KR970030706A - 반도체 칩 패키지를 성형하는 제조금형 구조 및 이형핀 배치방법 - Google Patents

반도체 칩 패키지를 성형하는 제조금형 구조 및 이형핀 배치방법 Download PDF

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Publication number
KR970030706A
KR970030706A KR1019950040241A KR19950040241A KR970030706A KR 970030706 A KR970030706 A KR 970030706A KR 1019950040241 A KR1019950040241 A KR 1019950040241A KR 19950040241 A KR19950040241 A KR 19950040241A KR 970030706 A KR970030706 A KR 970030706A
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South Korea
Prior art keywords
semiconductor chip
chip package
release pin
manufacturing mold
molding
Prior art date
Application number
KR1019950040241A
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English (en)
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KR0176111B1 (ko
Inventor
노희선
최희국
조인식
김태형
Original Assignee
김광호
삼성전자 주식회사
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Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950040241A priority Critical patent/KR0176111B1/ko
Priority to JP8279602A priority patent/JP2801899B2/ja
Priority to DE19644813A priority patent/DE19644813C2/de
Priority to FR9613589A priority patent/FR2740720A1/fr
Publication of KR970030706A publication Critical patent/KR970030706A/ko
Application granted granted Critical
Publication of KR0176111B1 publication Critical patent/KR0176111B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

본 발명은 반도체 칩 패키지를 성형하는 제조금형에 관한 것으로서, 더욱 상세하게는 리드 프레임의 상부에 실장된 반도체 칩을 보호하기 위해 에폭시 성형수지로 패키징하기 위한 몰딩공정에 사용되는 제조금형으로써 상기 제조 금형에 다수의 이형핀을 설치하여 반도체 칩 패키지를 손상없이 이형시키기 위한 반도체 칩 패키지를 성형하는 제조금형 구조 및 이형핀 배치방법에 관한 것이다. 본 발명은, 반도체 칩 패키지를 성형하는 제조금형에 있어서, 상기 반도체 칩 패키지를 이형시키기 위해 드라이브 플레이트에 고정한 1번핀과 윗면 이형핀의 대칭되는 중심선상에 윗면 중간 이형핀을 삽입하여 구성함을 특징으로 하는 반도체 칩 패키지를 성형하는 제조금형 구조 및 이형핀 배치방법이다.
따라서, 본 방법에 따른 구조에 따르면, 반도체 칩 패키지를 안정되게 탈착시킴으로서 칩 크랙, 패키지 크랙을 방지하여 제품의 불량을 방지함과 동시에 품질을 향상시키고 생산성을 향상시킬 수 있는 이점(利點)이 있다.

Description

반도체 칩 패키지를 성형하는 제조금형 구조 및 이형핀 배치방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 3a도는 본 발명의 반도체 칩 패키지의 제조금형의 구조를 나타내는 단면도.

Claims (6)

