MY155097A - Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate - Google Patents

Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate

Info

Publication number
MY155097A
MY155097A MYPI2010001142A MYPI20101142A MY155097A MY 155097 A MY155097 A MY 155097A MY PI2010001142 A MYPI2010001142 A MY PI2010001142A MY PI20101142 A MYPI20101142 A MY PI20101142A MY 155097 A MY155097 A MY 155097A
Authority
MY
Malaysia
Prior art keywords
semiconductor chips
coordinates
substrate
picking
wafer table
Prior art date
Application number
MYPI2010001142A
Other languages
English (en)
Inventor
Behler Stefan
Blessing Patrick
Original Assignee
Esec Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Ag filed Critical Esec Ag
Publication of MY155097A publication Critical patent/MY155097A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
MYPI2010001142A 2007-10-09 2008-10-03 Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate MY155097A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH15622007 2007-10-09
CH01136/08A CH698334B1 (de) 2007-10-09 2008-07-17 Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat.

Publications (1)

Publication Number Publication Date
MY155097A true MY155097A (en) 2015-09-15

Family

ID=40908817

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010001142A MY155097A (en) 2007-10-09 2008-10-03 Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate

Country Status (7)

Country Link
JP (1) JP5258068B2 (enExample)
KR (1) KR101503556B1 (enExample)
CN (1) CN101861637B (enExample)
CH (1) CH698334B1 (enExample)
DE (1) DE112008002467B4 (enExample)
MY (1) MY155097A (enExample)
TW (1) TWI464820B (enExample)

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CN103367208B (zh) * 2013-07-02 2015-10-28 华中科技大学 一种用于高密度芯片的倒装键合平台
SG11201610297UA (en) * 2014-06-11 2017-01-27 Universal Instruments Corp Test device for establishing, verifying, and/or managing accuracy
CN104362120B (zh) * 2014-10-30 2017-04-19 深圳市大能智造科技有限公司 晶片拾取设备的视觉定位系统的相机位置调节方法
US10223589B2 (en) 2015-03-03 2019-03-05 Cognex Corporation Vision system for training an assembly system through virtual assembly of objects
JP6510838B2 (ja) * 2015-03-11 2019-05-08 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP6438826B2 (ja) * 2015-04-02 2018-12-19 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP6470088B2 (ja) * 2015-04-02 2019-02-13 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
DE102015106224B4 (de) * 2015-04-22 2022-09-01 Asm Assembly Systems Gmbh & Co. Kg Verfahren zum wiederholten Vermessen eines in einem Bestückbereich eines Bestückautomaten befindlichen Bauelementeträgers sowie Bestückautomat und Computerprogramm zur Durchführung dieses Verfahrens
US10290118B2 (en) * 2015-08-06 2019-05-14 Cognex Corporation System and method for tying together machine vision coordinate spaces in a guided assembly environment
JP6584234B2 (ja) * 2015-08-31 2019-10-02 ファスフォードテクノロジ株式会社 ダイボンダ、ボンディング方法および半導体装置の製造方法
CH711536B1 (de) * 2015-08-31 2019-02-15 Besi Switzerland Ag Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats.
KR102196105B1 (ko) * 2016-02-01 2020-12-30 시바우라 메카트로닉스 가부시끼가이샤 전자 부품의 실장 장치와 실장 방법, 및 패키지 부품의 제조 방법
CN106409746A (zh) * 2016-10-21 2017-02-15 合肥矽迈微电子科技有限公司 芯片正装贴片设备
CN108575053B (zh) * 2017-03-08 2020-03-27 台达电子电源(东莞)有限公司 电子元器件插装定位装置及自动插件机
CN106829469A (zh) * 2017-03-30 2017-06-13 武汉库柏特科技有限公司 一种基于双相机的机器人无序抓取装置及方法
JP6649316B2 (ja) * 2017-03-31 2020-02-19 平田機工株式会社 移載方法および移載システム
CN110612258B (zh) * 2017-05-11 2021-06-15 村田机械株式会社 输送系统以及输送方法
TWI651795B (zh) * 2017-06-20 2019-02-21 梭特科技股份有限公司 影像輔助的置晶方法及置晶設備
JP7018341B2 (ja) * 2018-03-26 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN110767577A (zh) * 2019-10-24 2020-02-07 苏师大半导体材料与设备研究院(邳州)有限公司 一种半导体材料附接方法
CN112308919B (zh) * 2020-10-28 2024-04-09 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 芯片在夹具中的装夹位置的校正方法和装置
CN116528580A (zh) * 2023-05-09 2023-08-01 深圳康桥信息科技有限责任公司 自适应高精度芯片贴片装置及其贴片方法

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ATE361549T1 (de) 1997-12-07 2007-05-15 Oerlikon Assembly Equipment Ag Halbleiter-montageeinrichtung mit einem hin und her geführten chipgreifer
JP2001015992A (ja) * 1999-06-29 2001-01-19 Sony Corp 部品装着装置における校正方法
JP4046030B2 (ja) * 2002-08-30 2008-02-13 株式会社村田製作所 部品装着方法および部品装着装置
DE10300518B4 (de) * 2003-01-09 2005-06-23 Siemens Ag Vorrichtung zum Bestücken von Substraten mit Bauelementen und Verfahren zum Kalibrieren einer solchen Vorrichtung
EP1480507B1 (de) 2003-05-21 2006-07-19 Unaxis International Trading Ltd. Halbleiter-Montageeinrichtung
CH696103A5 (de) 2003-06-06 2006-12-15 Esec Trading Sa Halbleiter-Montageeinrichtung.
JP4343710B2 (ja) * 2004-01-09 2009-10-14 ヤマハ発動機株式会社 表面実装機
JP4029855B2 (ja) * 2004-03-26 2008-01-09 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
JP4111160B2 (ja) * 2004-03-26 2008-07-02 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
EP1612843A1 (de) 2004-07-02 2006-01-04 Unaxis International Trading Ltd Verfahren und Einrichtung fuer die Montage von Halbleiterchips
DE102004036990A1 (de) * 2004-07-30 2006-03-23 Siemens Ag Kalibrierverfahren zur Bestimmung der Bestückgenauigkeit eines Bestückautomaten, Verfahren zum Bestücken von Bauelementeträgern mit Bauelementen
EP1841570A1 (en) * 2005-01-26 2007-10-10 Abb Ab Device and method for calibrating the center point of tool mounted on a robot by means of a camera
JP2007173801A (ja) 2005-12-22 2007-07-05 Unaxis Internatl Trading Ltd フリップチップを基板に取り付ける方法
EP2126645B1 (de) * 2006-12-22 2012-07-04 Kulicke & Soffa Die Bonding GmbH Verfahren zum kalibrieren der x-y positionierung eines positionierwerkzeugs, sowie vorrichtung mit einem derartigen positionierwerkzeug

Also Published As

Publication number Publication date
JP2010541293A (ja) 2010-12-24
JP5258068B2 (ja) 2013-08-07
CN101861637B (zh) 2012-07-18
DE112008002467T5 (de) 2010-08-26
DE112008002467B4 (de) 2013-08-22
TWI464820B (zh) 2014-12-11
CH698334A1 (de) 2009-07-15
KR20100085027A (ko) 2010-07-28
CH698334B1 (de) 2011-07-29
HK1144235A1 (en) 2011-02-02
CN101861637A (zh) 2010-10-13
KR101503556B1 (ko) 2015-03-17
TW200929425A (en) 2009-07-01

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