KR970705835A - 활성 매트릭스 전자 형광 디스플레이 화소 및 제조방법(active matrix electroluminescent display pixel and method of fabricating same) - Google Patents

활성 매트릭스 전자 형광 디스플레이 화소 및 제조방법(active matrix electroluminescent display pixel and method of fabricating same)

Info

Publication number
KR970705835A
KR970705835A KR1019970701166A KR19970701166A KR970705835A KR 970705835 A KR970705835 A KR 970705835A KR 1019970701166 A KR1019970701166 A KR 1019970701166A KR 19970701166 A KR19970701166 A KR 19970701166A KR 970705835 A KR970705835 A KR 970705835A
Authority
KR
South Korea
Prior art keywords
drift region
insulating layer
forming
capacitor
depositing
Prior art date
Application number
KR1019970701166A
Other languages
English (en)
Other versions
KR100385378B1 (ko
Inventor
퓨-렁 슈에
알프레드 씨. 아이프리
게리 마크 돌리
로거 지. 스테와트
Original Assignee
윌리엄 제이. 버크
사르노프 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윌리엄 제이. 버크, 사르노프 코포레이션 filed Critical 윌리엄 제이. 버크
Publication of KR970705835A publication Critical patent/KR970705835A/ko
Application granted granted Critical
Publication of KR100385378B1 publication Critical patent/KR100385378B1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232Field-effect technology
    • H01L21/8234MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1203Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/782Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, each consisting of a single circuit element
    • H01L21/786Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, each consisting of a single circuit element the substrate being other than a semiconductor body, e.g. insulating body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00Aspects of the constitution of display devices
    • G09G2300/08Active matrix structure, i.e. with use of active elements, inclusive of non-linear two terminal elements, in the pixels together with light emitting or modulating elements
    • G09G2300/0809Several active elements per pixel in active matrix panels
    • G09G2300/0842Several active elements per pixel in active matrix panels forming a memory circuit, e.g. a dynamic memory with one capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Thin Film Transistor (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

활성 매트릭스 전지 형광 디스플레이에서, 화소(102)는 EL셀(108) 및 스위칭 장치(104) 사이에서 형성되고 접지된 도전성 전계 실드(104)를 포함하고, 그래서 EL 셀에서 만들어진 어떤 전계는 스위칭 장치의 작동을 방해 하지 않는다. 상기 화소의 제조 방법에 있어서, 첫째 EL 셀 스위칭 회로가 형성되고, 그러면 절연층(224) 및 상기 전계 실드(104)는 스위칭 회로 상에 연속적으로 형성된다. 더욱이, 상기 스위칭 회로는 저전압 MOS 트랜지스터(110) 및 고전압 MOS 트랜지스터(112)를 포함한다. 활성화 되었을 때, 저전압 트랜지스터는 고전압 트랜지스터의 게이트를 충전함으로서 고전압 트랜지스터를 활성화한다. 부가적으로, 고전압 트랜지스터의 브레이크다운 전압을 개선하기 위하여, 캐패시터 분할 네트워트(400)는 상기 트랜지스터의 드리프트 영역에 근접하여 배치된다.

Description

활성 매트릭스 전자 형광 디스플레이 화소 및 제조방법(ACTIVE MATRIX ELECTROLUMINESCENT DISPLAY PIXEL AND METHOD OF FABRICATING SAME)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 전계를 포함하는 AMELD 화소의 개략적인 단면도, 제3도는 AMELD 화소의 선택적인 실시예를 설명하는 개략적인 단면도, 및 제4도는 고전압 트래ㅈ니스터 내의 캐패시터 분할 네트워크의 단면도.

Claims (9)