  1. 반도체 칩 패키지를 성형하기 위한 상하부 금형으로 구성된 제조금형에 있어서, 상기 반도체 칩 패키지(102)를 이형시키기 위해 드라이브 플레이트(5)에 고정한 1번 핀(4)과 윗면 이형핀(9)의 대칭되는 중심선상에 윗면 중간 이형핀(12)을 삽입하여 구성함을 특징으로 하는 반도체 칩 패키지를 성형하는 제조금형 구조.
  2. 제 1항에 있어서, 상기 반도체 칩 패키지(102)를 이형하기 위해 드라이브 플레이트(1')에 고정한 밑면 이형핀(8)의 대칭되는 중앙에 밑면 중간 이형핀(13)을 고정시킴을 특징으로 하는 반도체 칩 패키지를 성형하는 제조금형 구조.
  3. 반도체 칩 패키지를 성형하기 위한 상하부 금형으로 구성된 제조금형에 있어서, 상기 반도체 칩 패키지(102)를 이형시키기 위해 상부 하우징(5)의 좌측상부에 1번핀(4) 및 우측 하부의 윗면 이형핀(9)의 대칭되는 중앙부분에 윗면 중간 이형핀(12)을 위치시키는 것을 특징으로 하는 반도체 칩 패키지를 제조하는 제조금형의 이형핀 배치방법.
  4. 제 3항에 있어서, 상기 반도체 칩 패키지(102)을 이형시키기 위해 하부 하우징(5')의 좌측 중단부에 위치한 밑면 이형핀(8) 및 우측 중단부에 위치한 밑면 이형핀(8)의 대칭되는 중앙부에 밑면 중간 이형핀(13)을 위치시키는 것을 특징으로 하는 반도체 칩 패키지를 제조하는 제조금형의 이형핀 배치방법.
  5. 제 3항에 있어서, 상기 반도체 칩 패키지(102)을 이형시키기 위해 하부 하우징(5')의 좌측 하부에 위치한 밑면 이형핀(8) 및 우측 상부에 위치한 밑면 이형핀(8)의 대칭되는 중앙부분에 밑면 중간 이형핀(13)을 위치시키는 것을 특징으로 하는 반도체 칩 패키지를 제조하는 제조금형의 이형핀 배치방법.
  6. 제 3항에 있어서, 상기 반도체 칩 패키지(102)을 이형시키기 위해 하부 하우징(5')의 좌측 상부에 위치한 밑면 이형핀(8) 및 우측 하부에 위치한 밑면 이형핀(8)의 대칭되는 중앙부에 밑면 중간 이형핀(13)을 위치시키는 것을 특징으로 하는 반도체 칩 패키지를 제조하는 제조금형의 이형핀 배치방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950040241A 1995-11-08 1995-11-08 반도체 칩 패키지를 성형하는 제조금형 구조 및 이형핀 배치방법 KR0176111B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019950040241A KR0176111B1 (ko) 1995-11-08 1995-11-08 반도체 칩 패키지를 성형하는 제조금형 구조 및 이형핀 배치방법
JP8279602A JP2801899B2 (ja) 1995-11-08 1996-10-22 半導体チップパッケージの保護胴体を形成するための金型
DE19644813A DE19644813C2 (de) 1995-11-08 1996-10-29 Formeinrichtung zum Herstellen eines Schutzgehäuses für einen Halbleiterchip
FR9613589A FR2740720A1 (fr) 1995-11-08 1996-11-07 Ensemble de moules pour corps protecteur de boitier de pastille semi-conductrice

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950040241A KR0176111B1 (ko) 1995-11-08 1995-11-08 반도체 칩 패키지를 성형하는 제조금형 구조 및 이형핀 배치방법

Publications (2)

Publication Number Publication Date
KR970030706A true KR970030706A (ko) 1997-06-26
KR0176111B1 KR0176111B1 (ko) 1999-03-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950040241A KR0176111B1 (ko) 1995-11-08 1995-11-08 반도체 칩 패키지를 성형하는 제조금형 구조 및 이형핀 배치방법

Country Status (4)

Country Link
JP (1) JP2801899B2 (ko)
KR (1) KR0176111B1 (ko)
DE (1) DE19644813C2 (ko)
FR (1) FR2740720A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101242441B1 (ko) * 2008-12-19 2013-03-12 세메스 주식회사 반도체소자 몰딩시스템용 금형장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60174242A (ja) * 1984-02-17 1985-09-07 Fuso Light Alloys Co Ltd ダイカスト製品の押出方法及び押出装置
US4575328A (en) * 1984-03-06 1986-03-11 Asm Fico Tooling, B.V. Automatic continuously cycleable molding apparatus
JPS60257528A (ja) * 1984-06-04 1985-12-19 Hitachi Ltd 半導体封止用金型
JPH0574827A (ja) * 1991-09-13 1993-03-26 Fujitsu Miyagi Electron:Kk 半導体装置の製造装置
JPH0679748A (ja) * 1992-09-02 1994-03-22 Toshiba Corp 樹脂封止型半導体装置の製造方法
JPH06302633A (ja) * 1993-04-13 1994-10-28 Fujitsu Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
DE19644813C2 (de) 1998-11-05
DE19644813A1 (de) 1997-05-15
JPH09181106A (ja) 1997-07-11
KR0176111B1 (ko) 1999-03-20
FR2740720A1 (fr) 1997-05-09
JP2801899B2 (ja) 1998-09-21

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