WO2003085703A3 - Elektronisches bauteil mit mindestens einem halbleiterchip und flip-chip-kontakten sowie verfahren zu seiner herstellung - Google Patents

Elektronisches bauteil mit mindestens einem halbleiterchip und flip-chip-kontakten sowie verfahren zu seiner herstellung Download PDF

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Publication number
WO2003085703A3
WO2003085703A3 PCT/DE2003/001150 DE0301150W WO03085703A3 WO 2003085703 A3 WO2003085703 A3 WO 2003085703A3 DE 0301150 W DE0301150 W DE 0301150W WO 03085703 A3 WO03085703 A3 WO 03085703A3
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WO
WIPO (PCT)
Prior art keywords
electronic component
chip
flip
production
contacts
Prior art date
Application number
PCT/DE2003/001150
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English (en)
French (fr)
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WO2003085703A2 (de
Inventor
Georg Meyer-Berg
Barbara Vasquez
Original Assignee
Infineon Technologies Ag
Georg Meyer-Berg
Barbara Vasquez
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag, Georg Meyer-Berg, Barbara Vasquez filed Critical Infineon Technologies Ag
Priority to EP03745749A priority Critical patent/EP1493188A2/de
Publication of WO2003085703A2 publication Critical patent/WO2003085703A2/de
Publication of WO2003085703A3 publication Critical patent/WO2003085703A3/de
Priority to US10/960,994 priority patent/US7176131B2/en
Priority to US11/619,086 priority patent/US20070102826A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)

Abstract

Die Erfindung betrifft ein elektronisches Bauteil (1) mit einem Halbleiterchip (2) und mikroskopisch kleinen Flip-Chip-Kontakten einer Umverdrahtungsplatte (4), auf welcher makroskopisch große elastische Außenkontakte (5) angeordnet sind. Dabei weist die Umverdrahtungsplatte (4) einen Verdrahtungsträger (6) aus polykristallinem Silizium, amorphem Glas oder Metall auf. Darüber hinaus betrifft die vorliegenden Erfindung ein Verfahren zur Herstellung eines geeigneten Verdrahtungsträgers (6) und des elektronischen Bauteils (1).
PCT/DE2003/001150 2002-04-09 2003-04-08 Elektronisches bauteil mit mindestens einem halbleiterchip und flip-chip-kontakten sowie verfahren zu seiner herstellung WO2003085703A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP03745749A EP1493188A2 (de) 2002-04-09 2003-04-08 Elektronisches bauteil mit mindestens einem halbleiterchip und flip-chip-kontakten sowie verfahren zu seiner herstellung
US10/960,994 US7176131B2 (en) 2002-04-09 2004-10-12 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same
US11/619,086 US20070102826A1 (en) 2002-04-09 2007-01-02 Electronic Component Having at Least One Semiconductor Chip and Flip-Chip Contacts, and Method for Producing the Same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10215654.9 2002-04-09
DE10215654A DE10215654A1 (de) 2002-04-09 2002-04-09 Elektronisches Bauteil mit mindestens einem Halbleiterchip und Flip-Chip-Kontakten sowie Verfahren zu seiner Herstellung

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/960,994 Continuation US7176131B2 (en) 2002-04-09 2004-10-12 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same

Publications (2)

Publication Number Publication Date
WO2003085703A2 WO2003085703A2 (de) 2003-10-16
WO2003085703A3 true WO2003085703A3 (de) 2004-04-22

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PCT/DE2003/001150 WO2003085703A2 (de) 2002-04-09 2003-04-08 Elektronisches bauteil mit mindestens einem halbleiterchip und flip-chip-kontakten sowie verfahren zu seiner herstellung

Country Status (4)

Country Link
US (2) US7176131B2 (de)
EP (1) EP1493188A2 (de)
DE (1) DE10215654A1 (de)
WO (1) WO2003085703A2 (de)

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DE10261410B4 (de) * 2002-12-30 2008-09-04 Qimonda Ag Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung
US20070003204A1 (en) * 2005-06-30 2007-01-04 Elli Makrides-Saravanos Methods and apparatus for splitter modules and splitter module housings
TW200721426A (en) * 2005-07-25 2007-06-01 Koninkl Philips Electronics Nv Air cavity package for flip-chip
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US20070102826A1 (en) 2007-05-10
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US7176131B2 (en) 2007-02-13
EP1493188A2 (de) 2005-01-05

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