KR960019689A - 다운세트된 노출 다이 장착 패드 리드프레임 및 패키지 - Google Patents

다운세트된 노출 다이 장착 패드 리드프레임 및 패키지 Download PDF

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Publication number
KR960019689A
KR960019689A KR1019950040971A KR19950040971A KR960019689A KR 960019689 A KR960019689 A KR 960019689A KR 1019950040971 A KR1019950040971 A KR 1019950040971A KR 19950040971 A KR19950040971 A KR 19950040971A KR 960019689 A KR960019689 A KR 960019689A
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South Korea
Prior art keywords
die
downset
leadframe
pad
mounting pad
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KR1019950040971A
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English (en)
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쥬니어 부포트 에이취. 카터
디. 데이비스 데니스
알. 키 데이비드
클락 제세
피. 라베데 스티븐
트랜 하이
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윌리엄 이. 힐러
텍사스 인스트루먼츠 인코포레이티드
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Publication of KR960019689A publication Critical patent/KR960019689A/ko

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Abstract

본 발명은 최근 제조 프로세스에 사용될 수 있는 단일 조각으로 깊이 노출된 리드프레임(10)에 관한 것이다. 단일 리드프레임(10)은 장착된 반도체 다이(20) 내로 다운세트 또는 캐비티로 형성된 다이 장착 패드(12)를 갖고 있다. 윙(14,15,17,18)은 디바이스 패키지(21)의 다이 패드를 에위싸, 가능 습기 경로(34a)의 길이를 증가시킨다. 다운세트된 다이 패드(12)는 다이 장착 패드(12)의 직접 열 접촉을 외부 히트 싱크에 제공하므로, 패키지에 히트 슬러그를 내장할 필요가 없다. 노출된 다이 패드(12)는 RF 회로 접지 평면에 대한 RF 접지 접속으로서 사용될 수도 있다.

Description

다운세트된 노출 다이 장착 패드 리드프레임 및 패키지
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 따른 다운세트된 다이 패드 리드프레임의 상면도,
제2도는 제1도의 리드프레임의 측면도,
제3도는 제1도의 리드프레임의 단면도.

Claims (21)

