TW295713B - - Google Patents

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Publication number
TW295713B
TW295713B TW83108889A TW83108889A TW295713B TW 295713 B TW295713 B TW 295713B TW 83108889 A TW83108889 A TW 83108889A TW 83108889 A TW83108889 A TW 83108889A TW 295713 B TW295713 B TW 295713B
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TW
Taiwan
Prior art keywords
lead
layer
item
patent application
alloy
Prior art date
Application number
TW83108889A
Other languages
English (en)
Original Assignee
Olin Corp
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Publication date
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Application granted granted Critical
Publication of TW295713B publication Critical patent/TW295713B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
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Description

二- 第8 3 1 〇 8 8 8 9號專利j
m m m iLM 五、發明説明（） (請先閱讀背面之注意事項存填寫本頁) 本發明係關於一種製造電子包裝件之方法，更明確而言 ，將一引線框架覆K 一抗氧化層，然後除去抗氧化層之覆 蓋外引線末端之部份，產生一可焊接之表面。 微《子電路，諸如矽半導體積體電路及混合型微電子電 路，需要一種將電路包圍並提供電互相連接至外電路之包 裝件。引線框架為電互相連接之常用裝置。引線框架由一 導電金羼條形成許多引線所形成。引線框架之諸内引線末 端自一側或數側接近積體電路裝置，並藉细粘结線電互相 連接至該装置。引線框架之諸外引線末端電互相連接至外 電路，諸如印刷電路板。 為保護該裝置Μ防水分及機械性質損壞，内引線末端及 装置均予以封裝。封裝可為藉模製樹脂包圍内引線及積體 電路装置。或則，個別之底座及罩蓋姐件界定一腔，內引 線及積體電路裝置予Μ封裝在該腔内。 需要內引線末端之良好粘著至模製樹脂，Μ防止水分沿 引線進入。濕氣可能腐蝕粘結線及積體電路装置。另外， 濕氣集聚在包裝件内。在加熱時，濕氣膨脹如蒸汽.，脹大 並可能使包裝破裂。此現象稱為”爆玉米花效應”。 經濟部中央標準局員工消費合作社印製 利用個別之底座及罩蓋姐件時，Μ熱固環氧樹脂或低溫 密封玻璃將引線框架之中間部份接合至底座及罩蓋。需要 良好之粘著Μ防止水分進入。 引線框架之諸外引線末端予以焊接至外電路，諸如印刷 電路板。銅或銅合金引線框架之此等外引線為可藉除去包 裝件姐裝時所形成之氧化銅而焊接。浸於稀釋之酸中而藉 83.3.1〇,〇〇0 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部中央標隼局貝工消費合作社印製 A7 ____B7 五、發明説明（21 ~ Μ除去氧化铜。然而，氧化飼對铜或铜合金底座金屬钻著 不良，並提供引線中間部之不良粘著至横製樹脂。 Μ粘性促進化合物處理引線框架，獲得較佳之效果，但 假設此粘性促進化合物必須對可焊接性無不利之影響。 供引線框架用之代表性粘性促進劑包括金屬，諸如鎳， 錫，鉻，鉬，絕及其合金’如授予Crane等人之美國專利 4、，889,449號中所述者°適當之聚合物塗料說明於授予 «·