  1. 드리프트 영역(202)에 의해 분리된 드레인 영역(234) 및 소스 영역(232); 상기 드리프트 영역에 평행하고 절연 층(212)에 의해 상기 드리프트 영역으로부터 분리되며 상기 드리프트 영역을 부분적으로 덮는 게이트 전극(218); 및 상기 드리프트 영역내에서 균일한 전계를 발생하기 위하여 상기 드리프트 영역에 인접하여 배치되고 상기 드리프트 영역으로부터 공간적으로 분리된 캐패시터 분할 네트워트(222)를 포함하는 것을 특징으로 하는 고전압 트랜지스터.
  2. 제1항에 있어서, 상기 캐패시터 분할 네트워크는, 고전압 전극(250); 상기 고전압 전극으로부터 전하를 축적하기 위하여 절연층(248)에 의해 상기 고전압 전극으로부터 공간적으로 분리된 다수의 제1도전성 엘리먼트(246); 상기 다수의 제1도전성 엘리먼트로부터 결합된 전하를 축적하기 위하여 절연층(212)에 의해 상기 다수의 제1도전성 엘리먼트로부터 공간적으로 분리된 다수의 제2도전성 엘리먼트(224)를 포함하고, 상기 제2트랜지스터의 드리프트 영역은 상기 엘리먼트에 평행하고 절연층에 의해 상기 다수의 제2도전성 엘리먼트로부터 공간적으로 분리되며, 상기 다수의 제2도전성 엘리먼트 상에 축적된 전하는 상기 드리프트 영역내에서 균일한 전계를 발생하는 것을 특징으로 하는 고전압 트랜지스터.
  3. 제2항에 있어서, 상기 각 제1도전성 엘리먼트는 상기 다수의 제2도전성 엘리먼트의 적어도 하나와 부분적으로 중복되는 것을 특징으로 하는 고전압 트랜지스터.
  4. 전자 형광 디스플레이 내에서 화소(102)를 만드는 방법에 있어서, 스위칭 회로에접속된 전자 형광 셀(108)을 통하여 전류를 제어하기 위하여 기판(206) 상에 스위칭 회로(106)를 형성하는 단계; 상기 스위칭 회로상에 절연층(212)을 증착하는 단계; 및 상기 절연층 및 상기 전자 형광 셀 사이에 상기 스위칭 회로로부터 상기 전자 형광 셀 내에서 전계를 절연하는 전계 실드(104)를 증착하는 단계를 포함하는 것을 특징으로 하는 방법.
  5. 제4항에 있어서, 상기 형성 단계는, 드레인 영역(234)과 소스 영역(232) 사이에 고전압 트랜지스터용드리프트 영역을 형성하는 단계 ; 상기 드리프트 영역상에 절연층(212)을 형성하는 단계; 및 상기 절연층 상에 게이트 전극(218)을 증착하는 단계를 더 포함하고, 상기 게이트 전극은 상기 전계 실드에 평행하며 상기 전계 실드 및 상기 게이트 전극이 저장 캐패시터(118)를 형성하도록 상기 드리프트 영역과 부분적으로 중복하는 것을 특징으로 하는 방법.
  6. 제5항에 있어서, 상기 전자 형광 셀에 상기 드레인 영역을 접속하기 위하여 상기 드레인 영역에 저항을 형성하는 단계를 더 포함하는 것을 특징으로 하는 방법.
  7. 제4항에 있어서, 상기 형성단계는, 드레인 영역(234) 및 소스 영역(232) 사이에 트랜지스터(112)용 드리프트 영역을 형성하는 단계; 상기 드리프트 영역 상에 절연 층(212)을 형성하는 단계; 상기 절연층 상에 상기 드리프트 영역을 부분적으로 중복하는 게이트 전극(218)을 증착하는 단계; 상기 절연층 상에 상기 게이트 전극에 의해 중복되지 않은 상기 드리프트 영역의 일부와 중복하는 제1다수의 캐패시터 엘리먼트(224)를 증착하는 단계; 상기 캐패시터 엘리먼트 및 상기 게이트 전극 상에 제2절연 층(212)을 형성하는 단계; 상기 제2산화물층상에 상기 제1다수의 캐패시터 엘리먼트와 중복하는 제2다수의 캐패시터 엘리먼트(246)를 증착하는 단계; 상기 제2다수의 캐패시터 엘리먼트 상에 제3절연층(248)을 형성하는 단계; 및 상기 고전압 전극에 고전압이 인가될 때, 상기 제1 및 제2다수의 전극상에 축적돈 전하 및 전게가 상기 드르프트 영역에 균일하게 분포되도록 상기 제3절연층 상에 상기 전자 형광 셀의 고전압 전극(250)을 증착하는 단계를 더 포함하는 것을 특징으로 하는 방법.
  8. 고전압 트랜지스터(112)를 제조하는 방법에 있어서, 드레인 영역(234) 및 소스 영역(232) 사이에 트랜지스터(112)용 드리프트 영역(202)을 형성하는 단계; 상기 드리프트 영역 상에 절연 층(212)을 형성하는 단계; 상기 절연층 상에 상기 드리프트 영역에 부분적으로 중복되는 게이트 전극(218)을 증착하는 단계; 및 상기 드리프트 영역내에서 균일한 전계를 발생하기 위하여 상기 드리프트 영역에 인접하게 배치된 상기 드리프트 영역에서 공간적으로 분리된 캐패시터 분할네트워크(222)를 형성하는 단계를 포함하는 것을 특징으로 하는 방법.
  9. 제8항에 있어서, 상기 캐패시터 분할 네트워크를 형성하는 단계는, 상기 절연층 상에 상기 게이트 전극에 의해 중복되지 않은 상기 드리프트 영역의 일부와 중복하는 제1다수의 캐패시터 엘리먼트(224)를 증착하는 단계; 상기 캐패시터 엘리먼트 및 상기 게이트 전극 상에 제2절연층(212)을 형성하는 단계; 상기 제2산화물층상에 상기 제1캐패시터 엘리먼트와 부분적으로 중복하는 제2다수의 캐패시터 엘리먼트(246)를 증착하는 단계; 상기 제2다수의 캐패시터 엘리먼트 상에 제3절연층(248)을 형성하는 단계; 및 상기 고전압 전극에 고전압이 인가될 때, 상기 제1 및 제2 다수의 전극 상에 축적된 전하 및 전계가 상기 드리프트 영역에 균일하게 분포되도록 상기 제3절연층 상에 고전압 전극(250)을 증착하는 단계를 더 포함하는 것을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970701166A 1994-08-24 1995-08-24 활성매트릭스전자형광디스플레이화소및제조방법 KR100385378B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/295,374 US5587329A (en) 1994-08-24 1994-08-24 Method for fabricating a switching transistor having a capacitive network proximate a drift region
US08/295,374 1994-08-24

