MX378787B - Aleación de soldadura libre de plomo. - Google Patents
Aleación de soldadura libre de plomo.Info
- Publication number
- MX378787B MX378787B MX2016014012A MX2016014012A MX378787B MX 378787 B MX378787 B MX 378787B MX 2016014012 A MX2016014012 A MX 2016014012A MX 2016014012 A MX2016014012 A MX 2016014012A MX 378787 B MX378787 B MX 378787B
- Authority
- MX
- Mexico
- Prior art keywords
- lead
- solder
- mass
- free
- alloy
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 7
- 229910045601 alloy Inorganic materials 0.000 title abstract 5
- 239000000956 alloy Substances 0.000 title abstract 5
- 239000000203 mixture Substances 0.000 abstract 3
- 238000005476 soldering Methods 0.000 abstract 3
- 229910020882 Sn-Cu-Ni Inorganic materials 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Abstract
El propósito de la presente invención es proveer una aleación de soldadura libre de plomo y soldadura en la cual es posible mantener alta resistencia de unión que no disminuye incluso en un estado de alta temperatura después de la soldadura, la aleación de soldadura libre de plomo y soldadura que tiene alto grado de confiabilidad y versatilidad. En la presente invención, la composición base es Sn-Cu-Ni, la composición de aleación libre de plomo contiene 0.1 a 2.0% en masa de Cu, 0.01 a 0.5% en masa de Ni, 0.1 a 5% en masa de Bi y 76.0 a 99.5% en masa de Sn. Como resultado de tal composición de aleación libre de plomo, la fuerza de unión de la soldadura no disminuye durante la soldadura, incluso cuando la soldadura es expuesta a altas temperaturas durante un largo período de tiempo, como será evidente, permitiendo mediante esto una soldadura altamente confiable.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014094277 | 2014-04-30 | ||
| JP2015004403 | 2015-01-13 | ||
| PCT/JP2015/062818 WO2015166945A1 (ja) | 2014-04-30 | 2015-04-28 | 鉛フリーはんだ合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MX2016014012A MX2016014012A (es) | 2017-01-11 |
| MX378787B true MX378787B (es) | 2025-03-10 |
Family
ID=54358672
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2016014012A MX378787B (es) | 2014-04-30 | 2015-04-28 | Aleación de soldadura libre de plomo. |
| MX2021000260A MX2021000260A (es) | 2014-04-30 | 2016-10-25 | Aleacion de soldadura libre de plomo. |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2021000260A MX2021000260A (es) | 2014-04-30 | 2016-10-25 | Aleacion de soldadura libre de plomo. |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US10286497B2 (es) |
| EP (2) | EP3708292A1 (es) |
| JP (3) | JP5872114B1 (es) |
| KR (1) | KR20160147996A (es) |
| CN (3) | CN114161023A (es) |
| AU (1) | AU2015254179B2 (es) |
| BR (2) | BR122021001612B1 (es) |
| CA (1) | CA2946994C (es) |
| HK (1) | HK1259425A1 (es) |
| MX (2) | MX378787B (es) |
| MY (1) | MY188657A (es) |
| PH (1) | PH12016502152B1 (es) |
| RU (3) | RU2695791C2 (es) |
| SG (1) | SG11201608933SA (es) |
| WO (1) | WO2015166945A1 (es) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2695791C2 (ru) * | 2014-04-30 | 2019-07-26 | Нихон Супериор Ко., Лтд. | Бессвинцовый припой |
| JP6788337B2 (ja) * | 2015-10-16 | 2020-11-25 | Ａｇｃ株式会社 | 接合用組成物 |
| JP6504401B2 (ja) * | 2015-11-05 | 2019-04-24 | パナソニックＩｐマネジメント株式会社 | はんだ合金およびそれを用いた実装構造体 |
| CN105665956A (zh) * | 2016-03-23 | 2016-06-15 | 徐宏达 | 一种用于钎焊铝及其合金的软钎料合金 |
