TWI464820B - 用以將半導體晶片安裝於基板上之方法 - Google Patents
用以將半導體晶片安裝於基板上之方法 Download PDFInfo
- Publication number
- TWI464820B TWI464820B TW097138530A TW97138530A TWI464820B TW I464820 B TWI464820 B TW I464820B TW 097138530 A TW097138530 A TW 097138530A TW 97138530 A TW97138530 A TW 97138530A TW I464820 B TWI464820 B TW I464820B
- Authority
- TW
- Taiwan
- Prior art keywords
- camera
- coordinate system
- image
- semiconductor wafer
- mark
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 72
- 239000000758 substrate Substances 0.000 title claims description 51
- 238000000034 method Methods 0.000 title claims description 13
- 235000012431 wafers Nutrition 0.000 claims description 120
- 239000013598 vector Substances 0.000 claims description 51
- 238000012937 correction Methods 0.000 claims description 41
- 238000013507 mapping Methods 0.000 claims description 29
- 239000003550 marker Substances 0.000 claims description 20
- 241000309551 Arthraxon hispidus Species 0.000 claims description 17
- 238000009434 installation Methods 0.000 claims 1
- 230000007246 mechanism Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH15622007 | 2007-10-09 | ||
| CH11362008A CH698334B1 (de) | 2007-10-09 | 2008-07-17 | Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200929425A TW200929425A (en) | 2009-07-01 |
| TWI464820B true TWI464820B (zh) | 2014-12-11 |
Family
ID=40908817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097138530A TWI464820B (zh) | 2007-10-09 | 2008-10-07 | 用以將半導體晶片安裝於基板上之方法 |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP5258068B2 (enExample) |
| KR (1) | KR101503556B1 (enExample) |
| CN (1) | CN101861637B (enExample) |
| CH (1) | CH698334B1 (enExample) |
| DE (1) | DE112008002467B4 (enExample) |
| MY (1) | MY155097A (enExample) |
| TW (1) | TWI464820B (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103367208B (zh) * | 2013-07-02 | 2015-10-28 | 华中科技大学 | 一种用于高密度芯片的倒装键合平台 |
| CN106660715B (zh) * | 2014-06-11 | 2020-07-24 | 环球仪器公司 | 用于建立、验证并/或管理准确性的测试装置 |
| CN104362120B (zh) * | 2014-10-30 | 2017-04-19 | 深圳市大能智造科技有限公司 | 晶片拾取设备的视觉定位系统的相机位置调节方法 |
| US10223589B2 (en) * | 2015-03-03 | 2019-03-05 | Cognex Corporation | Vision system for training an assembly system through virtual assembly of objects |
| JP6510838B2 (ja) * | 2015-03-11 | 2019-05-08 | ファスフォードテクノロジ株式会社 | ボンディング装置及びボンディング方法 |
| JP6470088B2 (ja) * | 2015-04-02 | 2019-02-13 | ファスフォードテクノロジ株式会社 | ボンディング装置及びボンディング方法 |
| JP6438826B2 (ja) * | 2015-04-02 | 2018-12-19 | ファスフォードテクノロジ株式会社 | ボンディング装置及びボンディング方法 |
| DE102015106224B4 (de) * | 2015-04-22 | 2022-09-01 | Asm Assembly Systems Gmbh & Co. Kg | Verfahren zum wiederholten Vermessen eines in einem Bestückbereich eines Bestückautomaten befindlichen Bauelementeträgers sowie Bestückautomat und Computerprogramm zur Durchführung dieses Verfahrens |
| US10290118B2 (en) * | 2015-08-06 | 2019-05-14 | Cognex Corporation | System and method for tying together machine vision coordinate spaces in a guided assembly environment |
| CH711536B1 (de) * | 2015-08-31 | 2019-02-15 | Besi Switzerland Ag | Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats. |
| JP6584234B2 (ja) * | 2015-08-31 | 2019-10-02 | ファスフォードテクノロジ株式会社 | ダイボンダ、ボンディング方法および半導体装置の製造方法 |
| KR102080214B1 (ko) * | 2016-02-01 | 2020-02-24 | 시바우라 메카트로닉스 가부시끼가이샤 | 전자 부품의 실장 장치와 실장 방법, 및 패키지 부품의 제조 방법 |
| CN106409746A (zh) * | 2016-10-21 | 2017-02-15 | 合肥矽迈微电子科技有限公司 | 芯片正装贴片设备 |
| CN108575053B (zh) * | 2017-03-08 | 2020-03-27 | 台达电子电源(东莞)有限公司 | 电子元器件插装定位装置及自动插件机 |
| CN106829469A (zh) * | 2017-03-30 | 2017-06-13 | 武汉库柏特科技有限公司 | 一种基于双相机的机器人无序抓取装置及方法 |
| JP6649316B2 (ja) * | 2017-03-31 | 2020-02-19 | 平田機工株式会社 | 移載方法および移載システム |
| WO2018207462A1 (ja) * | 2017-05-11 | 2018-11-15 | 村田機械株式会社 | 搬送システム及び搬送方法 |