Publications (2)

Publication Number Publication Date
KR970705835A true KR970705835A (ko) 1997-10-09
KR100385378B1 KR100385378B1 (ko) 2003-07-16

Family

ID=23137427

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970701166A KR100385378B1 (ko) 1994-08-24 1995-08-24 활성매트릭스전자형광디스플레이화소및제조방법

Country Status (6)

Country Link
US (3) US5587329A (ko)
EP (1) EP0776526B1 (ko)
JP (2) JPH11511898A (ko)
KR (1) KR100385378B1 (ko)
DE (1) DE69531055T2 (ko)
WO (1) WO1996006456A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100682803B1 (ko) * 1999-10-29 2007-02-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 전자 장치

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6104041A (en) * 1994-08-24 2000-08-15 Sarnoff Corporation Switching circuitry layout for an active matrix electroluminescent display pixel with each pixel provided with the transistors
US5587329A (en) * 1994-08-24 1996-12-24 David Sarnoff Research Center, Inc. Method for fabricating a switching transistor having a capacitive network proximate a drift region
EP0845812B1 (en) * 1996-11-28 2009-10-28 Casio Computer Co., Ltd. Display apparatus
JP3392672B2 (ja) * 1996-11-29 2003-03-31 三洋電機株式会社 表示装置
US6110804A (en) * 1996-12-02 2000-08-29 Semiconductor Components Industries, Llc Method of fabricating a semiconductor device having a floating field conductor
US5990629A (en) * 1997-01-28 1999-11-23 Casio Computer Co., Ltd. Electroluminescent display device and a driving method thereof
US6462722B1 (en) * 1997-02-17 2002-10-08 Seiko Epson Corporation Current-driven light-emitting display apparatus and method of producing the same
CN1971937B (zh) * 1997-02-17 2012-12-12 精工爱普生株式会社 显示装置
TW578130B (en) * 1997-02-17 2004-03-01 Seiko Epson Corp Display unit
US6147362A (en) * 1997-03-17 2000-11-14 Honeywell International Inc. High performance display pixel for electronics displays
US6501094B1 (en) * 1997-06-11 2002-12-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising a bottom gate type thin film transistor
JP3520396B2 (ja) 1997-07-02 2004-04-19 セイコーエプソン株式会社 アクティブマトリクス基板と表示装置
KR100627091B1 (ko) * 1997-08-21 2006-09-22 세이코 엡슨 가부시키가이샤 액티브 매트릭스형 표시장치
JP3580092B2 (ja) * 1997-08-21 2004-10-20 セイコーエプソン株式会社 アクティブマトリクス型表示装置
JPH11204434A (ja) * 1998-01-12 1999-07-30 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
US6444390B1 (en) 1998-02-18 2002-09-03 Semiconductor Energy Laboratory Co., Ltd. Process for producing semiconductor thin film devices using group 14 element and high temperature oxidizing treatment to achieve a crystalline silicon film
JP3980159B2 (ja) * 1998-03-05 2007-09-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6783849B2 (en) 1998-03-27 2004-08-31 Yissum Research Development Company Of The Hebrew University Of Jerusalem Molecular layer epitaxy method and compositions
US6482684B1 (en) * 1998-03-27 2002-11-19 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a TFT with Ge seeded amorphous Si layer
US6316098B1 (en) 1998-03-27 2001-11-13 Yissum Research Development Company Of The Hebrew University Of Jerusalem Molecular layer epitaxy method and compositions
US6417825B1 (en) * 1998-09-29 2002-07-09 Sarnoff Corporation Analog active matrix emissive display
US6373526B1 (en) 1999-03-19 2002-04-16 Sony Corporation Processing of closed caption in different formats
GB2350926A (en) * 1999-05-27 2000-12-13 Seiko Epson Corp Monolithic,semiconductor light emitting and receiving device
