KR960705358A - 전자 패키지를 어셈블링하기 위한 방법(Method for assembling an electronic package) - Google Patents

전자 패키지를 어셈블링하기 위한 방법(Method for assembling an electronic package)

Info

Publication number
KR960705358A
KR960705358A KR1019960701656A KR19960701656A KR960705358A KR 960705358 A KR960705358 A KR 960705358A KR 1019960701656 A KR1019960701656 A KR 1019960701656A KR 19960701656 A KR19960701656 A KR 19960701656A KR 960705358 A KR960705358 A KR 960705358A
Authority
KR
South Korea
Prior art keywords
oxidation resistant
copper
intermediate layer
nickel
resistant layer
Prior art date
Application number
KR1019960701656A
Other languages
English (en)
Inventor
마후리카 디팩
파아사사라띠 아빈드
Original Assignee
폴 와인스타인
오린 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 폴 와인스타인, 오린 코포레이션 filed Critical 폴 와인스타인
Publication of KR960705358A publication Critical patent/KR960705358A/ko

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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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Abstract

리드 프레임(50)의 외부리드 단부(14)를 주석 또는 납댐피복 없이 외부 회로(36)에 납땜할 수 있는 전자 패키지(30)를 어셈블리하는 방법에 관한 것이다. 산화 저항층(44)은 패키지(30) 어셈블리에 앞서 리드프레임(50)상에 증착된다. 산화 저항층(44)은 외부리드(14)의 납댐(28)에 앞서 제거되어 깨끗하고 납댐(38)에 접합한 산화되지 않은 금속 표면(46)을 제공한다.

Description

전자 패키지를 어셈블링하기 위한 방법(Method for assembling an electronic package)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명의 제1실시예에 따라 제공된 리드프레임 리드를 나타내는 단면도를 도시한다.

Claims (14)

  1. 전자 패키지(30,70)를 어셈블링하기 위한 방법에 있어서, a)내부(12) 및 외부(14) 리드단을 가지는 리드 프레임(40)을 제공하는 단계; b) 산화 저항층(44)으로 상기 리드프레임(40)을 코팅하는 단계; c) 상기 내부 리드단(12)을 밀봉하는 단계; 및 d) 상기 외부 리드단(14)위에 놓여있는 상기 일부분의 산화 저항층(44)을 제거하는 단계를 포함하는 것을 특징으로 하는 방법.
  2. 제1항에 있어서, 상기 리드프레임(40)은 구리 또는 구리 합금으로 구성되는 것을 특징으로 하는 방법.
  3. 제3항에 있어서, 상기 방법은 외부 회로(36)에 외부 리드단(14) 없이 상기 산화 저항층을 결합하는 단계 e)를 포함되는 것을 특징으로 하는 방법.
  4. 제1항에 있어서, 단계 f)는 단계 a) 및 b) 사이에 포함되고, 상기 단계 f)는 중간층(52)으로 상기 적어도 일부분의 리드프레임(40)을 코팅하는 것을 특징으로 하는 방법.
  5. 제4항에 있어서, 결합물(38)을 수용하기 위하여 적용된 상기 외부 리드단(14)은 상기 중간층(52)이 없는 것을 특징으로 하는 방법.
  6. 제5항에 있어서, 상기 리드프레임(40)은 구리 또는 구리 합금으로 구성되고, 상기 중간층(52)은 니켈 또는 니켈 합금이고 상기 산화 저항층(44)은 크롬 및 아연으로 코드포자이트되는 것을 특징으로 하는 방법.
  7. 제4항에 있어서, 상기 리드프레임(40)은 구리 또는 구리 베이스합금으로 구성되고, 상기 중간층(52)은 주석 도는 주석 합금이고 상기 산화 저항층(44)은 크롬 및 아연으로 코드포자이트되는 것을 특징으로 하는 방법.
  8. 제4항에 있어서, 단계 h)는 단계 f) 및 b) 사이에 삽입되고, 단계 h)는 결합 패드(54)를 가지는 와이어 본드(24)를 수용하기 위하여 적용된 상기 내부 리드(12)의 적어도 그 부분을 코팅하는 것을 특징으로 하는 방법.
  9. 제8항에 있어서, 상기 결합 패드(54)는 은, 알루미늄, 니켈 및 그것의 합금으로 된 그룹으로부터 선택되는 것을 특징으로 하는 방법.
  10. 전자 패키지(30,70)를 위한 리드프레임(40)에 있어서, 전기 전도 기판(42), 산화 저항 외부층(44), 및 상기 전기 전도 기판(42)과 상기 산화 저항층(44) 사이에 배치된 중간층(52)을 포함하고, 상기 중간층(52)은 외부회로(36)에 결합되기 적합하게 상기 전기 전도 기판(42)의 부분(46)으로부터는 존재하지 않는 것을 특징으로 하는 리드 프레임.
  11. 제10항에 있어서, 결합 패드(54)는 와이어 본드(24)를 수용하기 적합한 상기 전기 전도 기판(42)의 적어도 한 부분상의 상기 산화 저항층(44) 및 상기 중간층(52) 사이에 배치되는 것을 특징으로 하는 리드 프레임.
  12. 제11항에 있어서, 상기 산화 저항층(44)은 실질적으로 결합 패드(54)에서부터는 존재하지 않는 것을 특징으로 하는 리드 프레임.
  13. 제10항에 있어서, 상기 전기 전도 기판(42)은 구리 또는 구리 베이스합금으로 선택되고, 상기 중간층(52)은 니켈 또는 니켈합금으로 구성되고, 상기 산화 저항층(44)은 크롬 및 아연으로 코드포자이트되는 것을 특징으로 하는 리드 프레임.
  14. 제10항에 있어서, 상기 전기 전도 기판(42)은 구리 또는 구리 베이스합금으로 선택되고, 상기 중간층(52)은 니켈 또는 니켈합금으로 선택되고, 상기 결합패드(54)는 알루미늄, 은, 니켈 및 그것의 합금의 그룹으로부터 선택되고, 산화 저항층(44)은 크롬 및 아연으로 코드포자이트되는 것을 특징으로 하는 리드 프레임.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960701656A 1993-09-27 1994-09-16 전자 패키지를 어셈블링하기 위한 방법(Method for assembling an electronic package) KR960705358A (ko)

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US08/126,862 US5540378A (en) 1993-09-27 1993-09-27 Method for the assembly of an electronic package
US126,862 1993-09-27
PCT/US1994/010439 WO1995009437A1 (en) 1993-09-27 1994-09-16 Method for assembling an electronic package

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KR960705358A true KR960705358A (ko) 1996-10-09

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EP (1) EP0721660A4 (ko)
JP (1) JPH09503102A (ko)
KR (1) KR960705358A (ko)
AU (1) AU7797294A (ko)
TW (1) TW295713B (ko)
WO (1) WO1995009437A1 (ko)

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Publication number Publication date
EP0721660A4 (en) 1997-10-29
US5540378A (en) 1996-07-30
WO1995009437A1 (en) 1995-04-06
AU7797294A (en) 1995-04-18
EP0721660A1 (en) 1996-07-17
JPH09503102A (ja) 1997-03-25
TW295713B (ko) 1997-01-11
US5563442A (en) 1996-10-08

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