MY159854A - Resin coated copper foil and method for manufacturing resin coated copper foil - Google Patents

Resin coated copper foil and method for manufacturing resin coated copper foil

Info

Publication number
MY159854A
MY159854A MYPI2010002988A MYPI2010002988A MY159854A MY 159854 A MY159854 A MY 159854A MY PI2010002988 A MYPI2010002988 A MY PI2010002988A MY PI2010002988 A MYPI2010002988 A MY PI2010002988A MY 159854 A MY159854 A MY 159854A
Authority
MY
Malaysia
Prior art keywords
copper foil
coated copper
resin coated
full
resin layer
Prior art date
Application number
MYPI2010002988A
Other languages
English (en)
Inventor
Tetsuro Sato
Toshifumi Matsushima
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of MY159854A publication Critical patent/MY159854A/en

Links

MYPI2010002988A 2007-12-28 2008-12-24 Resin coated copper foil and method for manufacturing resin coated copper foil MY159854A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007338720 2007-12-28
JP2008325025A JP5636159B2 (ja) 2007-12-28 2008-12-22 樹脂付銅箔および樹脂付銅箔の製造方法

Publications (1)

Publication Number Publication Date
MY159854A true MY159854A (en) 2017-02-15

Family

ID=41028653

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010002988A MY159854A (en) 2007-12-28 2008-12-24 Resin coated copper foil and method for manufacturing resin coated copper foil

Country Status (5)

Country Link
JP (1) JP5636159B2 (ja)
KR (1) KR101357230B1 (ja)
CN (1) CN101909878A (ja)
MY (1) MY159854A (ja)
TW (1) TWI461287B (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5580135B2 (ja) 2010-08-03 2014-08-27 三井金属鉱業株式会社 プリント配線板の製造方法及びプリント配線板
CN103221583B (zh) 2010-11-22 2015-05-13 三井金属矿业株式会社 表面处理铜箔
JP2013123907A (ja) 2011-12-16 2013-06-24 Panasonic Corp 金属張積層板、及びプリント配線板
JP6375952B2 (ja) * 2013-01-07 2018-08-22 株式会社ニコン 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法
MY168616A (en) 2013-07-23 2018-11-14 Jx Nippon Mining & Metals Corp Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
KR101909352B1 (ko) 2013-07-24 2018-10-17 제이엑스금속주식회사 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 프린트 배선판, 구리 피복 적층판 및 프린트 배선판의 제조 방법
JP6403503B2 (ja) * 2013-09-30 2018-10-10 新日鉄住金化学株式会社 銅張積層板、プリント配線板及びその使用方法
KR101582398B1 (ko) * 2014-01-06 2016-01-05 주식회사 두산 수지 이중층 부착 동박, 이를 포함하는 다층 인쇄 회로 기판 및 그 제조 방법
CN103786402B (zh) * 2014-01-27 2015-09-23 中原工学院 雾化撒粉装置喷撒复合溶液制备巨幅双面挠性铜箔的方法
JP6640567B2 (ja) 2015-01-16 2020-02-05 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法
KR101852671B1 (ko) 2015-01-21 2018-06-04 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법
KR101942621B1 (ko) 2015-02-06 2019-01-25 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법
JP2017193778A (ja) 2016-04-15 2017-10-26 Ｊｘ金属株式会社 銅箔、高周波回路用銅箔、キャリア付銅箔、高周波回路用キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
KR102489990B1 (ko) 2016-07-19 2023-01-17 쇼와덴코머티리얼즈가부시끼가이샤 수지 조성물, 적층판 및 다층 프린트 배선판
CN113584537B (zh) * 2021-08-03 2023-01-06 东强（连州）铜箔有限公司 一种带树脂层的极低粗糙度的极薄铜箔及其制造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05214301A (ja) * 1992-02-06 1993-08-24 Hitachi Ltd 低熱膨張性接着フィルムおよびそれを用いた配線基板
JPH0974273A (ja) * 1995-06-27 1997-03-18 Nippon Denkai Kk プリント回路用銅張積層板とその接着剤
JPH115828A (ja) * 1997-06-17 1999-01-12 Mitsui Mining & Smelting Co Ltd 銅張積層板用樹脂組成物、樹脂付き銅箔、多層銅張り積層板および多層プリント配線板
JP3184485B2 (ja) * 1997-11-06 2001-07-09 三井金属鉱業株式会社 銅張積層板用樹脂組成物、樹脂付き銅箔、多層銅張り積層板および多層プリント配線板
JP2002179772A (ja) * 2000-12-08 2002-06-26 Mitsui Mining & Smelting Co Ltd プリント配線板の層間絶縁層構成用の樹脂化合物、その樹脂化合物を用いた絶縁層形成用樹脂シート及び樹脂付銅箔、並びにそれらを用いた銅張積層板
JP2004273744A (ja) * 2003-03-07 2004-09-30 Kanegafuchi Chem Ind Co Ltd 熱可塑性樹脂材料およびプリント配線板の製造方法
JP4286060B2 (ja) * 2003-05-26 2009-06-24 三井金属鉱業株式会社 絶縁層付き銅箔の製造方法
JP2005183599A (ja) * 2003-12-18 2005-07-07 Mitsubishi Gas Chem Co Inc Ｂステージ樹脂組成物シートおよびこれを用いたフリップチップ搭載用プリント配線板の製造方法。
JP2006045388A (ja) * 2004-08-05 2006-02-16 Kaneka Corp 絶縁性接着シートおよびその利用
JP2007130773A (ja) * 2005-11-08 2007-05-31 Toray Ind Inc 金属層付き積層フィルム、これを用いた配線基板および半導体装置
JP2007204714A (ja) * 2006-02-06 2007-08-16 Toyobo Co Ltd ポリアミドイミド樹脂、フィルム、それを用いたフレキシブル金属張積層体およびフレキシブルプリント基板
JP4838606B2 (ja) * 2006-03-17 2011-12-14 三菱樹脂株式会社 樹脂付き銅箔

Also Published As

Publication number Publication date
JP5636159B2 (ja) 2014-12-03
KR101357230B1 (ko) 2014-02-03
KR20100100930A (ko) 2010-09-15
JP2009173017A (ja) 2009-08-06
TW200944370A (en) 2009-11-01
CN101909878A (zh) 2010-12-08
TWI461287B (zh) 2014-11-21

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