SG11201609840XA - Integrated, three-dimensional cell configuration, integrated cooling array and cell-based integrated circuit - Google Patents

Integrated, three-dimensional cell configuration, integrated cooling array and cell-based integrated circuit

Info

Publication number
SG11201609840XA
SG11201609840XA SG11201609840XA SG11201609840XA SG11201609840XA SG 11201609840X A SG11201609840X A SG 11201609840XA SG 11201609840X A SG11201609840X A SG 11201609840XA SG 11201609840X A SG11201609840X A SG 11201609840XA SG 11201609840X A SG11201609840X A SG 11201609840XA
Authority
SG
Singapore
Prior art keywords
integrated
cell
cooling array
integrated circuit
cell configuration
Prior art date
Application number
SG11201609840XA
Other languages
English (en)
Inventor
Halil Kilic
Original Assignee
Hat Teknoloji A Ş
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hat Teknoloji A Ş filed Critical Hat Teknoloji A Ş
Publication of SG11201609840XA publication Critical patent/SG11201609840XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H10N19/101—Multiple thermocouples connected in a cascade arrangement

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
SG11201609840XA 2014-06-02 2014-06-02 Integrated, three-dimensional cell configuration, integrated cooling array and cell-based integrated circuit SG11201609840XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2014/061335 WO2015185082A1 (en) 2014-06-02 2014-06-02 Integrated, three-dimensional cell configuration, integrated cooling array and cell-based integrated circuit

Publications (1)

Publication Number Publication Date
SG11201609840XA true SG11201609840XA (en) 2016-12-29

Family

ID=50897581

Family Applications (3)

Application Number Title Priority Date Filing Date
SG11201609840XA SG11201609840XA (en) 2014-06-02 2014-06-02 Integrated, three-dimensional cell configuration, integrated cooling array and cell-based integrated circuit
SG10201810804PA SG10201810804PA (en) 2014-06-02 2015-06-01 Integrated circuit with cooling array
SG11201609841YA SG11201609841YA (en) 2014-06-02 2015-06-01 Integrated circuit with cooling array

Family Applications After (2)

Application Number Title Priority Date Filing Date
SG10201810804PA SG10201810804PA (en) 2014-06-02 2015-06-01 Integrated circuit with cooling array
SG11201609841YA SG11201609841YA (en) 2014-06-02 2015-06-01 Integrated circuit with cooling array

Country Status (17)

Country Link
US (1) US20180145241A1 (es)
EP (1) EP3149785A1 (es)
JP (2) JP2017525133A (es)
KR (1) KR20170013331A (es)
CN (2) CN106463606A (es)
AP (1) AP2017009669A0 (es)
AU (1) AU2015271243A1 (es)
BR (1) BR112016028369A2 (es)
CA (2) CA2949931A1 (es)
EA (1) EA201650136A1 (es)
IL (2) IL249179A0 (es)
MA (1) MA40285A (es)
MX (1) MX365124B (es)
SG (3) SG11201609840XA (es)
TR (1) TR201700279T1 (es)
WO (2) WO2015185082A1 (es)
ZA (1) ZA201608808B (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106655893A (zh) * 2016-12-25 2017-05-10 北京工业大学 一种芯片内部将热能转化成电能的模块
US10586138B2 (en) * 2017-11-02 2020-03-10 International Business Machines Corporation Dynamic thermoelectric quick response code branding
US10430620B2 (en) 2018-02-26 2019-10-01 International Business Machines Corporation Dynamic thermoelectric image branding
JP7065308B2 (ja) * 2018-04-10 2022-05-12 パナソニックＩｐマネジメント株式会社 発熱量測定方法および発熱量測定装置
JP7217401B2 (ja) * 2018-08-08 2023-02-03 パナソニックＩｐマネジメント株式会社 発熱量測定方法および発熱量測定装置

