JP4238235B2 - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP4238235B2 JP4238235B2 JP2005193242A JP2005193242A JP4238235B2 JP 4238235 B2 JP4238235 B2 JP 4238235B2 JP 2005193242 A JP2005193242 A JP 2005193242A JP 2005193242 A JP2005193242 A JP 2005193242A JP 4238235 B2 JP4238235 B2 JP 4238235B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- plating layer
- bonding pad
- layer
- electrolytic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
2・・・・配線導体
3・・・・半田接合パッド
3a・・・無電解銅めっき層
3b・・・電解銅めっき層
4・・・・耐半田樹脂層
5・・・・電解ニッケルめっき層
6・・・・電解金めっき層
7・・・・黒化膜
11・・・第一のめっきレジスト層
11a・・第一の開口部
12・・・第二のめっきレジスト層
12a・・第二の開口部
Claims (2)
- 内部および表面の少なくとも一方に配線導体を有する絶縁基板と、該絶縁基板上に形成され、上面の中央部と上面の外周部との間に該外周部側が低くなる段差を有する銅からなる半田接合パッドと、前記絶縁基板上に、前記半田接合パッドの側面と前記外周部と前記段差の側面とを覆うとともに前記中央部に達しないように形成された耐半田樹脂層と、前記中央部のみに順次被着された電解ニッケルめっき層および金めっき層と、前記耐半田樹脂層と密着した状態で前記半田接合パッドの側面から前記外周部にかけて形成された黒化膜とを具備してなる配線基板。
- 前記絶縁基板の表面に形成された前記半田接合パッドに、めっき導通用の配線が形成されていないことを特徴とする請求項1に記載の配線基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005193242A JP4238235B2 (ja) | 2005-07-01 | 2005-07-01 | 配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005193242A JP4238235B2 (ja) | 2005-07-01 | 2005-07-01 | 配線基板 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002304718A Division JP4142934B2 (ja) | 2002-10-18 | 2002-10-18 | 配線基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005294869A JP2005294869A (ja) | 2005-10-20 |
JP4238235B2 true JP4238235B2 (ja) | 2009-03-18 |
Family
ID=35327377
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005193242A Expired - Fee Related JP4238235B2 (ja) | 2005-07-01 | 2005-07-01 | 配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4238235B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5705565B2 (ja) * | 2011-01-28 | 2015-04-22 | 京セラ株式会社 | 実装構造体 |
-
2005
- 2005-07-01 JP JP2005193242A patent/JP4238235B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005294869A (ja) | 2005-10-20 |
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