KR960039208A - 반도체 소자의 게이트산화막 형성방법 - Google Patents
반도체 소자의 게이트산화막 형성방법 Download PDFInfo
- Publication number
- KR960039208A KR960039208A KR1019950007842A KR19950007842A KR960039208A KR 960039208 A KR960039208 A KR 960039208A KR 1019950007842 A KR1019950007842 A KR 1019950007842A KR 19950007842 A KR19950007842 A KR 19950007842A KR 960039208 A KR960039208 A KR 960039208A
- Authority
- KR
- South Korea
- Prior art keywords
- oxide film
- gas atmosphere
- oxidation process
- semiconductor device
- temperature
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000004065 semiconductor Substances 0.000 title claims abstract description 6
- 230000015572 biosynthetic process Effects 0.000 title 1
- 230000003647 oxidation Effects 0.000 claims abstract 7
- 238000007254 oxidation reaction Methods 0.000 claims abstract 7
- 229910052710 silicon Inorganic materials 0.000 claims abstract 3
- 239000010703 silicon Substances 0.000 claims abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000007789 gas Substances 0.000 abstract 2
- 235000014653 Carica parviflora Nutrition 0.000 abstract 1
- 241000243321 Cnidaria Species 0.000 abstract 1
- 230000015556 catabolic process Effects 0.000 abstract 1
- 150000004767 nitrides Chemical class 0.000 abstract 1
- 125000004433 nitrogen atom Chemical group N* 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28202—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation in a nitrogen-containing ambient, e.g. nitride deposition, growth, oxynitridation, NH3 nitridation, N2O oxidation, thermal nitridation, RTN, plasma nitridation, RPN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
- H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
- H01L21/02236—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
- H01L21/02238—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/518—Insulating materials associated therewith the insulating material containing nitrogen, e.g. nitride, oxynitride, nitrogen-doped material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Formation Of Insulating Films (AREA)
Abstract
본 발명은 반도체 소자의 게이트산화막 형성방법에 관한 것으로, 산화막의 균일도 향상시키기 위하여 N2O 및 NH3가스분위기하에서 제1산화공정을 실시한 후 N2O가스분위기하에서 제2산화공정을 실시하므로써 게이트 산호막의 균일도를 향상시키며 산화막과 실리콘의 계면에 질소원자가 분포하는 질화산화막을 형성하여 내압특성 및 신뢰도를 향상시킬 수 있도록 한 반도체 소자의 게이트산화막 형성방법에 관한 것이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명에 따른 반도체 소자의 게이트산화막 형성방법 설명하기 위한 개념도, 제4도는 제3도를 설명하기 위한 단면도.
Claims (5)
- 반도체 소자의 게이트산화막 형성방법에 있어서, 세정이 완료된 실리콘기판을 반응로내부로 보트-인시킨후 온도를 상승시키기 위한 램프-업공정을 실시하는 단계와, 상기 단계로부터 상승된 온도, N2O 및 NH3가스 분위기하에서 소정 시간동안 제1산화공정을 실시하는 단계와, 상기 단계로부터 N2O가스분위기하에서 소정시간동안 제2산화공정을 실시하는 단계와, 상기 단계료부터 N2가스분위기하에서 열처리공정을 실시한 후 상기반응로 내의 온도를 하강시키기 위한 램프-다운공정을 실시하고 상기 실리콘기판을 반응로 외부로 보트-이웃시키는 단계로 이루어지는 것을 특징으로 하는 반도체 소자의 게이트산화막 형성방법.
- 제1항에 있어서, 상기 보트-인 및 보트-아웃시 반응로의 온도는 600 내지 700℃이며, N2가스분위기인 것을 특징으로 하는 반도체 소자의 게이트산화막 형성방법.
- 제1항에 있어서, 상기 램프-업공정시 반응로의 온도는 850 내지 950℃로 상승되는 것을 특징으로 하는 반도체 소자의 게이트산화막 형성방법.
- 제1항에 있어서, 상기 제1산화공정은 5 내지 15분간 실시되며, 상기 제2산화공정은 30 내지 100분동안 실시되는 것을 특징으로 하는 반도체 소자의 게이트산화막 형성방법.
- 제1 또는 제4항에 있어서, 상기 제2산화공정은 N2O가스 대신 O2가스분위기하에서 실시되는 것을 특징으로 하는 반도체 소자의 게이트산화막 형성방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950007842A KR100305204B1 (ko) | 1995-04-04 | 1995-04-04 | 반도체소자의게이트산화막형성방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950007842A KR100305204B1 (ko) | 1995-04-04 | 1995-04-04 | 반도체소자의게이트산화막형성방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960039208A true KR960039208A (ko) | 1996-11-21 |
KR100305204B1 KR100305204B1 (ko) | 2001-11-30 |
Family
ID=37530030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950007842A KR100305204B1 (ko) | 1995-04-04 | 1995-04-04 | 반도체소자의게이트산화막형성방법 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100305204B1 (ko) |
-
1995
- 1995-04-04 KR KR1019950007842A patent/KR100305204B1/ko not_active IP Right Cessation
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Publication number | Publication date |
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KR100305204B1 (ko) | 2001-11-30 |
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