MY192613A - Photosensitive resin laminate - Google Patents

Photosensitive resin laminate

Info

Publication number
MY192613A
MY192613A MYPI2020002762A MYPI2020002762A MY192613A MY 192613 A MY192613 A MY 192613A MY PI2020002762 A MYPI2020002762 A MY PI2020002762A MY PI2020002762 A MYPI2020002762 A MY PI2020002762A MY 192613 A MY192613 A MY 192613A
Authority
MY
Malaysia
Prior art keywords
photosensitive resin
support film
resin laminate
epi
ppm
Prior art date
Application number
MYPI2020002762A
Inventor
Jun Miyazaki
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of MY192613A publication Critical patent/MY192613A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

Provided is a photosensitive resin laminate which prevents generation of resist projection, which provides a preferable resist pattern shape, and with which good productivity can be obtained. A photosensitive resin laminate according to one embodiment of the present invention is provided with a support film and a photosensitive resin composition layer formed on the support film, wherein the support film contains fine particles, and includes a region where the total area ratio of optical anomaly regions is not more than 300 ppm when observation is made in an area of 13.5 mm2 of the support film using an epi-illumination-type laser microscope. Figure 1
MYPI2020002762A 2017-12-20 2018-12-19 Photosensitive resin laminate MY192613A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017243871 2017-12-20
JP2018102603 2018-05-29
PCT/JP2018/046833 WO2019124452A1 (en) 2017-12-20 2018-12-19 Photosensitive resin laminate

Publications (1)

Publication Number Publication Date
MY192613A true MY192613A (en) 2022-08-29

Family

ID=66994619

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020002762A MY192613A (en) 2017-12-20 2018-12-19 Photosensitive resin laminate

Country Status (6)

Country Link
JP (1) JP7068340B2 (en)
KR (1) KR102471794B1 (en)
CN (1) CN111492309B (en)
MY (1) MY192613A (en)
TW (1) TWI700183B (en)
WO (1) WO2019124452A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI770578B (en) * 2019-08-06 2022-07-11 日商旭化成股份有限公司 Photosensitive resin composition, and photosensitive element
CN113993912A (en) * 2019-08-29 2022-01-28 积水保力马科技株式会社 Photocurable composition, cured product thereof, sealing material, protective material, waterproof structure, and method for producing cured product
WO2021220981A1 (en) * 2020-05-01 2021-11-04 富士フイルム株式会社 Photosensitive transfer material, resin pattern production method, circuit wiring production method, touch panel production method, and polyethylene terephthalate film

Family Cites Families (27)

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JP3841604B2 (en) * 1999-12-22 2006-11-01 株式会社荏原製作所 Electrophotographic photoreceptor
JP2002144504A (en) * 2000-09-04 2002-05-21 Toray Ind Inc Polyolefin film and photoresist cover film for photosensitive plate making
JP3711083B2 (en) * 2002-04-12 2005-10-26 株式会社東芝 Pattern formation method
JP4201746B2 (en) * 2003-09-30 2008-12-24 株式会社リコー Electrophotographic photosensitive member, image forming apparatus, and process cartridge for image forming apparatus
JP4422562B2 (en) * 2004-06-15 2010-02-24 富士フイルム株式会社 Pattern forming material, pattern forming apparatus and pattern forming method
JP2006023406A (en) * 2004-07-06 2006-01-26 Fuji Photo Film Co Ltd Photosensitive film for permanent pattern formation, method for producing the same and permanent pattern forming method
US8263313B2 (en) * 2004-08-11 2012-09-11 Hitachi Chemical Company, Ltd. Photosensitive resin composition and photosensitive film made with the same
JP4322757B2 (en) * 2004-09-06 2009-09-02 富士フイルム株式会社 Pattern forming material and pattern forming method
JP4086310B2 (en) * 2005-01-25 2008-05-14 日東電工株式会社 Manufacturing method of optical film
US20080194719A1 (en) * 2006-09-05 2008-08-14 Fujifilm Hunt Chemicals U.S.A., Inc. Composition for forming a laser-markable coating and a laser-markable material containing organic absorption enhancement additives
JP2008129431A (en) * 2006-11-22 2008-06-05 Fujifilm Corp Photosensitive transfer material, color filter and display device
JP5030599B2 (en) * 2007-01-16 2012-09-19 富士フイルム株式会社 PHOTOSPACER FOR LIQUID CRYSTAL DISPLAY, ITS MANUFACTURING METHOD, AND LIQUID CRYSTAL DISPLAY DEVICE
CN101600995B (en) 2007-01-31 2012-05-09 日立化成工业株式会社 Photosensitive element
JP2008239743A (en) * 2007-03-27 2008-10-09 Toray Ind Inc Polyester film for dry film resist carrier
JP5433367B2 (en) * 2008-11-19 2014-03-05 日本碍子株式会社 Lamb wave device
CN106918991A (en) * 2010-07-13 2017-07-04 日立化成工业株式会社 Photosensitive element, the forming method of corrosion-resisting pattern, the manufacture method of printed circuit board and printed circuit board
CN107367903A (en) * 2010-12-16 2017-11-21 日立化成株式会社 The manufacture method of photosensitive element, the forming method of corrosion-resisting pattern and printed wiring board
JP5763492B2 (en) * 2011-09-30 2015-08-12 富士フイルム株式会社 Capacitance type input device manufacturing method, capacitance type input device, and image display apparatus including the same
JP6318484B2 (en) * 2013-07-09 2018-05-09 日立化成株式会社 Photosensitive resin composition, photosensitive element, resist pattern forming method and printed wiring board manufacturing method
JP6486672B2 (en) * 2013-12-20 2019-03-20 旭化成株式会社 Photosensitive element and manufacturing method thereof
JP6463104B2 (en) * 2013-12-26 2019-01-30 キヤノン株式会社 Electrophotographic photosensitive member, process cartridge, and electrophotographic apparatus
JPWO2015178462A1 (en) * 2014-05-21 2017-04-20 旭化成株式会社 Photosensitive resin composition and method for forming circuit pattern
JP6333629B2 (en) * 2014-05-28 2018-05-30 シャープ株式会社 Electrophotographic photoreceptor and image forming apparatus having the same
JP6446848B2 (en) * 2014-06-16 2019-01-09 富士ゼロックス株式会社 Conductive support for electrophotographic photosensitive member, electrophotographic photosensitive member, image forming apparatus, and process cartridge
JP2016162284A (en) * 2015-03-03 2016-09-05 株式会社きもと Scattering prevention sheet
WO2017018053A1 (en) * 2015-07-29 2017-02-02 日立化成株式会社 Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board
CN106960897A (en) * 2017-04-18 2017-07-18 仇凯弘 A kind of preparation method of compound pattern substrate

Also Published As

Publication number Publication date
CN111492309A (en) 2020-08-04
TWI700183B (en) 2020-08-01
TW201932307A (en) 2019-08-16
JP7068340B2 (en) 2022-05-16
JPWO2019124452A1 (en) 2020-04-16
WO2019124452A1 (en) 2019-06-27
KR20200062363A (en) 2020-06-03
CN111492309B (en) 2023-12-12
KR102471794B1 (en) 2022-11-28

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