Mrc Dryfilm Ltd 光重合性樹脂組成物およびこれを用いた感光性フィルム
JP2011048270A (ja) * 2009-08-28 2011-03-10 Hitachi Chem Co Ltd 感光性エレメント、これを用いたレジストパターンの形成方法及びプリント配線板の製造方法
CN106918991A (zh) * 2010-07-13 2017-07-04 日立化成工业株式会社 感光性元件、抗蚀图案的形成方法、印刷电路布线板的制造方法及印刷电路布线板
JP5768521B2 (ja) * 2010-07-13 2015-08-26 日立化成株式会社 感光性エレメント、それを用いたレジストパターンの形成方法及びプリント配線板の製造方法
KR101444044B1 (ko) * 2010-12-16 2014-09-23 히타치가세이가부시끼가이샤 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법
JP2014074764A (ja) * 2012-10-03 2014-04-24 Hitachi Chemical Co Ltd 感光性エレメント及びこれを用いたレジストパターンの形成方法、プリント配線板の製造方法
JP6095337B2 (ja) * 2012-11-27 2017-03-15 日本写真印刷株式会社 シール付きドライフィルムレジストロール
JP6046746B2 (ja) * 2012-12-27 2016-12-21 旭化成株式会社 感光性樹脂積層体ロール
JP6318484B2 (ja) * 2013-07-09 2018-05-09 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
TWI541596B (zh) * 2013-12-26 2016-07-11 Asahi Kasei E Materials Corp A photosensitive resin composition and a photosensitive resin laminate
KR102375653B1 (ko) * 2014-02-12 2022-03-16 쇼와덴코머티리얼즈가부시끼가이샤 감광성 엘리먼트
CN111694218B (zh) * 2014-05-21 2023-09-08 旭化成株式会社 感光性树脂组合物以及电路图案的形成方法
MY189073A (en) * 2015-07-08 2022-01-24 Hitachi Chemical Co Ltd Photosensitive element, laminated body, method for forming resist pattern, and method for producing printed circuit board

Also Published As

Publication number Publication date
KR102458384B1 (ko) 2022-10-24
KR20210082545A (ko) 2021-07-05
TW201827930A (zh) 2018-08-01
WO2018105620A1 (ja) 2018-06-14
CN109690404B (zh) 2023-04-04
KR20190035864A (ko) 2019-04-03
JP2021113984A (ja) 2021-08-05
TWI666521B (zh) 2019-07-21
JP6985291B2 (ja) 2021-12-22
JPWO2018105620A1 (ja) 2019-06-24
CN109690404A (zh) 2019-04-26

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