KR960030328A - 반도체 장치의 금속층 형성방법 - Google Patents

반도체 장치의 금속층 형성방법 Download PDF

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Publication number
KR960030328A
KR960030328A KR1019950000133A KR19950000133A KR960030328A KR 960030328 A KR960030328 A KR 960030328A KR 1019950000133 A KR1019950000133 A KR 1019950000133A KR 19950000133 A KR19950000133 A KR 19950000133A KR 960030328 A KR960030328 A KR 960030328A
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KR
South Korea
Prior art keywords
conductive film
forming
semiconductor device
metal layer
melting point
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Application number
KR1019950000133A
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English (en)
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KR0161116B1 (ko
Inventor
전영권
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문정환
Lg 반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 문정환, Lg 반도체주식회사 filed Critical 문정환
Priority to KR1019950000133A priority Critical patent/KR0161116B1/ko
Priority to JP07231356A priority patent/JP3113800B2/ja
Priority to US08/583,320 priority patent/US5880023A/en
Publication of KR960030328A publication Critical patent/KR960030328A/ko
Application granted granted Critical
Publication of KR0161116B1 publication Critical patent/KR0161116B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/7684—Smoothing; Planarisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material

Abstract

본 발명은 반도체 장치의 금속층 형성방법으로서, 기판위에 제1전도성막을 형성하는 공정과, 제1전도성막보다 저융점의 제2전도성막을 제1전도성막위에 형성하는 공정과, 제2전도성막을 용융시키는 공정을 포함하여 이루어진다.
제1전도성막은 화학기상증착법으로 형성하고, 제2전도성막은 제1전도성막에 불순물이온을 주입하여 형성하거나, 제1전도성막위에 제2전도성막을 화학기상증착방법으로 형성하면 된다. 화학기상증착방법은 스퍼터링 방법도 포함한다.
또 제1전도성막은 A1 또는 Al 합금을 이용하고, 불순물로서는 Si, Cu, Ga, Gc, Pd, Sn, V등을 이용하면되며, 제2전도성막이 제1전도성막보다 10℃ 이상 낮은 융점을 갖도록 한다.

Description

반도체 장치의 금속층 형성방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 A, B, C는 본 발명의 금속층 형성방법의 일실시예를 설명하기 위한 공정 단계별 콘택부위의 일부 단면도이다.

Claims (11)

  1. 반도체 장치의 금속층 형성방법에 있어서, 기판위에 제1전도성막을 형성하는 공정과, 제1전도성막 보다저융점의 제2전도성막을 제1전도성막위에 형성하는 공정과, 제2전도성막 만을 용융시키는 공정을 포함하여 이루어지는 반도체 장치의 금속층 형성방법.
  2. 제1항에 있어서, 제1전도성막을 형성하는 공정은 화학기상증착법을 적용하는 것이 특징인 반도체 장치의 금속층 형성방법.
  3. 제1항에 있어서, 제1전도성막은 Al 또는 Al 합금으로 형성된 것이 특징인 반도체 장치의 금속층 형성방법.
  4. 제1항에 있어서, 제2전도성막을 형성하는 공정은 제1전도성막에 불순물이온을 주입하는 공정을 포함하는 것이 특징인 반도체 장치의 금속층 형성방법.
  5. 제4항에 있어서, 제1전도성막은 Al 또는 Al 합금으로 형성된 것이고, 상기 불순물이온으로서는 Si, Cu, Ga, Ge, Pd, Sn, V, 등에서 하나이상 선택하여 사용하는 것이 특징인 반도체 장치의 금속층 형성방법.
  6. 제4항에 있어서, 불순물이온의 농도는 저융점의 도전층이 전도성막보다 10℃ 이상 낮은 융점을 갖도록 하는 조성인 것이 특징인 반도체 장치의 금속층 형성방법.
  7. 제1항에 있어서, 제2전도성막을 형성하는 공정은 제1전도성막위에 제2전도성막을 화학기상증착방법으로 형성하는 것이 특징인 반도체 장치의 금속층 형성방법.
  8. 제7항에 있어서, 제1전도성막은 Al 또는 Al 합금으로 형성하고, 제2전도성막은 제1전도성막 보다 불순물이 많이 포함된 증착막으로 형성하는 것이 특징인 반도체 장치의 금속층 형성방법.
  9. 제8항에 있어서, 불순물로서는 Si, Cu, Ga, Ge, Pd, Sn, V등을 하나이상 선택하여 사용하는 것이 특징인 반도체 장치의 금속층 형성방법.
  10. 제8항에 있어서, 불순물 농도는 제2전도성막이 제1전도성막보다 10℃ 이상 낮은 융점을 갖는 조성인 것을 포함하는 것이 특징인 반도체 장치의 금속층 형성방법.
  11. 제7항에 있어서, 화학기상 증착막을 형성하는 공정으로서는 스퍼터링방식을 적용하는 것이 특징인 반도체 장치의 금속층 형성방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950000133A 1995-01-06 1995-01-06 반도체 장치의 금속층 형성방법 KR0161116B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019950000133A KR0161116B1 (ko) 1995-01-06 1995-01-06 반도체 장치의 금속층 형성방법
JP07231356A JP3113800B2 (ja) 1995-01-06 1995-09-08 半導体装置の配線形成方法
US08/583,320 US5880023A (en) 1995-01-06 1996-01-05 Process for formation of wiring layer in semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950000133A KR0161116B1 (ko) 1995-01-06 1995-01-06 반도체 장치의 금속층 형성방법

Publications (2)

Publication Number Publication Date
KR960030328A true KR960030328A (ko) 1996-08-17
KR0161116B1 KR0161116B1 (ko) 1999-02-01

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US (1) US5880023A (ko)
JP (1) JP3113800B2 (ko)
KR (1) KR0161116B1 (ko)

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Also Published As

Publication number Publication date
JP3113800B2 (ja) 2000-12-04
KR0161116B1 (ko) 1999-02-01
JPH08204013A (ja) 1996-08-09
US5880023A (en) 1999-03-09

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