KR960005761A - 반도체장치 - Google Patents
반도체장치 Download PDFInfo
- Publication number
- KR960005761A KR960005761A KR1019950021968A KR19950021968A KR960005761A KR 960005761 A KR960005761 A KR 960005761A KR 1019950021968 A KR1019950021968 A KR 1019950021968A KR 19950021968 A KR19950021968 A KR 19950021968A KR 960005761 A KR960005761 A KR 960005761A
- Authority
- KR
- South Korea
- Prior art keywords
- film
- semiconductor device
- gate electrode
- permeation prevention
- hydrogen permeation
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 13
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 13
- 239000001257 hydrogen Substances 0.000 claims abstract description 13
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 230000002265 prevention Effects 0.000 claims abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract 4
- 229910052710 silicon Inorganic materials 0.000 claims abstract 4
- 239000010703 silicon Substances 0.000 claims abstract 4
- 239000010410 layer Substances 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 2
- 235000014653 Carica parviflora Nutrition 0.000 claims 1
- 241000243321 Cnidaria Species 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 239000011229 interlayer Substances 0.000 claims 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 claims 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910021341 titanium silicide Inorganic materials 0.000 claims 1
- 238000000059 patterning Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 abstract 7
- 239000010409 thin film Substances 0.000 abstract 2
- 230000006866 deterioration Effects 0.000 abstract 1
- 239000012528 membrane Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 description 1
- 229910021342 tungsten silicide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0276—Photolithographic processes using an anti-reflective coating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
본 발명은 반사방지막으로서 산질화실리콘(SiON)계 박막을 사용하여 패터닝이 이루어지고, SiON계 박막에 함유되는 수소에 의한 전기특성의 열화가 방지된 반도체장치에 관한 것으로서, 기판과, 상기 기판의 표면에 형성된 게이트절연막과, 상기 게이트절연막상에 형성된 게이트전극과, 상기 게이트전극과 공통의 패턴을 가지고, 게이트전극상에 적층된 수소를 함유하는 제1의 반사방지막과, 상기 게이트절연막과 상기 제1의 반사방지막과의 사이에 형성된 수소투과방지막으로 이루어진다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제6도는 게이트전극의 패터닝에 사용한 반사방지막으로부터 확산하는 수소가 게이트절연막에 도달하지 않는 구조를 가지는 본 발명의 반도체장치의 일구성예를 나타낸 모식적 단면도이다.
제7도는 제6의 웨이퍼의 제조프로세스를 나타낸 것이며, 텅스텐실리사이드층상에 수소투과방지막을 성막하고나서, 반사방지막, 오프셋산화막, 포토레지스트도막이 형성된 상태를 나타낸 모식적 단면도이다.
제8도는 제7도의 웨이퍼에 있으서, 게이트전극의 패터닝이 이루어진 상태를 나타낸 모식적 단면도이다.
Claims (11)
- 기판과, 상기 기판의 표면에 형성된 게이트절연막과, 상기 게이트절연상에 형성된 게이트전극과, 상기 게이트전극과 공통의 패턴을 가지고, 게이트전극상에 적층된 수소를 함유하는 제1의 반사방지막과, 상기 게이트절연막과 상기 제1의 반사방지막과의 사이에 형성된 수소투과방지막으로 이루어지는 것을 특징으로 하는 반도체장치.
- 제1항에 있어서, 상기 게이트절연막이 산호실리콘제 재료로 구성되어 있는 것을 특징으로 하는 반도체장치.
- 제1항에 있어서, 상기 제1의 반사방지막이 산질화실리콘제 막인 것을 특징으로 하는 반도체장치.
- 제1항에 있어서, 상기 기판상에 형성된 상층배선층으로 이루어지고, 이 상층배선층과 공통의 패턴을 가지고, 상층배선층상에 적층된 수로를 함유하는 제2의 반사방지막을 더 가지는 것을 특징으로 하는 반도체장치.
- 제4항에 있어서, 상기 제2의 반사방지막이 산질화실리콘계 재료로 형성되어 있는 것을 특징으로 하는 반도체장치.
- 제3항에 있어서, 상기 수소투과방지막이 상기 게이트전극을 피복하도록 형성된 것을 특징으로 하는 반도체장치.
- 제6항에 있어서, 상기 수소투과방지막이 상기 게이트전극과 상층배선층과 사이의 층간절연막인 것을 특징으로 하는 반도체장치.
- 제1항에 있어서, 상기 수소투과방지막이 저압화학기상성장법으로 성막된 질화실리콘계 막인 것을 특징으로 하는 반도체장치.
- 제1항에 있어서,상기 수소투과방지막이 플라즈마 CVD법으로 형성된 산화실리콘계 막인 것을 특징으로 하는 반도체장치.
- 제1항에 있어서, 상기 수소투과방지막이 티탄막이고, 상기 게이트전극의 일부로서 형성되어 것을 특징으로 하는 반도체장치.
- 제1항에 있어서, 상기 수소투과방지막이 티탄실리사이드막이고, 상기 게이트전극의 일부로서 형성되어 것을 특징으로 하는 반도체장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1994-175526 | 1994-07-27 | ||
JP17552694A JPH0846186A (ja) | 1994-07-27 | 1994-07-27 | 半導体装置 |
JP1994-177055 | 1994-07-28 | ||
JP17705594A JPH0846188A (ja) | 1994-07-28 | 1994-07-28 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960005761A true KR960005761A (ko) | 1996-02-23 |
Family
ID=26496779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950021968A KR960005761A (ko) | 1994-07-27 | 1995-07-25 | 반도체장치 |
Country Status (2)
Country | Link |
---|---|
US (1) | US5600165A (ko) |
KR (1) | KR960005761A (ko) |
Cited By (1)
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KR100731484B1 (ko) * | 2001-07-13 | 2007-06-21 | 최효승 | 실내외용 그라운드 경사면 형태 대응형 골프 퍼팅 연습기 |
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JP3422580B2 (ja) * | 1994-12-16 | 2003-06-30 | 三菱電機株式会社 | 半導体装置の製造方法 |
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KR100211540B1 (ko) * | 1996-05-22 | 1999-08-02 | 김영환 | 반도체소자의 층간절연막 형성방법 |
US5866946A (en) * | 1996-05-23 | 1999-02-02 | Kabushiki Kaisha Toshiba | Semiconductor device having a plug for diffusing hydrogen into a semiconductor substrate |
US6156149A (en) * | 1997-05-07 | 2000-12-05 | Applied Materials, Inc. | In situ deposition of a dielectric oxide layer and anti-reflective coating |
US5841179A (en) * | 1996-08-28 | 1998-11-24 | Advanced Micro Devices, Inc. | Conductive layer with anti-reflective surface portion |
US6562544B1 (en) * | 1996-11-04 | 2003-05-13 | Applied Materials, Inc. | Method and apparatus for improving accuracy in photolithographic processing of substrates |
US5796151A (en) * | 1996-12-19 | 1998-08-18 | Texas Instruments Incorporated | Semiconductor stack having a dielectric sidewall for prevention of oxidation of tungsten in tungsten capped poly-silicon gate electrodes |
JP3090074B2 (ja) * | 1997-01-20 | 2000-09-18 | 日本電気株式会社 | 半導体装置及びその製造方法 |
JP3060979B2 (ja) * | 1997-02-10 | 2000-07-10 | 日本電気株式会社 | 半導体装置およびその製造方法 |
US5846878A (en) * | 1997-02-28 | 1998-12-08 | Nec Corporation | Method of manufacturing a wiring layer in a semiconductor device |
US5963841A (en) * | 1997-08-01 | 1999-10-05 | Advanced Micro Devices, Inc. | Gate pattern formation using a bottom anti-reflective coating |
US5965461A (en) * | 1997-08-01 | 1999-10-12 | Advanced Micro Devices, Inc. | Controlled linewidth reduction during gate pattern formation using a spin-on barc |
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US5920796A (en) * | 1997-09-05 | 1999-07-06 | Advanced Micro Devices, Inc. | In-situ etch of BARC layer during formation of local interconnects |
US6121123A (en) * | 1997-09-05 | 2000-09-19 | Advanced Micro Devices, Inc. | Gate pattern formation using a BARC as a hardmask |
US5834353A (en) * | 1997-10-20 | 1998-11-10 | Texas Instruments-Acer Incorporated | Method of making deep sub-micron meter MOSFET with a high permitivity gate dielectric |
US6541164B1 (en) | 1997-10-22 | 2003-04-01 | Applied Materials, Inc. | Method for etching an anti-reflective coating |
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US6288434B1 (en) | 1999-05-14 | 2001-09-11 | Tower Semiconductor, Ltd. | Photodetecting integrated circuits with low cross talk |
US6004853A (en) * | 1999-05-27 | 1999-12-21 | Vanguard International Semiconductor Corporation | Method to improve uniformity and the critical dimensions of a DRAM gate structure |
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US6410428B1 (en) * | 2000-10-03 | 2002-06-25 | Promos Technologies, Inc. | Nitride deposition on tungsten-polycide gate to prevent abnormal tungsten silicide oxidation |
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JPS6419760A (en) * | 1987-07-15 | 1989-01-23 | Fuji Electric Co Ltd | Semiconductor integrated circuit device |
JPS6465866A (en) * | 1987-09-05 | 1989-03-13 | Fuji Electric Co Ltd | Semiconductor integrated circuit device |
EP0642168B1 (en) * | 1989-07-18 | 1998-09-23 | Sony Corporation | Non-volatile semiconductor memory device |
JP3371143B2 (ja) * | 1991-06-03 | 2003-01-27 | ソニー株式会社 | ドライエッチング方法 |
JP3065829B2 (ja) * | 1992-12-25 | 2000-07-17 | 新日本製鐵株式会社 | 半導体装置 |
JP3342164B2 (ja) * | 1993-04-16 | 2002-11-05 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
JPH0737988A (ja) * | 1993-07-20 | 1995-02-07 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
-
1995
- 1995-07-25 KR KR1019950021968A patent/KR960005761A/ko not_active Application Discontinuation
- 1995-07-26 US US08/507,526 patent/US5600165A/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100731484B1 (ko) * | 2001-07-13 | 2007-06-21 | 최효승 | 실내외용 그라운드 경사면 형태 대응형 골프 퍼팅 연습기 |
Also Published As
Publication number | Publication date |
---|---|
US5600165A (en) | 1997-02-04 |
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