| TWI651795B (zh) * | 2017-06-20 | 2019-02-21 | 梭特科技股份有限公司 | 影像輔助的置晶方法及置晶設備 |
| JP7018341B2 (ja) * | 2018-03-26 | 2022-02-10 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
| CN110767577A (zh) * | 2019-10-24 | 2020-02-07 | 苏师大半导体材料与设备研究院(邳州)有限公司 | 一种半导体材料附接方法 |
| CN112308919B (zh) * | 2020-10-28 | 2024-04-09 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | 芯片在夹具中的装夹位置的校正方法和装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1065917A2 (en) * | 1999-06-29 | 2001-01-03 | Sony Corporation | Calibrating method for part mounting apparatus |
| US20050210667A1 (en) * | 2004-03-26 | 2005-09-29 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting apparatus and electronic component mounting method |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE59813989D1 (de) | 1997-12-07 | 2007-06-14 | Oerlikon Assembly Equipment Ag | Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer |
| JP4046030B2 (ja) * | 2002-08-30 | 2008-02-13 | 株式会社村田製作所 | 部品装着方法および部品装着装置 |
| DE10300518B4 (de) * | 2003-01-09 | 2005-06-23 | Siemens Ag | Vorrichtung zum Bestücken von Substraten mit Bauelementen und Verfahren zum Kalibrieren einer solchen Vorrichtung |
| ATE333780T1 (de) | 2003-05-21 | 2006-08-15 | Unaxis Int Trading Ltd | Halbleiter-montageeinrichtung |
| CH696103A5 (de) | 2003-06-06 | 2006-12-15 | Esec Trading Sa | Halbleiter-Montageeinrichtung. |
| JP4343710B2 (ja) * | 2004-01-09 | 2009-10-14 | ヤマハ発動機株式会社 | 表面実装機 |
| JP4029855B2 (ja) * | 2004-03-26 | 2008-01-09 | 松下電器産業株式会社 | 電子部品搭載装置および電子部品搭載方法 |
| EP1612843A1 (de) | 2004-07-02 | 2006-01-04 | Unaxis International Trading Ltd | Verfahren und Einrichtung fuer die Montage von Halbleiterchips |
| DE102004036990A1 (de) * | 2004-07-30 | 2006-03-23 | Siemens Ag | Kalibrierverfahren zur Bestimmung der Bestückgenauigkeit eines Bestückautomaten, Verfahren zum Bestücken von Bauelementeträgern mit Bauelementen |
| EP1841570A1 (en) * | 2005-01-26 | 2007-10-10 | Abb Ab | Device and method for calibrating the center point of tool mounted on a robot by means of a camera |
| JP2007173801A (ja) * | 2005-12-22 | 2007-07-05 | Unaxis Internatl Trading Ltd | フリップチップを基板に取り付ける方法 |
| CH698357B1 (de) * | 2006-12-22 | 2013-09-13 | Kulicke & Soffa Die Bonding Gmbh | Verfahren zum Kalibrieren der x-y Positionierung eines Positionierwerkzeugs, sowie Vorrichtung mit einem derartigen Positionierwerkzeug. |
-
2008
- 2008-07-17 CH CH11362008A patent/CH698334B1/de not_active IP Right Cessation
- 2008-10-03 JP JP2010528368A patent/JP5258068B2/ja active Active
- 2008-10-03 DE DE112008002467T patent/DE112008002467B4/de active Active
- 2008-10-03 MY MYPI2010001142A patent/MY155097A/en unknown
- 2008-10-03 CN CN2008801103578A patent/CN101861637B/zh active Active
- 2008-10-03 KR KR1020107007665A patent/KR101503556B1/ko active Active
- 2008-10-07 TW TW097138530A patent/TWI464820B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1065917A2 (en) * | 1999-06-29 | 2001-01-03 | Sony Corporation | Calibrating method for part mounting apparatus |
| US20050210667A1 (en) * | 2004-03-26 | 2005-09-29 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting apparatus and electronic component mounting method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20100085027A (ko) | 2010-07-28 |
| DE112008002467T5 (de) | 2010-08-26 |
| JP5258068B2 (ja) | 2013-08-07 |
| CN101861637B (zh) | 2012-07-18 |
| MY155097A (en) | 2015-09-15 |
| CH698334A1 (de) | 2009-07-15 |
| HK1144235A1 (en) | 2011-02-02 |
| TW200929425A (en) | 2009-07-01 |
| CN101861637A (zh) | 2010-10-13 |
| KR101503556B1 (ko) | 2015-03-17 |
| CH698334B1 (de) | 2011-07-29 |
| DE112008002467B4 (de) | 2013-08-22 |
| JP2010541293A (ja) | 2010-12-24 |
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