DK3381601T3 - Loddelegering, loddekugle og loddeforbindelse - Google Patents

Loddelegering, loddekugle og loddeforbindelse Download PDF

Info

Publication number
DK3381601T3
DK3381601T3 DK17850875.0T DK17850875T DK3381601T3 DK 3381601 T3 DK3381601 T3 DK 3381601T3 DK 17850875 T DK17850875 T DK 17850875T DK 3381601 T3 DK3381601 T3 DK 3381601T3
Authority
DK
Denmark
Prior art keywords
soldering
ball
alloy
connection
soldering connection
Prior art date
Application number
DK17850875.0T
Other languages
English (en)
Inventor
Ken Tachibana
Hikaru NOMURA
Yuki Iijima
Shunsaku Yoshikawa
Naoko Izumita
Takashi Saito
Takahiro Yokoyama
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2016178880A external-priority patent/JP6119912B1/ja
Priority claimed from JP2016178879A external-priority patent/JP6119911B1/ja
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Application granted granted Critical
Publication of DK3381601T3 publication Critical patent/DK3381601T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DK17850875.0T 2016-09-13 2017-09-12 Loddelegering, loddekugle og loddeforbindelse DK3381601T3 (da)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016178880A JP6119912B1 (ja) 2016-09-13 2016-09-13 はんだ合金、はんだボールおよびはんだ継手
JP2016178879A JP6119911B1 (ja) 2016-09-13 2016-09-13 はんだ合金、はんだボールおよびはんだ継手
PCT/JP2017/032834 WO2018051973A1 (ja) 2016-09-13 2017-09-12 はんだ合金、はんだボールおよびはんだ継手

Publications (1)

Publication Number Publication Date
DK3381601T3 true DK3381601T3 (da) 2021-02-22

Family

ID=61619527

Family Applications (1)

Application Number Title Priority Date Filing Date
DK17850875.0T DK3381601T3 (da) 2016-09-13 2017-09-12 Loddelegering, loddekugle og loddeforbindelse

Country Status (10)

Country Link
US (1) US10500680B2 (da)
EP (1) EP3381601B1 (da)
KR (1) KR101951162B1 (da)
CN (1) CN108290249B (da)
DK (1) DK3381601T3 (da)
ES (1) ES2844002T3 (da)
HU (1) HUE053519T2 (da)
PT (1) PT3381601T (da)
TW (1) TWI645047B (da)
WO (1) WO2018051973A1 (da)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6624322B1 (ja) 2019-03-27 2019-12-25 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手
JP6680992B1 (ja) * 2019-05-27 2020-04-15 千住金属工業株式会社 はんだ合金、はんだ粉末、ソルダペースト、はんだボール、ソルダプリフォーム、およびはんだ継手
JP6721851B1 (ja) * 2019-06-28 2020-07-15 千住金属工業株式会社 はんだ合金、鋳造物、形成物およびはんだ継手
JP6700568B1 (ja) * 2019-08-09 2020-05-27 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手
JP6928284B1 (ja) * 2020-02-14 2021-09-01 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
JP7041710B2 (ja) * 2020-04-30 2022-03-24 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手
CN114045412B (zh) * 2021-10-08 2022-08-16 安徽贵乾新材料有限公司 一种环保锡条制造方法及其成型模具

