KR101503556B1 - 웨이퍼 테이블로부터 반도체 칩을 픽업하는 방법 및 반도체 칩을 기판에 장착하는 방법 - Google Patents

웨이퍼 테이블로부터 반도체 칩을 픽업하는 방법 및 반도체 칩을 기판에 장착하는 방법 Download PDF

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KR101503556B1
KR101503556B1 KR1020107007665A KR20107007665A KR101503556B1 KR 101503556 B1 KR101503556 B1 KR 101503556B1 KR 1020107007665 A KR1020107007665 A KR 1020107007665A KR 20107007665 A KR20107007665 A KR 20107007665A KR 101503556 B1 KR101503556 B1 KR 101503556B1
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camera
coordinate system
semiconductor chip
marking
image
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KR20100085027A (ko
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슈테판 벨러
파트리크 블레싱
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에섹 에스에이
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Priority claimed from PCT/EP2008/063268 external-priority patent/WO2009047214A2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020107007665A 2007-10-09 2008-10-03 웨이퍼 테이블로부터 반도체 칩을 픽업하는 방법 및 반도체 칩을 기판에 장착하는 방법 Active KR101503556B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CH15622007 2007-10-09
CH1562/07 2007-10-09
CH1136/08 2008-07-17
CH11362008A CH698334B1 (de) 2007-10-09 2008-07-17 Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat.
PCT/EP2008/063268 WO2009047214A2 (en) 2007-10-09 2008-10-03 Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate

Publications (2)

Publication Number Publication Date
KR20100085027A KR20100085027A (ko) 2010-07-28
KR101503556B1 true KR101503556B1 (ko) 2015-03-17

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KR1020107007665A Active KR101503556B1 (ko) 2007-10-09 2008-10-03 웨이퍼 테이블로부터 반도체 칩을 픽업하는 방법 및 반도체 칩을 기판에 장착하는 방법

Country Status (7)

Country Link
JP (1) JP5258068B2 (enExample)
KR (1) KR101503556B1 (enExample)
CN (1) CN101861637B (enExample)
CH (1) CH698334B1 (enExample)
DE (1) DE112008002467B4 (enExample)
MY (1) MY155097A (enExample)
TW (1) TWI464820B (enExample)

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CN103367208B (zh) * 2013-07-02 2015-10-28 华中科技大学 一种用于高密度芯片的倒装键合平台
CN106660715B (zh) * 2014-06-11 2020-07-24 环球仪器公司 用于建立、验证并/或管理准确性的测试装置
CN104362120B (zh) * 2014-10-30 2017-04-19 深圳市大能智造科技有限公司 晶片拾取设备的视觉定位系统的相机位置调节方法
US10223589B2 (en) * 2015-03-03 2019-03-05 Cognex Corporation Vision system for training an assembly system through virtual assembly of objects
JP6510838B2 (ja) * 2015-03-11 2019-05-08 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP6470088B2 (ja) * 2015-04-02 2019-02-13 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
JP6438826B2 (ja) * 2015-04-02 2018-12-19 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
DE102015106224B4 (de) * 2015-04-22 2022-09-01 Asm Assembly Systems Gmbh & Co. Kg Verfahren zum wiederholten Vermessen eines in einem Bestückbereich eines Bestückautomaten befindlichen Bauelementeträgers sowie Bestückautomat und Computerprogramm zur Durchführung dieses Verfahrens
US10290118B2 (en) * 2015-08-06 2019-05-14 Cognex Corporation System and method for tying together machine vision coordinate spaces in a guided assembly environment
CH711536B1 (de) * 2015-08-31 2019-02-15 Besi Switzerland Ag Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats.
JP6584234B2 (ja) * 2015-08-31 2019-10-02 ファスフォードテクノロジ株式会社 ダイボンダ、ボンディング方法および半導体装置の製造方法
KR102080214B1 (ko) * 2016-02-01 2020-02-24 시바우라 메카트로닉스 가부시끼가이샤 전자 부품의 실장 장치와 실장 방법, 및 패키지 부품의 제조 방법
CN106409746A (zh) * 2016-10-21 2017-02-15 合肥矽迈微电子科技有限公司 芯片正装贴片设备
CN108575053B (zh) * 2017-03-08 2020-03-27 台达电子电源(东莞)有限公司 电子元器件插装定位装置及自动插件机
CN106829469A (zh) * 2017-03-30 2017-06-13 武汉库柏特科技有限公司 一种基于双相机的机器人无序抓取装置及方法
JP6649316B2 (ja) * 2017-03-31 2020-02-19 平田機工株式会社 移載方法および移載システム
WO2018207462A1 (ja) * 2017-05-11 2018-11-15 村田機械株式会社 搬送システム及び搬送方法
TWI651795B (zh) * 2017-06-20 2019-02-21 梭特科技股份有限公司 影像輔助的置晶方法及置晶設備
JP7018341B2 (ja) * 2018-03-26 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN110767577A (zh) * 2019-10-24 2020-02-07 苏师大半导体材料与设备研究院(邳州)有限公司 一种半导体材料附接方法
CN112308919B (zh) * 2020-10-28 2024-04-09 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 芯片在夹具中的装夹位置的校正方法和装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1395106A2 (en) * 2002-08-30 2004-03-03 Murata Manufacturing Co., Ltd. Parts mounting method and parts mounting apparatus
EP1581040A2 (en) * 2004-03-26 2005-09-28 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
US20070145102A1 (en) 2005-12-22 2007-06-28 Unaxis International Trading Ltd. Method for mounting a flip chip on a substrate
WO2008083701A1 (de) 2006-12-22 2008-07-17 Kulicke & Soffa Die Bonding Gmbh Verfahren zum kalibrieren der x-y positionierung eines positionierwerkzeugs, sowie vorrichtung mit einem derartigen positionierwerkzeug

