MX365124B - Circuito integrado con instalación de enfriamiento. - Google Patents

Circuito integrado con instalación de enfriamiento.

Info

Publication number
MX365124B
MX365124B MX2016015966A MX2016015966A MX365124B MX 365124 B MX365124 B MX 365124B MX 2016015966 A MX2016015966 A MX 2016015966A MX 2016015966 A MX2016015966 A MX 2016015966A MX 365124 B MX365124 B MX 365124B
Authority
MX
Mexico
Prior art keywords
cooling
contact area
integrated circuit
doped layer
cooling array
Prior art date
Application number
MX2016015966A
Other languages
English (en)
Other versions
MX2016015966A (es
Inventor
Kilic Halil
Original Assignee
Hat Teknoloji A S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hat Teknoloji A S filed Critical Hat Teknoloji A S
Publication of MX2016015966A publication Critical patent/MX2016015966A/es
Publication of MX365124B publication Critical patent/MX365124B/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H10N19/101—Multiple thermocouples connected in a cascade arrangement

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

La presente invención se refiere a una instalación de enfriamiento para circuito integrado, preferentemente para un microprocesador o aparato de refrigeración, constituido por un substrato dieléctrico con zonas dopadas y distinguidas para la realización del al menos un componente microelectrónico que forma un circuito integrado y al menos un componente termoeléctrico que forma un Refrigeración. El conjunto de refrigeración se caracteriza porque el componente termoeléctrico 1 comprende al menos un primer área de contacto, al menos un segundo área de contacto y al menos una sección de enfriamiento donde la sección de enfriamiento está dispuesta entre el primera y el segundo área de contacto y está constituida por al menos Un elemento térmico 29 que se suministra con tensión por la primera zona de contacto y la segunda zona de contacto a través de una unidad de control, en la que el elemento térmico 29 está constituido por al menos una capa dopada y una segunda capa dopada que están conectadas de tal manera Por medio de un elemento de puente 53, 58, 59, 73, 83, 84, 92 que el elemento de puente 53, 58, 59, 73, 83, 84, 92 descansa sólo parcialmente sobre la primera capa dopada y/o la segunda capa dopada. Mediante la disposición de refrigeración de acuerdo con la invención se pueden realizar circuitos integrados compactos y/o más eficientes, ya que se garantiza un flujo de calor suficientemente libre desde el interior del circuito integrado.
MX2016015966A 2014-06-02 2015-06-01 Circuito integrado con instalación de enfriamiento. MX365124B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/EP2014/061335 WO2015185082A1 (en) 2014-06-02 2014-06-02 Integrated, three-dimensional cell configuration, integrated cooling array and cell-based integrated circuit
PCT/EP2015/001109 WO2015185204A1 (en) 2014-06-02 2015-06-01 Integrated circuit with cooling array

Publications (2)

Publication Number Publication Date
MX2016015966A MX2016015966A (es) 2017-03-16
MX365124B true MX365124B (es) 2019-05-24

Family

ID=50897581

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2016015966A MX365124B (es) 2014-06-02 2015-06-01 Circuito integrado con instalación de enfriamiento.

Country Status (17)

Country Link
US (1) US20180145241A1 (es)
EP (1) EP3149785A1 (es)
JP (2) JP2017525133A (es)
KR (1) KR20170013331A (es)
CN (2) CN106463606A (es)
AP (1) AP2017009669A0 (es)
AU (1) AU2015271243A1 (es)
BR (1) BR112016028369A2 (es)
CA (2) CA2949931A1 (es)
EA (1) EA201650136A1 (es)
IL (2) IL249179A0 (es)
MA (1) MA40285A (es)
MX (1) MX365124B (es)
SG (3) SG11201609840XA (es)
TR (1) TR201700279T1 (es)
WO (2) WO2015185082A1 (es)
ZA (1) ZA201608808B (es)

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US10586138B2 (en) * 2017-11-02 2020-03-10 International Business Machines Corporation Dynamic thermoelectric quick response code branding
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EP3760994A4 (en) * 2018-04-10 2021-05-05 Panasonic Intellectual Property Management Co., Ltd. METHOD OF MEASURING THE AMOUNT OF HEAT GENERATED AND DEVICE FOR MEASURING THE AMOUNT OF HEAT GENERATED
JP7217401B2 (ja) * 2018-08-08 2023-02-03 パナソニックＩｐマネジメント株式会社 発熱量測定方法および発熱量測定装置

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Also Published As

Publication number Publication date
SG11201609841YA (en) 2016-12-29
CA2949931A1 (en) 2015-12-10
TR201700279T1 (tr) 2017-10-23
CA2949938A1 (en) 2015-12-10
US20180145241A1 (en) 2018-05-24
MA40285A (fr) 2017-04-05
BR112016028369A2 (pt) 2018-01-16
CN106463606A (zh) 2017-02-22
EA201650136A1 (ru) 2017-05-31
WO2015185082A1 (en) 2015-12-10
JP2017525135A (ja) 2017-08-31
SG11201609840XA (en) 2016-12-29
AU2015271243A1 (en) 2017-01-12
MX2016015966A (es) 2017-03-16
AP2017009669A0 (en) 2017-01-31
IL249179A0 (en) 2017-01-31
SG10201810804PA (en) 2018-12-28
IL249178A0 (en) 2017-01-31
WO2015185204A1 (en) 2015-12-10
ZA201608808B (en) 2019-03-27
CN106471633A (zh) 2017-03-01
EP3149785A1 (en) 2017-04-05
KR20170013331A (ko) 2017-02-06
JP2017525133A (ja) 2017-08-31

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