JP4627822B2 (ja) * 1999-06-23 2011-02-09 株式会社半導体エネルギー研究所 表示装置
JP2001051272A (ja) 1999-08-11 2001-02-23 Semiconductor Energy Lab Co Ltd フロントライト及び電子機器
US6587086B1 (en) 1999-10-26 2003-07-01 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device
TW484117B (en) * 1999-11-08 2002-04-21 Semiconductor Energy Lab Electronic device
TW525122B (en) 1999-11-29 2003-03-21 Semiconductor Energy Lab Electronic device
TW493152B (en) * 1999-12-24 2002-07-01 Semiconductor Energy Lab Electronic device
US6590227B2 (en) * 1999-12-27 2003-07-08 Semiconductor Energy Laboratory Co., Ltd. Active matrix display device
JP3659103B2 (ja) 1999-12-28 2005-06-15 セイコーエプソン株式会社 電気光学装置、電気光学装置の駆動回路および駆動方法、電子機器
JP4212079B2 (ja) * 2000-01-11 2009-01-21 ローム株式会社 表示装置およびその駆動方法
US6614088B1 (en) * 2000-02-18 2003-09-02 James D. Beasom Breakdown improvement method and sturcture for lateral DMOS device
TW521226B (en) * 2000-03-27 2003-02-21 Semiconductor Energy Lab Electro-optical device
TW516164B (en) * 2000-04-21 2003-01-01 Semiconductor Energy Lab Self-light emitting device and electrical appliance using the same
US7339317B2 (en) 2000-06-05 2008-03-04 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device having triplet and singlet compound in light-emitting layers
US6864628B2 (en) 2000-08-28 2005-03-08 Semiconductor Energy Laboratory Co., Ltd. Light emitting device comprising light-emitting layer having triplet compound and light-emitting layer having singlet compound
SG118110A1 (en) 2001-02-01 2006-01-27 Semiconductor Energy Lab Organic light emitting element and display device using the element
KR20040043116A (ko) 2001-04-10 2004-05-22 사르노프 코포레이션 유기 박막 트랜지스터를 이용한 고성능 액티브 매트릭스화소 제공방법 및 제공장치
US7474002B2 (en) * 2001-10-30 2009-01-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having dielectric film having aperture portion
JP3671012B2 (ja) * 2002-03-07 2005-07-13 三洋電機株式会社 表示装置
KR100432651B1 (ko) * 2002-06-18 2004-05-22 삼성에스디아이 주식회사 화상 표시 장치
KR100489802B1 (ko) 2002-12-18 2005-05-16 한국전자통신연구원 고전압 및 저전압 소자의 구조와 그 제조 방법
WO2005004548A1 (ja) * 2003-07-02 2005-01-13 Matsushita Electric Industrial Co., Ltd. 発光素子及び表示デバイス
WO2005075783A1 (de) 2004-02-03 2005-08-18 Karl Lenhardt Isolierglasscheibe und verfahren zu ihrer herstellung
US7112838B2 (en) * 2004-03-31 2006-09-26 Broadcom Corporation Multipurpose metal fill
US8566568B2 (en) * 2006-08-16 2013-10-22 Qualcomm Incorporated Method and apparatus for executing processor instructions based on a dynamically alterable delay
KR101103615B1 (ko) * 2007-07-30 2012-01-09 쿄세라 코포레이션 화상 표시 장치
KR101515382B1 (ko) * 2008-08-26 2015-04-27 삼성디스플레이 주식회사 박막 트랜지스터 표시판
US20110133286A1 (en) * 2009-12-03 2011-06-09 Franz Dietz Integrierter schaltungsteil
DE102009056562A1 (de) * 2009-12-03 2011-06-09 Telefunken Semiconductors Gmbh & Co. Kg Integrierter Schaltungsteil
US8294210B2 (en) * 2010-06-15 2012-10-23 Texas Instruments Incorporated High voltage channel diode
GB2489939A (en) * 2011-04-11 2012-10-17 Plastic Logic Ltd Control of capacitive coupling in pixel circuitry
JP5817580B2 (ja) * 2012-02-17 2015-11-18 セイコーエプソン株式会社 電気光学装置および電子機器
CN103018991B (zh) * 2012-12-24 2015-01-28 京东方科技集团股份有限公司 一种阵列基板及其制造方法、显示装置
JP6164269B2 (ja) * 2015-09-30 2017-07-19 セイコーエプソン株式会社 電気光学装置および電子機器
JP6323584B2 (ja) * 2017-03-22 2018-05-16 セイコーエプソン株式会社 電気光学装置および電子機器
JP6555381B2 (ja) * 2018-04-11 2019-08-07 セイコーエプソン株式会社 電気光学装置および電子機器

