MY178050A - Copper foil suitable for laser processing, copper foil provided with carrier foil suitable for laser processing, copper-clad laminate, and method of manufacturing printed wiring board - Google Patents

Copper foil suitable for laser processing, copper foil provided with carrier foil suitable for laser processing, copper-clad laminate, and method of manufacturing printed wiring board

Info

Publication number
MY178050A
MY178050A MYPI2015702835A MYPI2015702835A MY178050A MY 178050 A MY178050 A MY 178050A MY PI2015702835 A MYPI2015702835 A MY PI2015702835A MY PI2015702835 A MYPI2015702835 A MY PI2015702835A MY 178050 A MY178050 A MY 178050A
Authority
MY
Malaysia
Prior art keywords
copper
laser processing
copper foil
wiring board
printed wiring
Prior art date
Application number
MYPI2015702835A
Other languages
English (en)
Inventor
Mitsuyoshi Matsuda
Kazuhiro Yoshikawa
Yasuji Hara
Takao Fujimoto
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY178050A publication Critical patent/MY178050A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
MYPI2015702835A 2013-03-05 2014-03-04 Copper foil suitable for laser processing, copper foil provided with carrier foil suitable for laser processing, copper-clad laminate, and method of manufacturing printed wiring board MY178050A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013043046 2013-03-05

Publications (1)

Publication Number Publication Date
MY178050A true MY178050A (en) 2020-09-30

Family

ID=51491279

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015702835A MY178050A (en) 2013-03-05 2014-03-04 Copper foil suitable for laser processing, copper foil provided with carrier foil suitable for laser processing, copper-clad laminate, and method of manufacturing printed wiring board

Country Status (6)

Country Link
JP (1) JP6304829B2 (fr)
KR (1) KR102356407B1 (fr)
CN (1) CN105008594A (fr)
MY (1) MY178050A (fr)
TW (1) TWI599279B (fr)
WO (1) WO2014136763A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102412000B1 (ko) * 2015-05-12 2022-06-22 삼성전기주식회사 동박적층판 및 이를 이용한 인쇄회로기판의 제조방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4582778A (en) * 1983-10-25 1986-04-15 Sullivan Donald F Multi-function photopolymer for efficiently producing high resolution images on printed wiring boards, and the like
JPH0681172A (ja) * 1992-09-01 1994-03-22 Hitachi Cable Ltd 微細パターンの形成方法
TW469228B (en) * 1998-01-14 2001-12-21 Mitsui Mining & Smelting Co Method for producing multi-layer printed wiring boards having blind vias
JP3612594B2 (ja) * 1998-05-29 2005-01-19 三井金属鉱業株式会社 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法
JP2001226796A (ja) * 1999-12-09 2001-08-21 Hitachi Metals Ltd レーザ穴あけ加工用銅箔及びそれを用いてなる樹脂付き銅箔、ならびにそれらの製造方法
JP3258308B2 (ja) * 2000-02-03 2002-02-18 株式会社日鉱マテリアルズ レーザー穴開け性に優れた銅箔及びその製造方法
JP3330925B2 (ja) * 2000-04-05 2002-10-07 株式会社日鉱マテリアルズ レーザー穴開け用銅箔
US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
JP4592936B2 (ja) * 2000-12-05 2010-12-08 Ｊｘ日鉱日石金属株式会社 電子回路用銅箔及び電子回路の形成方法
JP2003286596A (ja) 2002-03-29 2003-10-10 Nippon Denkai Kk レーザー穴明けに適した銅箔とその製造方法
JP2004006612A (ja) * 2002-04-12 2004-01-08 Mitsui Mining & Smelting Co Ltd キャリア箔付銅箔及びそのキャリア箔付銅箔の製造方法並びにそのキャリア箔付銅箔を用いた銅張積層板
JP3736806B2 (ja) * 2003-12-26 2006-01-18 三井金属鉱業株式会社 プリント配線基板、その製造方法および回路装置
JP2005260250A (ja) * 2005-03-23 2005-09-22 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びそれを用いた銅張積層板
JP5354950B2 (ja) * 2008-05-02 2013-11-27 株式会社秀峰 携帯電話機ケースの表面処理方法およびそれによる携帯電話機ケース
US20120318568A1 (en) * 2010-01-15 2012-12-20 Jx Nippon Mining & Metals Corporation Electronic circuit, method for forming same, and copper clad laminate for forming electronic circuit
JP5043154B2 (ja) 2010-06-09 2012-10-10 Ｊｘ日鉱日石金属株式会社 電子回路用銅箔及び電子回路の形成方法
US9338898B2 (en) * 2012-03-09 2016-05-10 Mitsui Mining & Smelting Co., Ltd. Method of producing a printed wiring board

Also Published As

Publication number Publication date
CN105008594A (zh) 2015-10-28
KR102356407B1 (ko) 2022-01-28
TW201448685A (zh) 2014-12-16
TWI599279B (zh) 2017-09-11
JPWO2014136763A1 (ja) 2017-02-09
KR20150128686A (ko) 2015-11-18
WO2014136763A1 (fr) 2014-09-12
JP6304829B2 (ja) 2018-04-04

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