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3363393B2 (ja) * 1998-12-21 2003-01-08 千住金属工業株式会社 鉛フリーはんだ合金
US6621643B2 (en) * 2001-04-25 2003-09-16 Nikon Corporation Zoom lens system
TW592872B (en) * 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy
US8216395B2 (en) 2001-06-28 2012-07-10 Senju Metal Industry Co., Ltd. Lead-free solder alloy
JP2006289434A (ja) * 2005-04-11 2006-10-26 Nihon Superior Co Ltd はんだ合金
CN101224524A (zh) * 2007-01-18 2008-07-23 浙江亚通焊材有限公司 无铅钎料
KR101184234B1 (ko) 2008-04-23 2012-09-19 센주긴조쿠고교 가부시키가이샤 납프리 땜납
JP4787384B1 (ja) * 2010-10-29 2011-10-05 ハリマ化成株式会社 低銀はんだ合金およびはんだペースト組成物
JP2013252548A (ja) * 2012-06-08 2013-12-19 Nihon Almit Co Ltd 微細部品接合用のソルダペースト
JP5893528B2 (ja) * 2012-07-27 2016-03-23 新日鉄住金マテリアルズ株式会社 無鉛はんだバンプ接合構造
TWI460046B (zh) 2012-11-12 2014-11-11 Accurus Scient Co Ltd High strength silver-free lead-free solder
JP6283317B2 (ja) 2012-11-30 2018-02-21 株式会社日本スペリア社 低融点ろう材
TWI576195B (zh) 2013-05-03 2017-04-01 Accurus Scientific Co Ltd High temperature resistant high strength lead free solder
CN104395035B (zh) * 2013-05-29 2017-10-20 新日铁住金高新材料株式会社 钎料球以及电子构件
AU2015254179B2 (en) * 2014-04-30 2017-07-20 Nihon Superior Co., Ltd. Lead-free solder alloy
KR102190436B1 (ko) * 2014-07-29 2020-12-11 삼성전자주식회사 데이터를 송수신하는 전자 장치 및 방법
CN105665956A (zh) * 2016-03-23 2016-06-15 徐宏达 一种用于钎焊铝及其合金的软钎料合金

Also Published As

Publication number Publication date
EP3381601A1 (en) 2018-10-03
ES2844002T3 (es) 2021-07-21
CN108290249B (zh) 2020-01-10
KR20180063344A (ko) 2018-06-11
HUE053519T2 (hu) 2021-07-28
TWI645047B (zh) 2018-12-21
WO2018051973A1 (ja) 2018-03-22
PT3381601T (pt) 2021-01-05
TW201816137A (zh) 2018-05-01
EP3381601B1 (en) 2020-12-02
US10500680B2 (en) 2019-12-10
US20180361519A1 (en) 2018-12-20
CN108290249A (zh) 2018-07-17
EP3381601A4 (en) 2019-09-25
KR101951162B1 (ko) 2019-02-21

Similar Documents

Publication Publication Date Title
DK3337549T3 (da) Kateteranordninger med ventiler og tilhørende fremgangsmåder.
DK3381601T3 (da) Loddelegering, loddekugle og loddeforbindelse
DK3368534T3 (da) Valbenazin-ditosylat og polymorfer deraf
DK3452463T3 (da) Amidsubstituerede pyridinyltriazolderivater og anvendelser deraf
DK3580561T3 (da) Hla-baserede metoder, sammensætninger og anvendelse heraf
MA47802A (fr) Alliage de brasage
DK3603877T3 (da) Loddelegering, loddepasta og loddeforbindelse
SG11201700778TA (en) Solder alloy, solder ball, chip solder, solder paste and solder joint
DK3356558T3 (da) Sirs patogenbiomarkører og anvendelser deraf
DK3395801T3 (da) Arylazolforbindelse og skadedyrsbekæmpelsesmiddel
DK3256598T3 (da) Svampestammer og anvendelsesfremgangsmåder
DK3265641T3 (da) Stigørenhed og fremgangsmåde
DK3612579T3 (da) Pultrudat, fremstilling og anvendelse heraf
DK3426243T3 (da) 3-phosphoglyceratdehydrogenase-inhibitorer og anvendelser deraf
DK3162258T3 (da) Kogekar og fremstillingsfremgangsmåde
DK3386956T3 (da) Fumagillolderivater og polymorfer deraf
PL3254800T3 (pl) Środek aktywujący topnik, topnik i lutowie
DK3490988T3 (da) Ny forbindelse og fremgangsmåde
DK3365321T3 (da) Solabegron-zwitterion og anvendelser deraf
DK3337506T3 (da) Kombinationer og anvendelser deraf
DK3321279T3 (da) Exenatidmodificeringsmiddel og anvendelse deraf
DK3116238T3 (da) Afstandsstykke og høreanordning, som omfatter det
DK3555320T3 (da) Fremgangsmåder og stamme
GB2608711B (en) Brazing components and techniques
DK3304240T3 (da) Effektomformer og tilhørende strømnet