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4006383A (en) * 1975-11-28 1977-02-01 Westinghouse Electric Corporation Electroluminescent display panel with enlarged active display areas
US4087792A (en) * 1977-03-03 1978-05-02 Westinghouse Electric Corp. Electro-optic display system
JPS56169368A (en) * 1980-05-30 1981-12-26 Sharp Corp High withstand voltage mos field effect semiconductor device
JPS5828780A (ja) * 1981-08-12 1983-02-19 富士通株式会社 表示装置
JPS5875194A (ja) * 1981-10-30 1983-05-06 株式会社日立製作所 マトリクス表示装置及び駆動方法
US4528480A (en) * 1981-12-28 1985-07-09 Nippon Telegraph & Telephone AC Drive type electroluminescent display device
US4602192A (en) * 1983-03-31 1986-07-22 Matsushita Electric Industrial Co., Ltd. Thin film integrated device
JPS60103676A (ja) * 1983-11-11 1985-06-07 Seiko Instr & Electronics Ltd 薄膜トランジスタアレイの製造方法
JPS61168253A (ja) * 1985-01-19 1986-07-29 Sharp Corp 高耐圧mos電界効果半導体装置
US4737684A (en) * 1985-02-21 1988-04-12 Murata Manufacturing Co., Ltd. Thin film EL element having a crystal-orientable ZnO sublayer for a light-emitting layer
US4983880A (en) * 1986-12-19 1991-01-08 Gte Products Corporation Edge breakdown protection in ACEL thin film display
US4876212A (en) * 1987-10-01 1989-10-24 Motorola Inc. Process for fabricating complimentary semiconductor devices having pedestal structures
JP2627071B2 (ja) * 1988-01-26 1997-07-02 キヤノン株式会社 光変調素子
US5184969A (en) * 1988-05-31 1993-02-09 Electroluminscent Technologies Corporation Electroluminescent lamp and method for producing the same
JP2771820B2 (ja) * 1988-07-08 1998-07-02 株式会社日立製作所 アクティブマトリクスパネル及びその製造方法
US4954747A (en) * 1988-11-17 1990-09-04 Tuenge Richard T Multi-colored thin-film electroluminescent display with filter
US5132816A (en) * 1989-02-02 1992-07-21 Sharp Kabushiki Kaisha Ferroelectric liquid crystal device and method of manufacturing the same
US4908328A (en) * 1989-06-06 1990-03-13 National Semiconductor Corporation High voltage power IC process
JP2617798B2 (ja) * 1989-09-22 1997-06-04 三菱電機株式会社 積層型半導体装置およびその製造方法
US5118987A (en) * 1989-11-13 1992-06-02 Westinghouse Electric Corp. Multi-layer structure and method of constructing the same for providing tfel edge emitter modules
JPH0758635B2 (ja) * 1989-11-24 1995-06-21 富士ゼロックス株式会社 El駆動回路
US5056895A (en) * 1990-05-21 1991-10-15 Greyhawk Systems, Inc. Active matrix liquid crystal liquid crystal light valve including a dielectric mirror upon a leveling layer and having fringing fields
JP2616153B2 (ja) * 1990-06-20 1997-06-04 富士ゼロックス株式会社 El発光装置
US5206749A (en) * 1990-12-31 1993-04-27 Kopin Corporation Liquid crystal display having essentially single crystal transistors pixels and driving circuits
US5258320A (en) * 1990-12-31 1993-11-02 Kopin Corporation Single crystal silicon arrayed devices for display panels
US5198721A (en) * 1991-02-24 1993-03-30 Nec Research Institute, Inc. Electroluminescent cell using a ZnS host including molecules of a ternary europium tetrafluoride compound
US5233459A (en) * 1991-03-06 1993-08-03 Massachusetts Institute Of Technology Electric display device
US5308779A (en) * 1991-03-28 1994-05-03 Honeywell Inc. Method of making high mobility integrated drivers for active matrix displays
US5057450A (en) * 1991-04-01 1991-10-15 International Business Machines Corporation Method for fabricating silicon-on-insulator structures
US5302966A (en) * 1992-06-02 1994-04-12 David Sarnoff Research Center, Inc. Active matrix electroluminescent display and method of operation
WO1994018706A1 (en) * 1993-02-10 1994-08-18 Seiko Epson Corporation Active matrix substrate and thin film transistor, and method of its manufacture
US5587329A (en) * 1994-08-24 1996-12-24 David Sarnoff Research Center, Inc. Method for fabricating a switching transistor having a capacitive network proximate a drift region