  1. 반도체 디바이스용 리드프레임에 있어서, 제1수평면 내의 다수의 리드프레임 리드; 및 상기 제1평면에서 제2평면으로 다운세트되어 있으며, 베이스 및 상기 베이스로부터 상부 방향으로 연장되는 다수의 윙을 포함하는 다이 장착 패드를 포함하는 것을 특징으로 하는 리드프레임.
  2. 제1항에 있어서, 적어도 상기 리드프레임 리드의 몇몇은 상기 다운세트된 다이장착 패드에 부착된 것을 특징으로 하는 리드프레임.
  3. 제1항에 있어서 상기 다운세트는 멀티 스텝 다운세트인 것을 특징으로 하는 리드프레임.
  4. 반도체 디바이스용 리드프레임에 있어서, 제1수평면 내의 다수의 리드프레임 리드; 제1면에서 제2면으로 다운세트된 베이스를 포함하고, 상기 베이스로부터 외부 및 상부 방향으로 연장하는 다수의 윙을 갖고 있는 다이 장착 패드; 및 다운세트된 다이 패드에 부착된 적어도 하나의 리드프레임 리드를 포함하는 것을 특징으로 하는 리드프레임.
  5. 반도체 다이, 리드프레임 및 플라스틱 캡슐레이팅 본체를 포함하는 반도체 디바이스에 있어서, 제1수평면내의 다수의 리드프레임 리드; 상기 제1면에서 제2면으로 다운세트된 다이 장착 패드; 상기 다운세트된 다이 장착 패드 상에 장착된 반도체 다이; 및 상기 리드프레임 리드의 일부분, 상기 반도체 다이 및 상기 캡슐레이팅 패키지까지 연장하고 상기 캡슐레이팅 패키지를 통해 연장되는 상기 다운세트 다이 장착 패드의 일부를 캡슐화 하는 캡슐레이팅 패키지를 포함하는 것을 특징으로 하는 반도체 디바이스.
  6. 제5항에 있어서, 상기 다운세트된 다이 장착 패드는 직접 열 경로를 상기 반도체 다이에 제공하는 것을 특징으로 하는 반도체 디바이스.
  7. 제5항에 있어서, 상기 다운세트된 다이 장착 패드는 상기 반도체 다이용 열 전달면으로서 작용하는 것은 특징으로 하는 반도체 디바이스.
  8. 제5항에 있어서, 상기 리드프레임 리드는 상기 패키지가 인쇄 배선 기판 상에 장착될 때 반도체 디바이스 패키지의 상부 측면을 통해 연장되는 다이 패드를 배치하도록 형성된 것을 특징으로 하는 반도체 디바이스.
  9. 제5항에 있어서, 인쇄 회로 기판과 결합되어 있고, 상기 패키지의 상부 상의 노출된 다이 패드와 접촉하는 열 방출 디바이스를 포함하는 것을 특징으로 하는 반도체 디바이스.
  10. 반도체 디바이스용 리드프레임의 형성 방법에 있어서, 다이 장착 패드 및 리드프레임 리드를 포함하는 리드프레임을 형성하는 단계; 상기 리드프레임 리드의 평면 아래 및 평면에 수평인 평면에 다이 장착 패드를 다운세팅하는 단계; 및 상기 다이 장착 패드의 평면으로부터 상부 방향으로 연장된 상기 다이 장착 패드 상에 윙을 형성하는 단계를 포함하는 것을 특징으로 하는 리드프레임 형성 방법.
  11. 제10항에 있어서, 상기 리드프레임은 에칭에 의해 형성된 것을 특징으로 하는 리드프레임 형성 방법.
  12. 제10항에 있어서, 상기 리드프레임은 스탬핑에 의해 형성된 것을 특징으로 하는 리드프레임 형성 방법.
  13. 제10항에 있어서, 상기 다이 장착 패드 상에 제2다운세트를 형성하는 단계를 포함하는 것을 특징으로 하는 리드프레임 형성 방법.
  14. 제10항에 있어서, 상기 다운세트된 다이 패드 주위에서 습기의 침투를 제한하는 스텝 코너부를 형성하는 단계를 포함하는 것을 특징으로 하는 리드프레임 형성 방법.
  15. 제10항에 있어서, 상기 다이 패드와 상기 패키지 플라스틱간에 포지티브 록킹을 제공하기 위해 외부 방향으로 경사진 다이 장착 패드의 윙을 형성하는 단계를 포함하는 것을 특징으로 하는 리드프레임 형성 방법.
  16. 제10항에 있어서, 상기 습기 경로를 증가시키고 상기 패키지 내로 습기의 침투를 방지하도록 외부 방향으로 경사진 상기 다이 장착 패드의 윙을 형성하는 단계를 포함하는 것을 특징으로 하는 리드프레임 형성 방법.
  17. 반도체 디바이스용 리드프레임을 형성하는 방법에 있어서, 제1수평면에 다수의 리드프레임 리드를 형성하는 단계; 상기 제1평면에서 제2평면으로 다운세트된 다이 장착 패드를 형성하는 단계; 상기 다운세트된 다이 장착 패드 상에 장착된 반도체 다이를 장착하는 단계; 및 상기 리드프레임 리드의 일부분, 상기 반도체 다이 및 상기 캡슐레이팅 패키지까지 연장되고 상기 캡슐레이팅 패키지를 통해 연장되는 상기 다운세트된 다이 장착 패드의 부분을 캡슐화하는 단계를 포함하는 것을 특징으로 하는 리드프레임 형성 방법.
  18. 제1항에 있어서, 상기 다운세트된 다이 패드 주위에서 습기의 침투를 제한하기 위해 상기 다운세트된 다이 패드 상에 스텝된 코너부를 포함하는 것을 특징으로 하는 반도체 디바이스.
  19. 반도체 디바이스와 인쇄 배선 기판의 결합체에 있어서, 제1표면을 갖고 있고, 반도체 패키지의 상기 제1표면까지 연장되며 제1표면을 통해 연장되는 다운세트된 다이 장착 패드를 포함하는 패키지된 반도체 디바이스; 제1 및 제2표면을 갖고 있고, 상기 제1과 제2표면간의 인쇄 배선 기판을 통해 연장하는 적어도 하나의 열 도전 경로를 갖고 있는 인쇄 배선 기판; 및 상기 열 도전 경로와 열 접속하는 히트 싱크를 포함하고, 상기 패키지된 반도체 디바이스는 상기 인쇄 회로 기판의 상기 제1표면 상의 열 도전 비아와 열 접촉하여 상기 제1표면을 통해 연장하는 상기 다운세트된 다이 장착 패드를 갖고 있는 상기 인쇄 배선 기판의 상기 제1표면 상에 장착된 것을 특징으로 하는 결합체.
  20. 제19항에 있어서, 상기 다운세트된 다이 패드와 상기 인쇄 회로 기판의 상기 제1표면간의 열 도전 물질, 및 상기 히트 싱크와 상기 인쇄 배선 기판의 상기 제2표면간의 열 도전 물질을 포함하는 것을 특징으로 하는 결합체.
  21. 한 표면 상에 제1 및 제2열 도전 영역을 갖고 있는 인쇄 배선 기판; 상기 제1 및 제2열 도전 영역간 및 상기 제1 및 제2열 도전 영역을 접속하는 제3열 도전 영역; 및 상기 제3열 도전 영역 위의 상기 인쇄 배선 기판에 장착되며, 상기 반도체 패키지의 면을 통해 연장하며 상기 제3열 도전 영역과 열 도전 접촉하는 다운세트 된 열 도전 다이 장착 패드를 갖고 있는 반도체 디바이스를 포함하는 것을 특징으로 하는 반도체 디바이스와 인쇄 배선 기판의 결합체.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950040971A 1994-11-14 1995-11-13 다운세트된 노출 다이 장착 패드 리드프레임 및 패키지 KR960019689A (ko)

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US08/337,798 US5594234A (en) 1994-11-14 1994-11-14 Downset exposed die mount pad leadframe and package

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EP0712160A2 (en) 1996-05-15

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