| JP6755546B2 (ja) * | 2016-08-09 | 2020-09-16 | 株式会社日本スペリア社 | 接合方法 |
| DK3381601T3 (da) * | 2016-09-13 | 2021-02-22 | Senju Metal Industry Co | Loddelegering, loddekugle og loddeforbindelse |
| CN106825983B (zh) * | 2017-03-10 | 2020-05-05 | 南京达迈科技实业有限公司 | 一种SnAgSbNi系无铅焊锡合金及其制备方法和应用 |
| US20200140975A1 (en) * | 2017-03-23 | 2020-05-07 | Nihon Superior Co., Ltd. | Soldered Joint |
| PT3603877T (pt) | 2017-03-31 | 2021-09-09 | Senju Metal Industry Co | Liga de soldadura, pasta de soldadura, e junta de soldadura |
| KR102563840B1 (ko) * | 2017-06-22 | 2023-08-07 | 에이지씨 가부시키가이샤 | 창재, 광학 패키지 |
| CN107671451A (zh) * | 2017-08-21 | 2018-02-09 | 番禺得意精密电子工业有限公司 | 电连接器及其焊料 |
| US11123823B2 (en) | 2017-11-08 | 2021-09-21 | Alpha Assembly Solutions Inc. | Cost-effective lead-free solder alloy for electronic applications |
| JP7420363B2 (ja) * | 2018-03-06 | 2024-01-23 | 株式会社日本スペリア社 | はんだ継手 |
| JP7287606B2 (ja) * | 2018-08-10 | 2023-06-06 | 株式会社日本スペリア社 | 鉛フリーはんだ合金 |
| CN108994480A (zh) * | 2018-10-10 | 2018-12-14 | 云南锡业锡材有限公司 | 一种SnBiAgCu高可靠性无铅焊料合金 |
| TW202403062A (zh) * | 2018-12-27 | 2024-01-16 | 美商阿爾發金屬化工公司 | 無鉛焊料組成物 |
| CN109702374B (zh) * | 2019-02-13 | 2021-02-09 | 南昌大学 | 一种Sn-Cu-Ni-In无铅钎料合金及其制备方法 |
| BR112021020323B1 (pt) * | 2019-04-11 | 2022-08-30 | Nihon Superior Co., Ltd | Liga de solda branca isenta de chumbo, e, parte de junta de solda branca |
| CN110315238B (zh) * | 2019-07-31 | 2021-09-17 | 广东省科学院中乌焊接研究所 | 一种碳纳米管增强无铅钎料、其制备方法及其应用 |
| WO2021025081A1 (ja) * | 2019-08-05 | 2021-02-11 | 株式会社日本スペリア社 | はんだ－金属メッシュ複合材及びその製造方法 |
| JP6912742B1 (ja) | 2020-02-14 | 2021-08-04 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
| CN116472140A (zh) * | 2020-11-19 | 2023-07-21 | 千住金属工业株式会社 | 焊料合金、焊球及焊料接头 |
| US20220212293A1 (en) * | 2020-12-23 | 2022-07-07 | Mk Electron Co., Ltd. | Lead-free solder alloy, solder paste comprising the same, and semiconductor device comprising the same |
| JP7161133B1 (ja) * | 2021-09-30 | 2022-10-26 | 千住金属工業株式会社 | はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手 |
| JP2023060639A (ja) * | 2021-10-18 | 2023-04-28 | Tdk株式会社 | はんだ組成物および電子部品 |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4879096A (en) | 1989-04-19 | 1989-11-07 | Oatey Company | Lead- and antimony-free solder composition |
| KR19980068127A (ko) * | 1997-02-15 | 1998-10-15 | 김광호 | 납땜용 무연 합금 |
| WO1999048639A1 (en) | 1998-03-26 | 1999-09-30 | Nihon Superior Sha Co., Ltd. | Leadless solder |
| JP3363393B2 (ja) | 1998-12-21 | 2003-01-08 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
| JP3262113B2 (ja) | 1999-01-29 | 2002-03-04 | 富士電機株式会社 | はんだ合金 |
| US6365097B1 (en) * | 1999-01-29 | 2002-04-02 | Fuji Electric Co., Ltd. | Solder alloy |
| JP3775172B2 (ja) | 2000-05-22 | 2006-05-17 | 株式会社村田製作所 | はんだ組成物およびはんだ付け物品 |
| WO2002040213A1 (en) | 2000-11-16 | 2002-05-23 | Singapore Asahi Chemical And Solder Industries Pte. Ltd. | Lead-free solders |
| US8216395B2 (en) * | 2001-06-28 | 2012-07-10 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
| TW592872B (en) | 2001-06-28 | 2004-06-21 | Senju Metal Industry Co | Lead-free solder alloy |
| RU2219030C1 (ru) * | 2002-05-27 | 2003-12-20 | Открытое акционерное общество "ГАЗ" | Припой для низкотемпературной пайки |
| US7172726B2 (en) * | 2002-10-15 | 2007-02-06 | Senju Metal Industry Co., Ltd. | Lead-free solder |
