MY186397A - Roughened copper foil, copper-clad laminate, and printed wiring board - Google Patents
Roughened copper foil, copper-clad laminate, and printed wiring boardInfo
- Publication number
- MY186397A MY186397A MYPI2018700155A MYPI2018700155A MY186397A MY 186397 A MY186397 A MY 186397A MY PI2018700155 A MYPI2018700155 A MY PI2018700155A MY PI2018700155 A MYPI2018700155 A MY PI2018700155A MY 186397 A MY186397 A MY 186397A
- Authority
- MY
- Malaysia
- Prior art keywords
- roughened
- copper foil
- copper
- wiring board
- printed wiring
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
- C23C22/63—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/82—After-treatment
- C23C22/83—Chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrochemistry (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Chemical Treatment Of Metals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015149717 | 2015-07-29 | ||
PCT/JP2016/070876 WO2017018232A1 (ja) | 2015-07-29 | 2016-07-14 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY186397A true MY186397A (en) | 2021-07-22 |
Family
ID=57885564
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2018700155A MY186397A (en) | 2015-07-29 | 2016-07-14 | Roughened copper foil, copper-clad laminate, and printed wiring board |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6342078B2 (zh) |
KR (1) | KR102490491B1 (zh) |
CN (1) | CN107923047B (zh) |
MY (1) | MY186397A (zh) |
TW (1) | TWI609780B (zh) |
WO (1) | WO2017018232A1 (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6945523B2 (ja) * | 2016-04-14 | 2021-10-06 | 三井金属鉱業株式会社 | 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法 |
KR102136794B1 (ko) * | 2017-03-09 | 2020-07-22 | 케이씨에프테크놀로지스 주식회사 | 우수한 밀착력을 갖는 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
WO2019188087A1 (ja) * | 2018-03-30 | 2019-10-03 | 三井金属鉱業株式会社 | 銅張積層板 |
JP6606317B1 (ja) * | 2018-04-25 | 2019-11-13 | 古河電気工業株式会社 | 表面処理銅箔、銅張積層板、及びプリント配線板 |
EP3567993B1 (en) * | 2018-05-08 | 2022-02-23 | Atotech Deutschland GmbH & Co. KG | A method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, and acidic aqueous non-etching protector solution |
JP6985745B2 (ja) * | 2018-06-20 | 2021-12-22 | ナミックス株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
EP3813104B1 (en) | 2018-06-22 | 2023-08-16 | Sekisui Polymatech Co., Ltd. | Thermally conductive sheet |
WO2020031721A1 (ja) * | 2018-08-10 | 2020-02-13 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
US11987687B2 (en) | 2018-09-26 | 2024-05-21 | Sekisui Polymatech Co., Ltd. | Heat conductive sheet |
JP6805217B2 (ja) * | 2018-10-18 | 2020-12-23 | Jx金属株式会社 | 導電性材料、成型品及び電子部品 |
US10581081B1 (en) * | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
KR102600218B1 (ko) * | 2019-03-22 | 2023-11-08 | 가부시키가이샤 몰디노 | 피복 절삭 공구 |
JP7456578B2 (ja) * | 2019-05-09 | 2024-03-27 | ナミックス株式会社 | 銅表面の加工装置 |
JP7328671B2 (ja) * | 2019-05-09 | 2023-08-17 | ナミックス株式会社 | 積層体 |
KR20230038643A (ko) * | 2020-07-16 | 2023-03-21 | 미쓰이금속광업주식회사 | 동장 적층판 및 프린트 배선판 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3977790B2 (ja) * | 2003-09-01 | 2007-09-19 | 古河サーキットフォイル株式会社 | キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板 |
JP4704025B2 (ja) * | 2004-12-21 | 2011-06-15 | Jx日鉱日石金属株式会社 | 高周波回路用粗化処理圧延銅箔及びその製造方法 |
JP5406278B2 (ja) * | 2009-03-27 | 2014-02-05 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔及びその製造方法 |
JP5297546B1 (ja) * | 2012-04-23 | 2013-09-25 | 三井金属鉱業株式会社 | 電極箔及び電子デバイス |
KR102078897B1 (ko) * | 2012-11-26 | 2020-02-19 | 제이엑스금속주식회사 | 표면 처리 전해 동박, 적층판, 및 프린트 배선판 |
CN107881505A (zh) * | 2013-02-14 | 2018-04-06 | 三井金属矿业株式会社 | 表面处理铜箔及用表面处理铜箔得到的覆铜层压板 |
KR101851882B1 (ko) * | 2013-07-23 | 2018-04-24 | 제이엑스금속주식회사 | 표면 처리 동박, 캐리어가 형성된 동박, 기재, 수지 기재, 프린트 배선판, 구리 피복 적층판 및 프린트 배선판의 제조 방법 |
JP6166614B2 (ja) * | 2013-07-23 | 2017-07-19 | Jx金属株式会社 | 表面処理銅箔、キャリア付銅箔、基材、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法 |
TWI587757B (zh) * | 2013-09-20 | 2017-06-11 | Mitsui Mining & Smelting Co | Copper foil, copper foil with carrier foil, and copper clad laminate |
JP2015134953A (ja) * | 2014-01-17 | 2015-07-27 | Jx日鉱日石金属株式会社 | 表面処理銅箔、キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法 |
-
2016
- 2016-07-14 WO PCT/JP2016/070876 patent/WO2017018232A1/ja active Application Filing
- 2016-07-14 KR KR1020187000573A patent/KR102490491B1/ko active IP Right Grant
- 2016-07-14 JP JP2017529857A patent/JP6342078B2/ja active Active
- 2016-07-14 CN CN201680044203.8A patent/CN107923047B/zh active Active
- 2016-07-14 MY MYPI2018700155A patent/MY186397A/en unknown
- 2016-07-28 TW TW105123901A patent/TWI609780B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201710079A (zh) | 2017-03-16 |
KR20180036693A (ko) | 2018-04-09 |
CN107923047A (zh) | 2018-04-17 |
CN107923047B (zh) | 2020-05-01 |
TWI609780B (zh) | 2018-01-01 |
WO2017018232A1 (ja) | 2017-02-02 |
JP6342078B2 (ja) | 2018-06-13 |
JPWO2017018232A1 (ja) | 2017-09-21 |
KR102490491B1 (ko) | 2023-01-19 |
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