WO2002001634A3 - Systemträger für halbleiterchips und elektronische bauteile sowie herstellungsverfahren für einen systemträger und für elektronische bauteile - Google Patents
Systemträger für halbleiterchips und elektronische bauteile sowie herstellungsverfahren für einen systemträger und für elektronische bauteile Download PDFInfo
- Publication number
- WO2002001634A3 WO2002001634A3 PCT/DE2001/002097 DE0102097W WO0201634A3 WO 2002001634 A3 WO2002001634 A3 WO 2002001634A3 DE 0102097 W DE0102097 W DE 0102097W WO 0201634 A3 WO0201634 A3 WO 0201634A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- system support
- electronic components
- semiconductor chips
- rivet
- producing
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/1147—Manufacturing methods using a lift-off mask
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020027017780A KR100614722B1 (ko) | 2000-06-27 | 2001-06-07 | 반도체 칩용 리드프레임과 전자 디바이스 및 리드프레임과 전자 디바이스 제조방법 |
JP2002505680A JP2004502303A (ja) | 2000-06-27 | 2001-06-07 | 半導体チップおよび電子部品用のシステム支持体ならびにシステム支持体および電子部品の製作方法 |
EP01949240A EP1295336A2 (de) | 2000-06-27 | 2001-06-07 | Systemträger für halbleiterchips und elektronische bauteile sowie herstellungsverfahren für einen systemträger und für elektronische bauteile |
US10/330,440 US6969905B2 (en) | 2000-06-27 | 2002-12-27 | Leadframe for semiconductor chips and electronic devices and production methods for a leadframe and for electronic devices |
US11/274,249 US20060060981A1 (en) | 2000-06-27 | 2005-11-15 | Production methods for a leadframe and electronic devices |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10031204.7 | 2000-06-27 | ||
DE10031204A DE10031204A1 (de) | 2000-06-27 | 2000-06-27 | Systemträger für Halbleiterchips und elektronische Bauteile sowie Herstellungsverfahren für einen Systemträger und für elektronische Bauteile |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/330,440 Continuation US6969905B2 (en) | 2000-06-27 | 2002-12-27 | Leadframe for semiconductor chips and electronic devices and production methods for a leadframe and for electronic devices |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002001634A2 WO2002001634A2 (de) | 2002-01-03 |
WO2002001634A3 true WO2002001634A3 (de) | 2002-06-20 |
Family
ID=7646924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2001/002097 WO2002001634A2 (de) | 2000-06-27 | 2001-06-07 | Systemträger für halbleiterchips und elektronische bauteile sowie herstellungsverfahren für einen systemträger und für elektronische bauteile |
Country Status (6)
Country | Link |
---|---|
US (2) | US6969905B2 (de) |
EP (1) | EP1295336A2 (de) |
JP (1) | JP2004502303A (de) |
KR (1) | KR100614722B1 (de) |
DE (1) | DE10031204A1 (de) |
WO (1) | WO2002001634A2 (de) |
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DE10235332A1 (de) * | 2002-08-01 | 2004-02-19 | Infineon Technologies Ag | Mehrlagiger Schaltungsträger und Herstellung desselben |
DE10240461A1 (de) * | 2002-08-29 | 2004-03-11 | Infineon Technologies Ag | Universelles Gehäuse für ein elektronisches Bauteil mit Halbleiterchip und Verfahren zu seiner Herstellung |
DE10246101B4 (de) | 2002-10-02 | 2005-12-01 | Infineon Technologies Ag | Verfahren zum Herstellen eines Gehäuses für einen Chip mit einer mikromechanischen Struktur |
DE10252556B3 (de) * | 2002-11-08 | 2004-05-19 | Infineon Technologies Ag | Elektronisches Bauteil mit Außenkontaktelementen und Verfahren zur Herstellung einer Mehrzahl dieses Bauteils |
JP4245370B2 (ja) * | 2003-02-21 | 2009-03-25 | 大日本印刷株式会社 | 半導体装置の製造方法 |
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DE10333841B4 (de) * | 2003-07-24 | 2007-05-10 | Infineon Technologies Ag | Verfahren zur Herstellung eines Nutzens mit in Zeilen und Spalten angeordneten Halbleiterbauteilpositionen und Verfahren zur Herstellung eines Halbleiterbauteils |
CN100543884C (zh) * | 2003-08-22 | 2009-09-23 | 泰科电子荷兰公司 | 生产电导体元件的方法及电导体元件 |
DE10352349B4 (de) * | 2003-11-06 | 2006-11-16 | Infineon Technologies Ag | Halbleiterchip mit Flip-Chip-Kontakten und Verfahren zur Herstellung desselben |
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DE102006023998B4 (de) | 2006-05-22 | 2009-02-19 | Infineon Technologies Ag | Elektronische Schaltungsanordnung und Verfahren zur Herstellung einer solchen |
DE102006030581B3 (de) | 2006-07-03 | 2008-02-21 | Infineon Technologies Ag | Verfahren zum Herstellen eines Bauelements |
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JP3400877B2 (ja) * | 1994-12-14 | 2003-04-28 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
JP3422144B2 (ja) * | 1995-09-22 | 2003-06-30 | ソニー株式会社 | 半導体パッケージの製造方法 |
US6072239A (en) * | 1995-11-08 | 2000-06-06 | Fujitsu Limited | Device having resin package with projections |
US6001671A (en) * | 1996-04-18 | 1999-12-14 | Tessera, Inc. | Methods for manufacturing a semiconductor package having a sacrificial layer |
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2000
- 2000-06-27 DE DE10031204A patent/DE10031204A1/de not_active Withdrawn
-
2001
- 2001-06-07 KR KR1020027017780A patent/KR100614722B1/ko not_active IP Right Cessation
- 2001-06-07 EP EP01949240A patent/EP1295336A2/de not_active Withdrawn
- 2001-06-07 JP JP2002505680A patent/JP2004502303A/ja active Pending
- 2001-06-07 WO PCT/DE2001/002097 patent/WO2002001634A2/de active Application Filing
-
2002
- 2002-12-27 US US10/330,440 patent/US6969905B2/en not_active Expired - Fee Related
-
2005
- 2005-11-15 US US11/274,249 patent/US20060060981A1/en not_active Abandoned
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Also Published As
Publication number | Publication date |
---|---|
US20030102538A1 (en) | 2003-06-05 |
KR20030011932A (ko) | 2003-02-11 |
KR100614722B1 (ko) | 2006-08-21 |
US6969905B2 (en) | 2005-11-29 |
US20060060981A1 (en) | 2006-03-23 |
WO2002001634A2 (de) | 2002-01-03 |
DE10031204A1 (de) | 2002-01-17 |
JP2004502303A (ja) | 2004-01-22 |
EP1295336A2 (de) | 2003-03-26 |
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