| JP4401671B2 (ja) | 2003-03-31 | 2010-01-20 | 千住金属工業株式会社 | 高温鉛フリーはんだ合金および電子部品 |
| GB2406101C (en) | 2004-10-27 | 2007-09-11 | Quantum Chem Tech Singapore | Improvements in ro relating to solders |
| GB2421030B (en) * | 2004-12-01 | 2008-03-19 | Alpha Fry Ltd | Solder alloy |
| JP2006255762A (ja) | 2005-03-18 | 2006-09-28 | Uchihashi Estec Co Ltd | 電子部品用線状はんだ |
| TWI465312B (zh) | 2005-07-19 | 2014-12-21 | Nihon Superior Co Ltd | 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法 |
| US8641964B2 (en) * | 2005-08-24 | 2014-02-04 | Fry's Metals, Inc. | Solder alloy |
| GB2431412B (en) * | 2005-10-24 | 2009-10-07 | Alpha Fry Ltd | Lead-free solder alloy |
| CN1788918A (zh) * | 2005-12-20 | 2006-06-21 | 徐振五 | 无铅环保焊料 |
| US20070172381A1 (en) | 2006-01-23 | 2007-07-26 | Deram Brian T | Lead-free solder with low copper dissolution |
| CN100439028C (zh) | 2007-01-24 | 2008-12-03 | 太仓市南仓金属材料有限公司 | 一种无铅软钎锡焊料 |
| WO2009013114A1 (de) | 2007-07-20 | 2009-01-29 | Inventio Ag | Verfahren zur ermittlung der geschwindigkeit einer aufzugskabine und eine steuereinheit zur durchführung dieses verfahrens |
| CN101214591B (zh) | 2008-01-18 | 2010-11-24 | 重庆工学院 | 一种电子微连接使用的低银亚共晶Sn-Cu-Ag无铅钎料 |
| US8557021B2 (en) * | 2008-02-22 | 2013-10-15 | Nihon Superior Sha Co., Ltd. | Method of regulating nickel concentration in lead-free solder containing nickel |
| EP2277657B1 (en) * | 2008-04-23 | 2012-07-11 | Senju Metal Industry Co., Ltd | Lead-free solder |
| US9227258B2 (en) * | 2008-04-23 | 2016-01-05 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy having reduced shrinkage cavities |
| CN101585119A (zh) * | 2009-02-26 | 2009-11-25 | 郴州金箭焊料有限公司 | 抗氧化低银无铅焊料合金 |
| JP2011251310A (ja) * | 2010-06-02 | 2011-12-15 | Nippon Genma:Kk | 鉛フリーはんだ合金 |
| JP4787384B1 (ja) | 2010-10-29 | 2011-10-05 | ハリマ化成株式会社 | 低銀はんだ合金およびはんだペースト組成物 |
| US9339893B2 (en) * | 2011-04-15 | 2016-05-17 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
| JP2013000744A (ja) * | 2011-06-10 | 2013-01-07 | Nihon Superior Co Ltd | 鉛フリーはんだ合金及び当該はんだを用いたはんだ接合部 |
| JP2013252548A (ja) * | 2012-06-08 | 2013-12-19 | Nihon Almit Co Ltd | 微細部品接合用のソルダペースト |
| WO2014002304A1 (ja) | 2012-06-29 | 2014-01-03 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
| JP5238088B1 (ja) | 2012-06-29 | 2013-07-17 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
| US8875253B2 (en) * | 2012-07-03 | 2014-10-28 | Facebook, Inc. | Trust metrics on shared computers |
| KR20160011242A (ko) | 2012-10-09 | 2016-01-29 | 알파 메탈즈, 인코포레이티드 | 고온에서 신뢰성이 있는 무납 및 무안티몬 주석 납땜 |
| TWI460046B (zh) * | 2012-11-12 | 2014-11-11 | Accurus Scient Co Ltd | High strength silver-free lead-free solder |
| CN103008904B (zh) * | 2012-11-28 | 2015-04-08 | 一远电子科技有限公司 | 一种SnCuNiGaGeIn系无银无铅焊料合金 |
| TWI576195B (zh) | 2013-05-03 | 2017-04-01 | Accurus Scientific Co Ltd | High temperature resistant high strength lead free solder |
| RU2695791C2 (ru) * | 2014-04-30 | 2019-07-26 | Нихон Супериор Ко., Лтд. | Бессвинцовый припой |
-
2015
- 2015-04-28 RU RU2018118007A patent/RU2695791C2/ru active
- 2015-04-28 MX MX2016014012A patent/MX378787B/es unknown
- 2015-04-28 MY MYPI2016001916A patent/MY188657A/en unknown
- 2015-04-28 CN CN202111526384.7A patent/CN114161023A/zh active Pending
- 2015-04-28 CN CN201810326161.8A patent/CN108515289A/zh active Pending
