JP6283317B2 - 低融点ろう材 - Google Patents
低融点ろう材 Download PDFInfo
- Publication number
- JP6283317B2 JP6283317B2 JP2014549852A JP2014549852A JP6283317B2 JP 6283317 B2 JP6283317 B2 JP 6283317B2 JP 2014549852 A JP2014549852 A JP 2014549852A JP 2014549852 A JP2014549852 A JP 2014549852A JP 6283317 B2 JP6283317 B2 JP 6283317B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing material
- joint
- temperature
- melting point
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/06—Tubes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
Description
表3、及び表4の結論として、試料2については低融点ろう材として利用可能性は極めて低いことを確認した。
2 曲がり管
3 溶融ろう材
4 溶融槽
5 接合部
10 銅板
11 重ね継手
Claims (2)
- Cu7.6重量%を超え41.4重量%以下、Ni0.04〜2重量%、Al0.006〜0.1重量%、残部Snからなる低融点ろう材。
- Geをさらに0.001〜1重量%添加した請求項1記載の低融点ろう材。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012262534 | 2012-11-30 | ||
JP2012262534 | 2012-11-30 | ||
PCT/JP2013/081873 WO2014084242A1 (ja) | 2012-11-30 | 2013-11-27 | 低融点ろう材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2014084242A1 JPWO2014084242A1 (ja) | 2017-01-05 |
JP6283317B2 true JP6283317B2 (ja) | 2018-02-21 |
Family
ID=50827874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014549852A Expired - Fee Related JP6283317B2 (ja) | 2012-11-30 | 2013-11-27 | 低融点ろう材 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6283317B2 (ja) |
WO (1) | WO2014084242A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2015053114A1 (ja) * | 2013-10-10 | 2017-03-09 | 株式会社日本スペリア社 | 低融点ろう材 |
KR101951162B1 (ko) | 2016-09-13 | 2019-02-21 | 센주긴조쿠고교 가부시키가이샤 | 땜납 합금, 땜납 볼 및 땜납 조인트 |
JP2018153834A (ja) * | 2017-03-17 | 2018-10-04 | 株式会社ニーケプロダクツ | アルミニウム部材同士またはアルミニウム部材と銅部材とをトーチハンダ付けする方法 |
JP6292342B1 (ja) * | 2017-09-20 | 2018-03-14 | 千住金属工業株式会社 | Cu管及び/又はFe管接合用はんだ合金、プリフォームはんだ、やに入りはんだおよびはんだ継手 |
JP6369620B1 (ja) | 2017-12-31 | 2018-08-08 | 千住金属工業株式会社 | はんだ合金 |
TWI725664B (zh) * | 2018-12-14 | 2021-04-21 | 日商千住金屬工業股份有限公司 | 焊料合金、焊料膏、焊料預形體及焊料接頭 |
TWI820277B (zh) * | 2018-12-27 | 2023-11-01 | 美商阿爾發金屬化工公司 | 無鉛焊料組成物 |
JP6744972B1 (ja) | 2019-10-04 | 2020-08-19 | 有限会社 ナプラ | 接合構造部 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4758407A (en) * | 1987-06-29 | 1988-07-19 | J.W. Harris Company | Pb-free, tin base solder composition |
JP3205466B2 (ja) * | 1994-06-13 | 2001-09-04 | 福田金属箔粉工業株式会社 | Sn基低融点ろう材 |
JP2000197988A (ja) * | 1998-03-26 | 2000-07-18 | Nihon Superior Co Ltd | 無鉛はんだ合金 |
JP3775172B2 (ja) * | 2000-05-22 | 2006-05-17 | 株式会社村田製作所 | はんだ組成物およびはんだ付け物品 |
WO2002068146A1 (fr) * | 2001-02-27 | 2002-09-06 | Sumida Corporation | Alliage de brasage sans plomb et composants electriques l'utilisant |
JP4673552B2 (ja) * | 2001-08-30 | 2011-04-20 | スミダコーポレーション株式会社 | コイル部品 |
JP2004154864A (ja) * | 2002-10-15 | 2004-06-03 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
US7172726B2 (en) * | 2002-10-15 | 2007-02-06 | Senju Metal Industry Co., Ltd. | Lead-free solder |
JP2006254580A (ja) * | 2005-03-10 | 2006-09-21 | Mitsuba Corp | 電動モータのコンミテータ |
JP2006289434A (ja) * | 2005-04-11 | 2006-10-26 | Nihon Superior Co Ltd | はんだ合金 |
CN103547407A (zh) * | 2011-04-08 | 2014-01-29 | 日本斯倍利亚社股份有限公司 | 焊锡合金 |
JP2013013916A (ja) * | 2011-07-04 | 2013-01-24 | Nihon Superior Co Ltd | 金属間化合物含有鉛フリーはんだ合金及びその製造方法 |
-
2013
- 2013-11-27 JP JP2014549852A patent/JP6283317B2/ja not_active Expired - Fee Related
- 2013-11-27 WO PCT/JP2013/081873 patent/WO2014084242A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2014084242A1 (ja) | 2014-06-05 |
JPWO2014084242A1 (ja) | 2017-01-05 |
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