Mahu 1 i kar等人之美國專利5，1 22 , 858號，並包括苯並三 唑及乙烯醋酸G烯酯。 .搏常用以被覆引線。縛對聚化物提供抗氧化塗層及良好 之拈著。然而，在包装件姐裝所用之高溫導致在外引線末 端形成氧化縛曆。氧化_層為不可焊接，必須使用強邐原 、 酸諸如鹽酸予以除去。鹽酸能破瓌横製樹脂及其他包裝姐件 ，故不宜使用。 即使無氧化物’辣也不易被習知用以將®子包裝件裝至 印刷電路板之鉛錫焊料沾濕。鎳被瑷之引線上通常予以被 覆錫或錫鉛合金，以增進可焊接性。必須小心保證適當被 覆每一引線，同時防止間開很近之引線間搭接。另外’用 Μ敷著錫或錫鉛合金之解液能損壞用於包裝件製造之聚合-物。因此，必須準確控制在電鍍槽中包裝件進入之深度。丨 <因之，本發明之目的為提供一種姐装電子包装件之方法 ，其中引線框架予Κ被覆—種抗氧化材料，其增進對聚合 物之粘著，並可除去Μ供直接焊接至引線框架基片。本發 明之特色為抗氧化層包含鋅及絡，而梓路比Μ重量§十超過 -5 - 本紙浪尺度適用中國國家揉準（CNS ) Α4说格（210Χ297公釐） I I I I 裝 訂 線 (請先Μ讀背面之注意事項再填寫本頁) 經濟部中央樣準局貞工消費合作社印製 2C57i3 A7 _B7 _ 五、發明説明（3 ) 約4 : 1 。本發明之另一特色為在引線框架之内引線封装前 施用抗氧化層*並在焊接前除去。 本發明之優點為該姐装方法增進引線框架對電子包装姐 件之粘著•並提供改進之可焊接性。另一優點為該方法對 諸包装組件之完整性無不利之影響。本發明之又一優點為 無需後封裝電鍍步驟。 ，根據本發明，提供一種製造電子包裝件之方法。該方法 包含下列步驟： (⑴提出一有内外引線末端之引線框架； (b>以抗氧化層被覆引線框架； 〇封装引線框架之諸内引線末端；Μ及 (d)除去抗氧化層之覆蓋外引線末端之部份。 ' 由以下之詳细說明及附圖，將會更明白上述諸目的，特 色及優點。 圖1 A -1 C Μ剖面圖示如自先前技藝所知之電子包装件姐 裝方法。 圖2以剖面圖示根據本發明第一實施例所製成之引線框 架引線。 圖3 Μ剖面圖示引線框架之内引線末端封装在模製樹脂 __ 内。. ! 圖4 W剖面圖示製備供焊接之外引線末端。 画5 Μ剖面圖示根據本發明第二實施例所製成之引線框 架引線。 圖6以剖面圖示外引線焊接至印刷電路板。 -6 - 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） 訂 線 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央橾準局負工消费合作社印褽 A7 _____B7_ 五、發明説明（4 ) 圖7以剖面圖示根據本發明第三實施例所製成之引線框 架引線。 圖8以剖面圖示一利用本發明之引線框架之半導體包裝 件。 圖1A至1C Μ剖面圖示一種如自先前技藝所知，製造電子 包裝件3 0之方法。一引線框架10有數内引線末端1 2及數外 引線末端1 4。引線末端1 2自一側或數側接近積體電路装置 16。一由與引線框架10相同之材枓所形成，位於中央之模 具附著片18可支撐裝置16。引線框架10予Μ被覆抗氧化之 鎳層20。在内引線末端1 2形成銀或鋁條22，Μ方便線粘結 24之拈著。小直徑铜，金或鋁線之線粘結24將装置16與引 線框架10電互相連接。 ' 如圖1Β中所示，諸内引線末端〗2及積體電路装置16予封 裝在聚合物樹脂26中，或在個別之底座與罩蓋姐件（未示 )之間。聚合物樹脂之代表性模製循環為175°C約30分鐘 。在模製循環期間，抗氧化層2 0之覆蓋外引線末端1 4之部 份便行氧化。在焊接諸外引線末端1 4前，必須將氧化鎳除 去。 除去氧化鎳一般為藉浸於鹽酸中，Μ使氧化鎳遨原為元 素鎳。鹽酸也有害地腐蝕聚合物樹脂26。甚至在氧化鎳除丨 掉後，金靨辣層也不具有供電子包裝件應用之足夠可焊接 性。因此，如圖1 C中所示，抗氧化層2 0予Μ被覆一可焊接 層2 8。可焊接層2 8為任何適當金靨諸如錫，鉛，鉛錫合金 ，金或銀。