KR920701011A - 칩형 전자부품 포장용 커버 테이프 - Google Patents

칩형 전자부품 포장용 커버 테이프

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Publication number
KR920701011A
KR920701011A KR1019910701255A KR910701255A KR920701011A KR 920701011 A KR920701011 A KR 920701011A KR 1019910701255 A KR1019910701255 A KR 1019910701255A KR 910701255 A KR910701255 A KR 910701255A KR 920701011 A KR920701011 A KR 920701011A
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South Korea
Prior art keywords
cover tape
chip
adhesive layer
packaging
resin
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KR1019910701255A
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English (en)
Other versions
KR950006382B1 (ko
Inventor
시게루 마에다
도모하루 미야모또
Original Assignee
노무라 마사오
스미또모 배꾸라이또 가부시끼가이샤
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y10T428/2826—Synthetic resin or polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

내용 없음

Description

칩형 전자부품 포장용 커버 테이프
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 커버 테이프의 충구성의 일예를 나타낸 단면도이다, 제2도는 본 발명의 커버 테이프를 캐리어 테이프에 접착했을때의 상태를 나타낸 단면도이다, 제3도는 본 발명의 커버 테이프를 캐리어 테이프에 접착하고, 그후 박리했을때의 캐리어 테이프의 상태를 나타낸 단면도이다.

Claims (12)

  1. 칩형 전자부품을 수납하는 수납 포켓을 연속적으로 형성한 플라스틱제 캐리어 테이프에, 열시일 가능한 커버테이프이며, 외층이 폴리에스테르, 폴리프로필렌, 나일론의 어느것인 2축 연신 필름이며, 접착층이 열가소성 수지에 산화주석, 산화아연, 산화티탄, 카아본 블랙, Si계 유기화합물의 어느것인가 또는 이들의 조합으로된 도전성 미분말 분산시 이루어진것을 특징으로 하는 칩형 전자부품 포장용 커버 테이프.
  2. 제1항에 있어서, 접착층의 열가소성 수지가 폴리우레탄계 수지, 아크릴계 수지, 폴리염화비닐계 수지, 에틸렌비닐아세테이트수지, 폴리에스테르계 수지의 어느 것인가 또는 이들의 조합으로 이루어진 칩형 전자부품 포장용 커버 테이프.
  3. 제1 또는 2항에 있어서, 도전성 미분말의 첨가량이 접착층의 열가소성 수지 100중량부에 대하여 10~100중량부이며, 접착층의 표면저항치가 103Ω/ㅁ이하인 칩형 전자 부품 포장용 커버 테이프.
  4. 제1, 2 또는 3항에 있어서, 커버 테이프의 접착층과 캐리어 테이프의 시일면의 접착강도가 커버테이프의 외층과 접착층의 층간 밀착강도 보다도 큰것으로 특징으로 하는 칩형 전자부품 포장용 커버 테이프.
  5. 제4항에 있어서, 커버 테이프의 외층과 접착층의 층간 밀착 강도가 시일폭 1㎜당 10~120gr인 칩형전자 부품 포장용 커버 테이프.
  6. 제1, 2, 3, 4 또는 5항에 있어서, 커버 테이프의 가시광선 투과율이 10%이상인 칩형 전자부품 포장용 커버 테이프.
  7. 칩형 전자부품을 수납하는 수납포켓을 연속적으로 형성한 플라스틱제 캐리어 테이프에 열시일 가능한 커버 테이프로서, 외층이 폴리에스테르, 폴리프필렌, 나일론의 어느것인 2축 연신 필름이며, 중간층이 폴리에틸렌, 에틸렌 비닐아세테이프 공증합체, 아이오노머, 폴리프로필렌 혹은 그들의 변성물의 어느 것인가의 폴리올레핀이며, 접착층이 열가소성 수지에 산화주석, 산화아연, 산화티탄, 카아본 블랙, Si계 유지 화합물의 어느 것인가 또는 이들의 조합으로된 도전성 미분말을 분산시켜서 이루어진 것을 특징으로 하는 칩형 전자부품 포장용 커버 테이프.
  8. 제7항에 있어서, 접착층의 열가소성 수지가 폴리우레탄 수지, 아크릴 수자, 폴리염화비틸계 수지, 에틸렌비닐아세티이프계수지, 폴리에스테르계 수지의 어느 것인가 또는 이들의 조합으로된 치병 전자부품 포장용 커버테이프.
  9. 제7 또는 8항에 있어서, 도전성 미분말의 첨가량이 접차가층의 열가소성 수지 100중량부에 대하여 10~100중량부이며, 접착층의 표면 저항치가 103Ω/ㅁ이하인 칩형 전자 부품 포장용 커버 테이프.
  10. 제7, 8 또는 9항에 있어서, 커버 테이프의 접착층과 캐리어 테이프의 시일면의 접차강도가 커버 테이프의 중간층과 접착층의 층간 밀착 강도보다 큰 것을 특징으로 하는 칩형 전자부품 포장용 커버 테이프.
  11. 제10항에 있어서, 커버 테이프의 중간층과 접착층의 층간 밀착 강도가 시일폭 1㎜당 10~120gr인 칩형전자 부품 포장용 커버 테이프.
  12. 제7, 8, 9, 10 또는 11항에 있어서, 커버 테이프의 가시광선 투과율이 10%이상인 칩형 전자부품 포장용 커버 테이프.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910701255A 1990-02-06 1991-02-05 칩형 전자부품 포장용 커버 테이프 KR950006382B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1022590 1990-02-06
JP90-10225 1990-02-06
PCT/JP1991/000133 WO1991012187A1 (en) 1990-02-06 1991-02-05 Covering tape for electronic component chip

Publications (2)

Publication Number Publication Date
KR920701011A true KR920701011A (ko) 1992-08-10
KR950006382B1 KR950006382B1 (ko) 1995-06-14

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ID=11744341

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Application Number Title Priority Date Filing Date
KR1019910701255A KR950006382B1 (ko) 1990-02-06 1991-02-05 칩형 전자부품 포장용 커버 테이프

Country Status (6)

Country Link
US (1) US5346765A (ko)
EP (1) EP0466937B2 (ko)
KR (1) KR950006382B1 (ko)
DE (1) DE69109756T3 (ko)
TW (1) TW209849B (ko)
WO (1) WO1991012187A1 (ko)

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MY107463A (en) * 1991-02-28 1995-12-30 Sumitomo Bakelite Co Cover tape for packaging chip type electronic parts.

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TW209849B (ko) 1993-07-21
EP0466937A4 (en) 1992-08-12
EP0466937A1 (en) 1992-01-22
EP0466937B1 (en) 1995-05-17
KR950006382B1 (ko) 1995-06-14
DE69109756D1 (de) 1995-06-22
EP0466937B2 (en) 1998-03-18
US5346765A (en) 1994-09-13
DE69109756T3 (de) 1998-10-15
WO1991012187A1 (en) 1991-08-22
DE69109756T2 (de) 1995-09-21

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