CN101909878A - 带树脂铜箔以及带树脂铜箔的制造方法 - Google Patents

带树脂铜箔以及带树脂铜箔的制造方法 Download PDF

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Publication number
CN101909878A
CN101909878A CN2008801233016A CN200880123301A CN101909878A CN 101909878 A CN101909878 A CN 101909878A CN 2008801233016 A CN2008801233016 A CN 2008801233016A CN 200880123301 A CN200880123301 A CN 200880123301A CN 101909878 A CN101909878 A CN 101909878A
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CN
China
Prior art keywords
copper foil
resin
tree fat
curing
semi
Prior art date
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Pending
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CN2008801233016A
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English (en)
Chinese (zh)
Inventor
佐藤哲朗
松岛敏文
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Mitsui Mining and Smelting Co Ltd
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Mitsui Mining and Smelting Co Ltd
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Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority claimed from PCT/JP2008/073412 external-priority patent/WO2009084533A1/ja
Publication of CN101909878A publication Critical patent/CN101909878A/zh
Pending legal-status Critical Current

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CN2008801233016A 2007-12-28 2008-12-24 带树脂铜箔以及带树脂铜箔的制造方法 Pending CN101909878A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2007338720 2007-12-28
JP2007-338720 2007-12-28
JP2008325025A JP5636159B2 (ja) 2007-12-28 2008-12-22 樹脂付銅箔および樹脂付銅箔の製造方法
JP2008-325025 2008-12-22
PCT/JP2008/073412 WO2009084533A1 (ja) 2007-12-28 2008-12-24 樹脂付銅箔および樹脂付銅箔の製造方法

Publications (1)

Publication Number Publication Date
CN101909878A true CN101909878A (zh) 2010-12-08

Family

ID=41028653

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008801233016A Pending CN101909878A (zh) 2007-12-28 2008-12-24 带树脂铜箔以及带树脂铜箔的制造方法

Country Status (5)

Country Link
JP (1) JP5636159B2 (ja)
KR (1) KR101357230B1 (ja)
CN (1) CN101909878A (ja)
MY (1) MY159854A (ja)
TW (1) TWI461287B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103786402A (zh) * 2014-01-27 2014-05-14 中原工学院 雾化撒粉装置喷撒复合溶液制备巨幅双面挠性铜箔的方法
CN109476923A (zh) * 2016-07-19 2019-03-15 日立化成株式会社 树脂组合物、层叠板及多层印刷线路板

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Publication number Priority date Publication date Assignee Title
JP5580135B2 (ja) 2010-08-03 2014-08-27 三井金属鉱業株式会社 プリント配線板の製造方法及びプリント配線板
CN103221583B (zh) 2010-11-22 2015-05-13 三井金属矿业株式会社 表面处理铜箔
JP2013123907A (ja) 2011-12-16 2013-06-24 Panasonic Corp 金属張積層板、及びプリント配線板
JP6375952B2 (ja) * 2013-01-07 2018-08-22 株式会社ニコン 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法
MY168616A (en) 2013-07-23 2018-11-14 Jx Nippon Mining & Metals Corp Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
KR101909352B1 (ko) 2013-07-24 2018-10-17 제이엑스금속주식회사 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 프린트 배선판, 구리 피복 적층판 및 프린트 배선판의 제조 방법
JP6403503B2 (ja) * 2013-09-30 2018-10-10 新日鉄住金化学株式会社 銅張積層板、プリント配線板及びその使用方法
KR101582398B1 (ko) * 2014-01-06 2016-01-05 주식회사 두산 수지 이중층 부착 동박, 이를 포함하는 다층 인쇄 회로 기판 및 그 제조 방법
JP6640567B2 (ja) 2015-01-16 2020-02-05 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法
KR101852671B1 (ko) 2015-01-21 2018-06-04 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법
KR101942621B1 (ko) 2015-02-06 2019-01-25 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법
JP2017193778A (ja) 2016-04-15 2017-10-26 Ｊｘ金属株式会社 銅箔、高周波回路用銅箔、キャリア付銅箔、高周波回路用キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN113584537B (zh) * 2021-08-03 2023-01-06 东强（连州）铜箔有限公司 一种带树脂层的极低粗糙度的极薄铜箔及其制造方法

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Publication number Priority date Publication date Assignee Title
JPH05214301A (ja) * 1992-02-06 1993-08-24 Hitachi Ltd 低熱膨張性接着フィルムおよびそれを用いた配線基板
JPH0974273A (ja) * 1995-06-27 1997-03-18 Nippon Denkai Kk プリント回路用銅張積層板とその接着剤
JPH115828A (ja) * 1997-06-17 1999-01-12 Mitsui Mining & Smelting Co Ltd 銅張積層板用樹脂組成物、樹脂付き銅箔、多層銅張り積層板および多層プリント配線板
JP3184485B2 (ja) * 1997-11-06 2001-07-09 三井金属鉱業株式会社 銅張積層板用樹脂組成物、樹脂付き銅箔、多層銅張り積層板および多層プリント配線板
JP2002179772A (ja) * 2000-12-08 2002-06-26 Mitsui Mining & Smelting Co Ltd プリント配線板の層間絶縁層構成用の樹脂化合物、その樹脂化合物を用いた絶縁層形成用樹脂シート及び樹脂付銅箔、並びにそれらを用いた銅張積層板
JP2004273744A (ja) * 2003-03-07 2004-09-30 Kanegafuchi Chem Ind Co Ltd 熱可塑性樹脂材料およびプリント配線板の製造方法
JP4286060B2 (ja) * 2003-05-26 2009-06-24 三井金属鉱業株式会社 絶縁層付き銅箔の製造方法
JP2005183599A (ja) * 2003-12-18 2005-07-07 Mitsubishi Gas Chem Co Inc Ｂステージ樹脂組成物シートおよびこれを用いたフリップチップ搭載用プリント配線板の製造方法。
JP2006045388A (ja) * 2004-08-05 2006-02-16 Kaneka Corp 絶縁性接着シートおよびその利用
JP2007130773A (ja) * 2005-11-08 2007-05-31 Toray Ind Inc 金属層付き積層フィルム、これを用いた配線基板および半導体装置
JP2007204714A (ja) * 2006-02-06 2007-08-16 Toyobo Co Ltd ポリアミドイミド樹脂、フィルム、それを用いたフレキシブル金属張積層体およびフレキシブルプリント基板
JP4838606B2 (ja) * 2006-03-17 2011-12-14 三菱樹脂株式会社 樹脂付き銅箔

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103786402A (zh) * 2014-01-27 2014-05-14 中原工学院 雾化撒粉装置喷撒复合溶液制备巨幅双面挠性铜箔的方法
CN109476923A (zh) * 2016-07-19 2019-03-15 日立化成株式会社 树脂组合物、层叠板及多层印刷线路板
CN109476923B (zh) * 2016-07-19 2022-04-05 昭和电工材料株式会社 树脂组合物、层叠板及多层印刷线路板
US11377546B2 (en) 2016-07-19 2022-07-05 Showa Denko Materials Co., Ltd. Resin composition, laminate sheet, and multilayer printed wiring board

Also Published As

Publication number Publication date
JP5636159B2 (ja) 2014-12-03
KR101357230B1 (ko) 2014-02-03
KR20100100930A (ko) 2010-09-15
JP2009173017A (ja) 2009-08-06
TW200944370A (en) 2009-11-01
TWI461287B (zh) 2014-11-21
MY159854A (en) 2017-02-15

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Application publication date: 20101208