可藉電解手段，無電手段，或浸入熔融金匾槽 -7 - 本紙張尺度遑用中國國家標準（CNS ) Α4规格（210Χ297公釐） 裝 訂 線 (讀先聞讀背面之注意事項再填寫本頁) 經濟部中央橾準局員工消费合作社印製 A7 _B7 五、發明説明（5 ) 塗敷可焊接層2 8。供澱積法使用之化學溶液及用於浸入法 之熱量，均可能損壞聚合物樹脂，而必須在應用時極端小 心。另外，留在抗氧化層20上之任何氧化物都會在可焊接 層28造成空隙或針孔，専致不足夠之焊接或未來之腐蝕部 位。 在澱積可焊接層2 8後，使包裝姐合件3 0與印刷電路板 3.2對準。印刷電路32有一電介質支持層34有金屬電路痕跡 層36·合至電介質基Η之一面或兩面。諸如藉網板印刷將 一種焊料3 8 (通常為鉛錫合金）敷著於金屬電路痕跡3 6。 然後使包裝姐合件3 0位於致使焊料3 8接觸可焊接層2 8。然 後將印刷電路板3 2 /包裝姐合件3 0加熱至溫度足Μ使焊料 3 8熔化，使包裝姐合件30熔合至印刷電路板32。 ' 本發明之方法大為減少製造電子包装件所需之步驟，並 減低損壞聚合物樹脂及包裝件其他姐件之危險。圖2 Κ剖 面圖示一根據本發明之方法所處理之引線。該方法提供一 引線框架之引線40，有一金靥基片42形成為許多引線。金 鼷基Η42可為任何適當導電材料，諸如銅，銅合金及鐵鎳 合金。特別遇合者為铜合金C 11 0 (電解高韌铜，額定組成 以重量計為99.90¾銅及最多0.05%氧）*及C7025 (額定組 成Μ重量計為3 . 0 %鎳，0 . 6 5 % δ夕，0 . 1 5 %鎂，其餘為銅）。| 弓L線40有一内引線末端12及一外引線末端14。内引線末端 1 2為供以後電互相連接至積體電路裝置，而外引線末端 1 4為供Μ後焊接至外電路。引線40予Μ被覆一抗氧化層 44，其粘附至用於電子包装姐合件之聚合物樹脂，並可藉 -8 - 本紙張尺度逋用中國國家#準（CNS ) Α4说格（210X297公釐） ---------私衣------ΐτ------^ (請先閲讀背面之注意事項再填寫本頁) A7 ^05713 _B7 五、發明説明（6 ) 一種對包装姐件無有害影響之方法除去。較佳之抗氧化層 44為鋅及鋅合金。一種特別適合之鋅合金包括鋅及絡，鋅 絡比以重量計超過約4 : 1 。此種塗層可如授予L i η等人之 美國專利5 , 0 9 8 , 7 9 6號予Μ電解同時澱積。將引線40浸於 在具有鹼性出值之水溶液中含0.1-100克/公升詻Ή離子 及0 . 0 7 - 7克/公升鋅離子之電解液中。較佳之鹽用以提供 鉻V I離子者包括重絡酸钠，提供鋅離子者包括氧化鋅。將 電壓加至引線，而Μ引線作為陰極，時間足Κ提供有效厚 度之鋅/鉻抗氧化層。有效厚度為防止金屬基片42氧化， 而同時增進粘著並容易在硫酸之稀釋（約為4體積百分比 )水溶液中除去之厚度。較佳厚度約為1 0埃至0 . 1微米| 最佳厚度約為1 〇埃至1 〇 〇埃。 ' 如圖3中所示，其次將内引線末端1 2封裝在諸如聚合物 樹脂26内。拈著係藉聚合物樹脂26與抗氧化層44間之化學 粘结。因此，如陰影所示*抗氧化層4 4之接觸聚合物樹脂 2 6之部份不易藉浸於稀釋之硫酸中除去。外引線部份1 4由 抗氧化層44予Κ保護，在聚合物模製時不發生基底金屬氧 化0 如圖4之剖面圖中所示，然後形成外引線部份1 4，彎成 _ 希望之形狀，並且藉任何不影響其他電子包裝姐件之手段丨 &外引線部份1 4除去抗氧化層44之一部份。至於較佳實皰 例之鉾鉻合金塗層，將整個包装件浸於以容積計4%含水硫 酸溶液中約5秒至6 0秒。然後將露出之金屬表面4 6焊接至 印刷電路板。因為金靥表面46容易氧化，故應快速開始焊 -9 - 本紙張尺度適用中國國家梯準（CNS ) Α4说格（210X297公羞） ---------扣衣------1Τ------i ' > (請先閲讀背面之注意事項再填寫本頁) 經濟部中央樣準局員工消費合作社印製 經濟部中央梂準局員工消費合作杜印製 A7 B7 五、發明説明（7 ) 接*通常約在除去抗氧化層後2 4小時以内。可利用任何適 當之低熔化溫度焊料，諸如鋁/錫合金，可有可無助焊劑 〇 圖5 Μ剖面圖示根據本發明第二實施例之引線框架之引 線5 0。