- 2015-04-28 RU RU2016146520A patent/RU2662176C2/ru active
- 2015-04-28 US US14/901,638 patent/US10286497B2/en active Active
- 2015-04-28 KR KR1020167033604A patent/KR20160147996A/ko not_active Ceased
- 2015-04-28 AU AU2015254179A patent/AU2015254179B2/en active Active
- 2015-04-28 CN CN201580001155.XA patent/CN105339131A/zh active Pending
- 2015-04-28 EP EP20170413.7A patent/EP3708292A1/en active Pending
- 2015-04-28 RU RU2018118008A patent/RU2018118008A/ru not_active Application Discontinuation
- 2015-04-28 WO PCT/JP2015/062818 patent/WO2015166945A1/ja not_active Ceased
- 2015-04-28 BR BR122021001612-7A patent/BR122021001612B1/pt active IP Right Grant
- 2015-04-28 CA CA2946994A patent/CA2946994C/en active Active
- 2015-04-28 JP JP2015524557A patent/JP5872114B1/ja active Active
- 2015-04-28 EP EP15785689.9A patent/EP3138658B1/en active Active
- 2015-04-28 SG SG11201608933SA patent/SG11201608933SA/en unknown
- 2015-04-28 BR BR112016024855-4A patent/BR112016024855B1/pt active IP Right Grant
- 2015-12-03 JP JP2015236930A patent/JP6339993B2/ja active Active
-
2016
- 2016-04-08 JP JP2016078295A patent/JP2016129908A/ja active Pending
- 2016-10-25 MX MX2021000260A patent/MX2021000260A/es unknown
- 2016-10-27 PH PH12016502152A patent/PH12016502152B1/en unknown
-
2019
- 2019-01-31 HK HK19101829.4A patent/HK1259425A1/zh unknown
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MX378787B (es) | Aleación de soldadura libre de plomo. | |
| MY186064A (en) | High reliability lead-free solder alloys for harsh environment electronics applications | |
| EP2979807A4 (en) | Solder alloy, solder composition, solder paste and electronic circuit board | |
| PT3597356T (pt) | Liga para soldadura | |
| SG11201700778TA (en) | Solder alloy, solder ball, chip solder, solder paste and solder joint | |
| EP3603877A4 (en) | Solder alloy, solder paste, and solder joint | |
| TWI561639B (en) | Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal | |
| EP3828294A4 (en) | LEAD FREE BRAZING ALLOY AND SOLDER SEAL PART | |
| SG11202004067UA (en) | Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications | |
| PL3603879T3 (pl) | Kompozycja topnika i kompozycja pasty lutowniczej | |
| MX2016015710A (es) | Aleacion de soldadura. | |
| PL3473373T3 (pl) | Kompozycja lutownicza | |
| SG11202004069QA (en) | High reliability lead-free solder alloy for electronic applications in extreme environments | |
| SG11202004068XA (en) | Cost-effective lead-free solder alloy for electronic applications | |
| SG11201606845TA (en) | Brazing and soldering alloy wires | |
| PH12017500404A1 (en) | Lead-free solder alloy for use in terminal preplating, and electronic component | |
| GB2540060A (en) | Hybrid interconnect for low temperature attach | |
| JP2014090211A5 (es) | ||
| TW201611938A (en) | Solder ball and electronic member | |
| HUP1500353A2 (en) | Preparation of lead free sn-cu-ni solder alloy and determination of composition | |
| TH1501003598B (th) | โลหะผสมบัดกรี, องค์ประกอบบัดกรี, ตะกั่วเหลวบัดกรี และแผงวงจรอิเล็กทรอนิกส์ | |
| RU2014130543A (ru) | Сплав припойный на основе палладия 850 пробы | |
| SG10201402705VA (en) | Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal | |
| SG10201401618YA (en) | Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal | |
| TH1601000633A (th) | โลหะผสมสำหรับการบัดกรีชนิดไร้ตะกั่ว |