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DE59813989D1 (de) 1997-12-07 2007-06-14 Oerlikon Assembly Equipment Ag Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer
JP2001015992A (ja) * 1999-06-29 2001-01-19 Sony Corp 部品装着装置における校正方法
DE10300518B4 (de) * 2003-01-09 2005-06-23 Siemens Ag Vorrichtung zum Bestücken von Substraten mit Bauelementen und Verfahren zum Kalibrieren einer solchen Vorrichtung
ATE333780T1 (de) 2003-05-21 2006-08-15 Unaxis Int Trading Ltd Halbleiter-montageeinrichtung
CH696103A5 (de) 2003-06-06 2006-12-15 Esec Trading Sa Halbleiter-Montageeinrichtung.
JP4343710B2 (ja) * 2004-01-09 2009-10-14 ヤマハ発動機株式会社 表面実装機
JP4029855B2 (ja) * 2004-03-26 2008-01-09 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
EP1612843A1 (de) 2004-07-02 2006-01-04 Unaxis International Trading Ltd Verfahren und Einrichtung fuer die Montage von Halbleiterchips
DE102004036990A1 (de) * 2004-07-30 2006-03-23 Siemens Ag Kalibrierverfahren zur Bestimmung der Bestückgenauigkeit eines Bestückautomaten, Verfahren zum Bestücken von Bauelementeträgern mit Bauelementen
EP1841570A1 (en) * 2005-01-26 2007-10-10 Abb Ab Device and method for calibrating the center point of tool mounted on a robot by means of a camera

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1395106A2 (en) * 2002-08-30 2004-03-03 Murata Manufacturing Co., Ltd. Parts mounting method and parts mounting apparatus
EP1581040A2 (en) * 2004-03-26 2005-09-28 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
US20070145102A1 (en) 2005-12-22 2007-06-28 Unaxis International Trading Ltd. Method for mounting a flip chip on a substrate
WO2008083701A1 (de) 2006-12-22 2008-07-17 Kulicke & Soffa Die Bonding Gmbh Verfahren zum kalibrieren der x-y positionierung eines positionierwerkzeugs, sowie vorrichtung mit einem derartigen positionierwerkzeug

Also Published As

Publication number Publication date
KR20100085027A (ko) 2010-07-28
DE112008002467T5 (de) 2010-08-26
TWI464820B (zh) 2014-12-11
JP5258068B2 (ja) 2013-08-07
CN101861637B (zh) 2012-07-18
MY155097A (en) 2015-09-15
CH698334A1 (de) 2009-07-15
HK1144235A1 (en) 2011-02-02
TW200929425A (en) 2009-07-01
CN101861637A (zh) 2010-10-13
CH698334B1 (de) 2011-07-29
DE112008002467B4 (de) 2013-08-22
JP2010541293A (ja) 2010-12-24

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