和前述實施例一樣，引線5 0有一金屬基片4 2及一抗 氧化層4 4。一中間層5 2配置於金屬基Η 42之至少一部份與 抗氧化層4 4之間。中間層5 2可為較金屬基Η 4 2抗氧化之任 何材料，並可為金屬，合金，金屬化合物或聚合物。鎳及 _合金為最佳。較佳為，除了外引線末端1 4之將會接觸焊 料之部份外，中間層5 2被覆金龎基Η 4 2之所有部份。除去 抗氧化層44時，便露出金屬基Η42之無氧化物部份供焊接 。引線之其餘部份受到中間層5 2保護| Μ防在焊接時及其 ' 後氧化。 中間層5 2為縛時，厚度約1至5微米便有效防止下面金屬 基片之氧化。較佳為，_層5 2之厚度約為2至4微米。此鎳 層可藉任何適當手段諸如電解予以澱積。至於SI合金基片 ，一種適當之電解液為一種含263-450克/公斤氨基磺酸 縛及3 0 - 4 5克/公斤硼酸，pH值3 - 5之水溶液。將引線5 0浸 於一含_有電解液之電解槽中，並Μ電流密度2.5-30安培/ _ 平方分米加上電壓，而以引線為陰極，時間足Μ澱積有效丨 厚:度之中間層52。 為增進線粘结之粘著|特別是中間層5 2為非金屬時，在 内引線末端12上形成一粘结片54。粘结片54為一種金屬諸 如銀，鋁•鎳，或其合金。如果中間層5 2不導電，一導電 - 10 - 本紙張尺度適用中國國家梂準（CNS ) Α4規格（2Ϊ0Χ297公釐） ---------1------ΐτ------,il (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作杜印製 A7 B7 五、發明説明（8 ) 通路56將坫结H54與金屬基片42電互相連接。較佳為，粘 结H54為銀，厚度約0.5至4微米。銀之抗氧化性高，因此 抗氧化層不必被覆内引線末端1 2之被粘结片所覆蓋之部份 。由於大多數線粘结技術為直接粘结至銀’故可能較佳為 不以抗氧化層被覆粘结片。 圖6以剖面圖示利用本發明之引線5 0 *藉焊料3 8將電子 包装組合件3 0粘结至印刷電路板3 2。焊料3 8將外引線末端 1 4之無中間層5 2之部份拈结至電路痕跡3 6。 圖7 Μ剖面圖示一根據本發明之第三萁胨例。中間層 52由一種可焊接金靨材料諸如縛，錫及其合金所形成。中 間層5 2被覆引線6 0之所有表面。和前述諸實施例一樣，緊 接在焊接之前除去抗氧化層4 4。直接焊接至中間層。 ' 如圖8中之剖面圖所示，本發明之方法同樣適用於包括 個別底座72及罩蓋74組件之電子包装件70。引線40有一在 最初以抗氧化層44被覆之金屬基片42。引線40藉粘结劑 .7 6配置在底座姐件7 2與罩蓋姐件7 4之間，並粘结至此二姐 件。粘结劑可為任何適當不導電材料，諸如聚合物粘合劑 或密封玻璃。粘结劑76較佳為熱固環氧樹脂。引線40粘结 至粘结_劑7 6時，一種化學钻结使抗氧化層4 4之接觸粘结劑 _ 76之部份基本上與稀硫酸不起反應。因此，包装件70浸於| 稀硫鹽中時，僅自外引線末端1 4除掉抗氧化層44。 可由任何適當材料，包括聚合物，陶瓷及金屬，形成底 座姐件72及罩蓋組件74。為增進自積體電路裝置16除熱， 低座姐件72較佳為由銅•鋁或其合金形成。最佳為，底座 -11 - 本紙張尺度適用中國國家標準（CNS ) A4规格（210X297公釐） 訂 線 (請先閲讀背面之注意事項再t寫本頁) 經濟部中央樣準局員工消費合作社印製 A7 B7 五、發明説明（9 ) 組件72及罩蓋姐件74均由經陽極處理Μ增強抗蝕性之鋁合 金形成。 莨 例 下列S例示本發明方法之好處。藉上述方法Μ鉻及鉾之 抗氧化層被覆飼合金C 7 0 2 5引線框架。樣品然後在空氣中 在1901 接受熱處理90分鐘。然後浸於在室溫之5重量百 分比鹽酸3 0秒，藉以除去抗氧化塗層。然後將樣品沈浸於 鉛錫合金焊料槽，並測量焊料所覆蓋表面之百分比，藉以 估計可焊接性。未接受根據本發明之方法處理之C7025樣 品呈現少於5 0 %焊料覆蓋率。接受根據本發明之方法處理 者圼琨95-99%焊料覆蓋率。 ‘ 雖本發明羥就有引線之包装件諸如雙排直插式包裝件或 方形平直包装加Κ說明，但該方法同樣適用於需在包装件 姐裝後焊接至印刷電路板之其他類型電子包装件。