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100682803B1 (ko) * 1999-10-29 2007-02-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 전자 장치

Also Published As

Publication number Publication date
EP0776526A4 (en) 1998-04-29
DE69531055T2 (de) 2004-04-01
US5587329A (en) 1996-12-24
EP0776526A1 (en) 1997-06-04
WO1996006456A1 (en) 1996-02-29
JP2007134728A (ja) 2007-05-31
JPH11511898A (ja) 1999-10-12
KR100385378B1 (ko) 2003-07-16
JP5086613B2 (ja) 2012-11-28
US5736752A (en) 1998-04-07
US5932892A (en) 1999-08-03
EP0776526B1 (en) 2003-06-11
DE69531055D1 (de) 2003-07-17

Similar Documents

Publication Publication Date Title
KR970705835A (ko) 활성 매트릭스 전자 형광 디스플레이 화소 및 제조방법(active matrix electroluminescent display pixel and method of fabricating same)
KR970063776A (ko) 중첩된 필드플레이트구조를 갖는 전력반도체장치 및 그의 제조방법
US4239346A (en) Compact liquid crystal display system
US4614959A (en) Improved high voltage MOS transistor with field plate layers for preventing reverse field plate effect
CN105810677B (zh) 静电释放组件、阵列基板及其制备方法、显示面板
CN101288171B (zh) 使用场屏蔽的象素性能改进
MY115602A (en) Mis transistor varactor device and osillator using same
US4686551A (en) MOS transistor
KR970706603A (ko) 투명 스위치 소자를 갖는 반도체 장치(Semiconductor device provided with transparent switching element)
KR950021480A (ko) 스위칭 소자 및 메모리 소자
US20200043871A1 (en) Array substrate and method for producing the same
CN108717939A (zh) 静电释放保护电路、阵列基板和显示装置
US5895958A (en) Input protection circuit for use in semiconductor device having an improved electrostatic breakdown voltage
US9515191B2 (en) Thin-film field effect transistor, driving method thereof, array substrate, display device, and electronic product
CN1034841C (zh) 带有公共基区的晶体管
KR900013652A (ko) 감소된 온 저항을 가진 soi구조의 고전압 반도체 장치
JPH01251755A (ja) サイリスタ
JPH01253275A (ja) サイリスタ
JP2002319629A (ja) 半導体装置
US11049944B2 (en) High voltage thin-film transistor and method of manufacturing the same
US6914296B2 (en) Controllable semiconductor component with multi-section control electrode
EP0420485A1 (en) MOS gated bipolar devices
WO2018116263A1 (en) Low power electrostatic discharge protection circuit
JPH02153570A (ja) 半導体素子
CN113366644A (zh) 阵列基板及其制作方法、显示面板

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20110428

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee