KR950006382B1 - 칩형 전자부품 포장용 커버 테이프 - Google Patents

칩형 전자부품 포장용 커버 테이프 Download PDF

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Publication number
KR950006382B1
KR950006382B1 KR1019910701255A KR910701255A KR950006382B1 KR 950006382 B1 KR950006382 B1 KR 950006382B1 KR 1019910701255 A KR1019910701255 A KR 1019910701255A KR 910701255 A KR910701255 A KR 910701255A KR 950006382 B1 KR950006382 B1 KR 950006382B1
Authority
KR
South Korea
Prior art keywords
cover tape
adhesive layer
tape
chip
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019910701255A
Other languages
English (en)
Korean (ko)
Other versions
KR920701011A (ko
Inventor
시게루 마에다
도모하루 미야모또
Original Assignee
스미또모 배꾸라이또 가부시끼가이샤
노무라 마사오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=11744341&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR950006382(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 스미또모 배꾸라이또 가부시끼가이샤, 노무라 마사오 filed Critical 스미또모 배꾸라이또 가부시끼가이샤
Publication of KR920701011A publication Critical patent/KR920701011A/ko
Application granted granted Critical
Publication of KR950006382B1 publication Critical patent/KR950006382B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y10T428/2826—Synthetic resin or polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
KR1019910701255A 1990-02-06 1991-02-05 칩형 전자부품 포장용 커버 테이프 Expired - Lifetime KR950006382B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP90-10225 1990-02-06
JP1022590 1990-02-06
PCT/JP1991/000133 WO1991012187A1 (fr) 1990-02-06 1991-02-05 Bande de couverture pour puce electronique

Publications (2)

Publication Number Publication Date
KR920701011A KR920701011A (ko) 1992-08-10
KR950006382B1 true KR950006382B1 (ko) 1995-06-14

Family

ID=11744341

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910701255A Expired - Lifetime KR950006382B1 (ko) 1990-02-06 1991-02-05 칩형 전자부품 포장용 커버 테이프

Country Status (6)

Country Link
US (1) US5346765A (https=)
EP (1) EP0466937B2 (https=)
KR (1) KR950006382B1 (https=)
DE (1) DE69109756T3 (https=)
TW (1) TW209849B (https=)
WO (1) WO1991012187A1 (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5325654A (en) * 1992-06-19 1994-07-05 Minnesota Mining And Manufacturing Company Carrier tape with cover strip
US5390472A (en) * 1992-06-19 1995-02-21 Minnesota Mining And Manufacturing Company Carrier tape with cover strip
TW339840U (en) * 1993-12-22 1998-09-01 Lintec Corp Coating applicator
JPH08295001A (ja) * 1995-04-27 1996-11-12 Dainippon Printing Co Ltd 蓋材とキャリアテープおよびこれらを用いたテーピング
US5599621A (en) * 1995-09-29 1997-02-04 Brady Precision Tape Co. Cover tape for surface mount device packaging
US5670254A (en) * 1995-09-29 1997-09-23 Brady Precision Tape Co. Cover tape for surface mount device packaging
US5811184A (en) * 1996-06-04 1998-09-22 Hughes Electronics Corporation Double-faced adhesive film particle getter
US6030692A (en) * 1996-09-13 2000-02-29 Netpco Incorporated Cover tape for formed tape packing system and process for making same
JP3202935B2 (ja) * 1996-12-25 2001-08-27 日東電工株式会社 フレキシブル配線板及びその製造方法
US5726283A (en) * 1997-01-03 1998-03-10 Far Eastern Textile, Ltd. Conductive polyester sheet
US6495195B2 (en) * 1997-02-14 2002-12-17 Arcturus Engineering, Inc. Broadband absorbing film for laser capture microdissection
US7075640B2 (en) 1997-10-01 2006-07-11 Arcturus Bioscience, Inc. Consumable for laser capture microdissection
US6027802A (en) * 1997-10-23 2000-02-22 Four Piliars Enterprise Co., Ltd. Cover tape for packaging
US6529379B1 (en) 1998-10-13 2003-03-04 International Business Machines Corporation Article exhibiting enhanced adhesion between a dielectric substrate and heat spreader and method
US6703120B1 (en) 1999-05-05 2004-03-09 3M Innovative Properties Company Silicone adhesives, articles, and methods
JP2001171728A (ja) * 1999-12-15 2001-06-26 Denki Kagaku Kogyo Kk エンボスキャリアテープ用シート
WO2001061311A1 (en) 2000-02-16 2001-08-23 Arcturus Engineering, Inc. Transfer film for laser microcapture
SG115510A1 (en) * 2001-12-20 2005-10-28 Nitto Denko Corp Cover tape for the electronic part conveyance, process for its production and electronic part conveying member
US7108899B2 (en) * 2002-09-11 2006-09-19 Entegris, Inc. Chip tray with tacky surface
US6926937B2 (en) * 2002-09-11 2005-08-09 Entegris, Inc. Matrix tray with tacky surfaces
US8247057B2 (en) * 2005-09-16 2012-08-21 3M Innovative Properties Company Cover tape and method for manufacture
US20070062844A1 (en) * 2005-09-16 2007-03-22 Velasquez Urey Ruben E Cover tape and method for manufacture
US20070202289A1 (en) * 2006-02-27 2007-08-30 Robert Kranz Array of self supporting thermally conductive insulator parts having a perforated outline surrounding each part to facilitate separation and a method of packaging
JP4919727B2 (ja) * 2006-08-04 2012-04-18 日東電工株式会社 配線回路基板
TW200823962A (en) * 2006-11-21 2008-06-01 Speck Co Ltd Manufacturing process of hot press adhesive tape for chip on the plastic carrier body
US20140120293A1 (en) * 2011-12-22 2014-05-01 Mohit Gupta Electrostatic discharge compatible dicing tape with laser scribe capability
CN105377713A (zh) * 2013-07-09 2016-03-02 住友电木株式会社 电子部件包装用盖带
TWI622532B (zh) * 2017-09-28 2018-05-01 Jenimetal Chemical Factory Co Ltd 蓋帶之改良結構
CN109747972A (zh) * 2017-11-06 2019-05-14 仁仪企业股份有限公司 盖带改良结构
CN116794062A (zh) * 2022-03-18 2023-09-22 株式会社东芝 外观检查系统及外观检查方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK169553B1 (da) * 1979-08-08 1994-11-28 Ucb Sa Varmforseglelig emballeringsfilm, fremgangsmåde til dens fremstilling samt emballager deraf
JPS5748639U (https=) * 1980-09-05 1982-03-18
JPS5748639A (en) * 1980-09-08 1982-03-20 Ricoh Co Ltd Measuring apparatus of optical density
JPS60113998A (ja) * 1983-11-26 1985-06-20 松下電器産業株式会社 電子部品集合体
AU572615B2 (en) * 1983-12-27 1988-05-12 Sony Corporation Electrically conductive adhesive sheet circuit board and electrical connection structure
CA1222071A (en) * 1984-01-30 1987-05-19 Joseph A. Aurichio Conductive die attach tape
US4548862A (en) * 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
JPS61188957A (ja) * 1985-02-18 1986-08-22 Toshiba Corp 回路モジユ−ルの製造方法
JPS61202362A (ja) * 1985-03-01 1986-09-08 Sony Corp テ−プレコ−ダにおけるテ−プロ−デイング機構
JPS61202362U (https=) * 1985-06-07 1986-12-19
JPS62108277A (ja) * 1985-11-05 1987-05-19 木村　仁彦 押し花の製造法
JPS62108277U (https=) * 1985-12-26 1987-07-10
JPS61188957U (https=) * 1986-05-06 1986-11-25
JPH01112599A (ja) * 1987-10-26 1989-05-01 Matsushita Electric Ind Co Ltd 半導体記憶装置
JPH046159Y2 (https=) * 1988-01-26 1992-02-20
JPH024670A (ja) * 1988-06-13 1990-01-09 Nec Corp エンボス包装用カバーテープ
JPH0257576A (ja) * 1988-08-12 1990-02-27 Minnesota Mining & Mfg Co <3M> 電子部品収納用テープ
US5091251A (en) * 1989-05-29 1992-02-25 Tomoegawa Paper Co., Ltd. Adhesive tapes and semiconductor devices
TW203624B (https=) * 1991-02-28 1993-04-11 Sumitomo Bakelite Co

Also Published As

Publication number Publication date
EP0466937B2 (en) 1998-03-18
EP0466937B1 (en) 1995-05-17
TW209849B (https=) 1993-07-21
WO1991012187A1 (fr) 1991-08-22
US5346765A (en) 1994-09-13
DE69109756T2 (de) 1995-09-21
EP0466937A1 (en) 1992-01-22
KR920701011A (ko) 1992-08-10
DE69109756D1 (de) 1995-06-22
EP0466937A4 (en) 1992-08-12
DE69109756T3 (de) 1998-10-15

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