本發明 之方法所可改進之其他包装件包括無引線晶片載具，多晶 片模件，接腳格柵陣列包裝件及球形格棚陣列包装件。 根據本發明顯然業已提供一種完全滿足上文所述諸目的 *特色_及優點，用於製造電子包裝件之方法。雖然本發明-經配合其特定實施例予以說明，但精於此項技藝者依照上（ 述銳明將會明白很多替代，修改及變化。因之*所有此等 替代，修改及變化均意為在後附申請專利範圍之精神及概 括範圍Μ内。 -12 - 本紙張尺度適用中國國家橾準（CNS ) Α4洗格（210X297公釐） I I 裝 訂 線 (請先W讀背面之注意事項再t寫本頁)

Claims (1)

  1. 說明i
    A8 B8 C8 D8 六、申請專利範圍 1 一種製造電子包裝件之方法，其特徵為下列步驟： ⑻提供一有內及外引線末端之引線框架； (請先閲讀背面之注意事項再填寫本頁) ⑸K抗氧化層被覆引線框架； ⑵封裝内引線末端；K及 叻除去抗氧化層之覆蓋外引線末端之部份。 2 根據申請專利範圍第1項之方法，其中該引線框架予以 選擇為銅或銅合金。 a 根據申請專利範圍第1項之方法，其中包括步驟（e)將 該無抗氧化層之外引線末端焊接至外電路。 4 根據申請專利範圍第1項之方法，其中在步驟（3)與 (b)之間包括一步驟（f)，步驟（f)包含以一中間層被覆 引線框架之至少一部份。 5. 根據申請專利範圍第4項之方法，其中外引線末端之適 於容納焊料之部份為實際無中間層。 6. 根據申請專利範圍第4項之方法，其中該引線框架選擇 為飼或飼合金，中間層為鎳或||合金，及抗氧化層為同 時澱積之鉻及鋅。 7. 根據申請專利範圍第5項之方法，其中該引線框架選擇 為銅或銅合金，中間層為錫或錫合金，及抗氧化層為同 時澱積之絡及鋅。 經濟部中央標準局員工消費合作社印製 8. 根據申請專利範圍第4項之方法，其中一步驟（h )插入 步驟（f )與（b )之間，步驟（h )包含Μ粘结片被覆内引線 末端之至少適於容納線粘结之部份。 9. 根據申請專利範圍第8項之方法，其中該粘结片為選自 -1 - 本纸張又度適用中國國家標準（CNS)A4規格（210 X297公釐） 申請專利範圍 11. 12 13. 14 銀•絕 一種供 一導電 一抗氧 一中間 適於焊 根據申 中間層 線粘结 根據申 無抗氧 根據申 擇為銅 抗氧化 根據申 擇為銅 片為選 含同時 ，鎳及其合 電子包装件 基片； 化外層；Μ 層配置在導 接至外電路 請專利範圍 與抗氧化層 之部份。 請專利範圍 化層。 請專利範圍 或銅基礎合 層包含同時 請專利範圍 或銅基礎合 自鋁，銀， 澱積之絡及 A8 B8 C8 D8 金之類姐。 之引線框架， 及 電基片與抗氧 之部份實際無 % 第10項之引線 之間配置在導 其特激為：. 化層之間，導電基片之 該中間廇。 框架，其中一粘結片在 電基片之至少適於容納 第11項之引線框架，其中粘结片賁際 第10項之引線 金，中間層選 澱積之鉻及鋅 第10項之引線 金，中間層選 鎳及其合金之 鋅。 框架，其中導電基片選 擇為鎳或鎳合金，以及 〇 框架，其中導電基片選 擇為_或鍊合金，粘结 類姐，Μ及抗氧化廇包 (請先閱讀背面之法意事項真塡寫本頁) 装 訂 線 經濟部中央標準局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（2丨Ο Χ 297公笼）
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AU7797294A (en) 1995-04-18
EP0721660A4 (en) 1997-10-29
EP0721660A1 (en) 1996-07-17
KR960705358A (ko) 1996-10-09
US5540378A (en) 1996-07-30
WO1995009437A1 (en) 1995-04-06
US5563442A (en) 1996-10-08

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