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01245549A (ja) * 1988-03-26 1989-09-29 Matsushita Electric Works Ltd 半導体装置およびその製法
JP3173853B2 (ja) * 1991-08-02 2001-06-04 株式会社エコ・トゥエンティーワン 熱電変換素子
JP3214664B2 (ja) * 1995-05-25 2001-10-02 松下電器産業株式会社 超伝導素子および温度制御器を備えた高周波装置
JP3956405B2 (ja) * 1996-05-28 2007-08-08 松下電工株式会社 熱電モジュールの製造方法
JPH11233986A (ja) * 1998-02-12 1999-08-27 Sony Corp 半導体装置
JP4131029B2 (ja) * 1998-02-18 2008-08-13 松下電工株式会社 熱電変換モジュール
JP4146032B2 (ja) * 1999-05-31 2008-09-03 東芝エレベータ株式会社 半導体スイッチ装置およびこの半導体スイッチ装置を用いた電力変換装置
US6614109B2 (en) * 2000-02-04 2003-09-02 International Business Machines Corporation Method and apparatus for thermal management of integrated circuits
IL136275A0 (en) 2000-05-22 2001-05-20 Active Cool Ltd Active cooling system for cpu and semiconductors also enabling thermal acceleration
US6559538B1 (en) * 2000-10-20 2003-05-06 Bae Systems Information And Electronic Systems Integration Inc. Integrated circuit device having a built-in thermoelectric cooling mechanism
JP3462469B2 (ja) * 2000-12-15 2003-11-05 Ｓｍｃ株式会社 円形冷却プレート用異形サーモモジュール及びそれを用いた円形冷却プレート
IL147394A0 (en) 2001-12-30 2002-08-14 Active Cool Ltd Thermoelectric active cooling system for a computer processor with reduced audible noise and emi noise audio noise
JP2003332640A (ja) * 2002-05-16 2003-11-21 Seiko Instruments Inc ペルチェ素子モジュール
US7034394B2 (en) * 2003-10-08 2006-04-25 Intel Corporation Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
US6880345B1 (en) * 2003-11-04 2005-04-19 Intel Corporation Cooling system for an electronic component
CN1297802C (zh) * 2004-02-12 2007-01-31 李韫言 一种全硅集成流量传感器及其制造方法
JP4485865B2 (ja) * 2004-07-13 2010-06-23 Ｏｋｉセミコンダクタ株式会社 半導体装置、及びその製造方法
US7523617B2 (en) 2004-10-22 2009-04-28 Nextreme Thermal Solutions, Inc. Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
US7544883B2 (en) * 2004-11-12 2009-06-09 International Business Machines Corporation Integrated thermoelectric cooling devices and methods for fabricating same
US8318519B2 (en) * 2005-01-11 2012-11-27 SemiLEDs Optoelectronics Co., Ltd. Method for handling a semiconductor wafer assembly
KR100703860B1 (ko) 2005-03-23 2007-04-04 한 상 이 슬라이딩 개폐장치 및 그를 채용한 응용기기
JP2007095897A (ja) * 2005-09-28 2007-04-12 Toshiba Corp 半導体装置とその製造方法
JP4799204B2 (ja) * 2006-02-09 2011-10-26 株式会社半導体エネルギー研究所 温度センサ素子、表示装置および半導体装置
KR20080062045A (ko) * 2006-12-29 2008-07-03 동부일렉트로닉스 주식회사 시모스 소자 및 그 제조 방법
US20130255741A1 (en) * 2007-08-29 2013-10-03 Texas Instruments Incorporated Structure and method for coupling heat to an embedded thermoelectric device
US8598700B2 (en) * 2008-06-27 2013-12-03 Qualcomm Incorporated Active thermal control for stacked IC devices
JP5249662B2 (ja) * 2008-07-23 2013-07-31 パナソニック株式会社 熱電変換モジュール及びその製造方法
US8728846B2 (en) * 2008-08-20 2014-05-20 Texas Instruments Incorporated Vertical thermoelectric structures
US20110094556A1 (en) * 2009-10-25 2011-04-28 Digital Angel Corporation Planar thermoelectric generator
JP2011146474A (ja) * 2010-01-13 2011-07-28 Sony Corp 半導体装置及びその製造方法
US8441092B2 (en) * 2010-12-06 2013-05-14 Stmicroelectronics Pte. Ltd. Thermoelectric cooler system, method and device
JP2014086330A (ja) * 2012-10-25 2014-05-12 Fujitsu Ltd 小型電源モジュール及び半導体モジュール

Also Published As

Publication number Publication date
WO2015185204A1 (en) 2015-12-10
CN106471633A (zh) 2017-03-01
KR20170013331A (ko) 2017-02-06
JP2017525133A (ja) 2017-08-31
SG10201810804PA (en) 2018-12-28
BR112016028369A2 (pt) 2018-01-16
MX2016015966A (es) 2017-03-16
IL249178A0 (en) 2017-01-31
MA40285A (fr) 2017-04-05
TR201700279T1 (tr) 2017-10-23
CN106463606A (zh) 2017-02-22
CA2949938A1 (en) 2015-12-10
WO2015185082A1 (en) 2015-12-10
JP2017525135A (ja) 2017-08-31
CA2949931A1 (en) 2015-12-10
AU2015271243A1 (en) 2017-01-12
EA201650136A1 (ru) 2017-05-31
US20180145241A1 (en) 2018-05-24
MX365124B (es) 2019-05-24
SG11201609841YA (en) 2016-12-29
IL249179A0 (en) 2017-01-31
AP2017009669A0 (en) 2017-01-31
ZA201608808B (en) 2019-03-27
EP3149785A1 (en) 2017-04-05

Similar Documents

Publication Publication Date Title
HK1246825A1 (zh) 細胞
HK1250667A1 (zh) 細胞
HK1252162A1 (zh) 細胞
SG10201912825XA (en) Genetically modified cells and uses thereof
GB201621889D0 (en) Cell
GB201507368D0 (en) Cell
GB201503500D0 (en) Cell
GB201610515D0 (en) Cell
GB201522097D0 (en) Cells
ZA201607022B (en) Encoded cells and cell arrays
GB201616238D0 (en) Modified T cells
HK1223195A1 (zh) 反熔絲存儲器單元
GB201603372D0 (en) Cell
IL249178A0 (en) 3D integrated cell configuration, integrated cooling array and cell-based integrated circuit
GB2526825B (en) An integrated circuit with interface circuitry, and an interface cell for such interface circuitry
ZA201900891B (en) B-cell-mimetic cells
GB201609604D0 (en) Cell
GB201617716D0 (en) Cell
PL3131154T3 (pl) Żebro chłodzące, moduł chłodzący zawierający żebro chłodzące i zawierający go moduł akumulatora
GB201604427D0 (en) Modified cell
GB2526823B (en) An integrated circuit with interface circuitry, and an interface cell for such interface circuitry
PL3128579T3 (pl) Ogniwo baterii
GB201510142D0 (en) Electrochemical cells
GB201508753D0 (en) Two cell photovoltaic device
GB201507819D0 (en) Cell