KR940006254A - 수지용 인서트 부재 - Google Patents

수지용 인서트 부재 Download PDF

Info

Publication number
KR940006254A
KR940006254A KR1019930012249A KR930012249A KR940006254A KR 940006254 A KR940006254 A KR 940006254A KR 1019930012249 A KR1019930012249 A KR 1019930012249A KR 930012249 A KR930012249 A KR 930012249A KR 940006254 A KR940006254 A KR 940006254A
Authority
KR
South Korea
Prior art keywords
insert member
resin
nickel
plating
containing alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019930012249A
Other languages
English (en)
Korean (ko)
Inventor
도시히꼬 시마다
Original Assignee
이노우에 사다오
신꼬오 덴기 고오교오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이노우에 사다오, 신꼬오 덴기 고오교오 가부시끼가이샤 filed Critical 이노우에 사다오
Publication of KR940006254A publication Critical patent/KR940006254A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Chemically Coating (AREA)
KR1019930012249A 1992-07-11 1993-07-01 수지용 인서트 부재 Ceased KR940006254A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP92-207480 1992-07-11
JP20748092A JP3228789B2 (ja) 1992-07-11 1992-07-11 樹脂用インサート部材の製造方法

Publications (1)

Publication Number Publication Date
KR940006254A true KR940006254A (ko) 1994-03-23

Family

ID=16540451

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930012249A Ceased KR940006254A (ko) 1992-07-11 1993-07-01 수지용 인서트 부재

Country Status (6)

Country Link
US (1) US5585195A (https=)
EP (1) EP0579464B1 (https=)
JP (1) JP3228789B2 (https=)
KR (1) KR940006254A (https=)
DE (1) DE69318894T2 (https=)
SG (1) SG46235A1 (https=)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5696756A (en) * 1995-04-14 1997-12-09 Kabushiki Kaishia Toshiba Optical disk having an evaluation pattern for evaluating the optical disk
US6055140A (en) 1997-07-25 2000-04-25 Seagate Technology, Inc. Rigid disc plastic substrate with high stiffness insert
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
JPH11189835A (ja) * 1997-12-25 1999-07-13 Jst Mfg Co Ltd すず−ニッケル合金およびこの合金により表面処理を施した部品
US6509632B1 (en) 1998-01-30 2003-01-21 Micron Technology, Inc. Method of fabricating a redundant pinout configuration for signal enhancement in an IC package
US6683368B1 (en) 2000-06-09 2004-01-27 National Semiconductor Corporation Lead frame design for chip scale package
US6689640B1 (en) 2000-10-26 2004-02-10 National Semiconductor Corporation Chip scale pin array
US6551859B1 (en) * 2001-02-22 2003-04-22 National Semiconductor Corporation Chip scale and land grid array semiconductor packages
JP2002299538A (ja) * 2001-03-30 2002-10-11 Dainippon Printing Co Ltd リードフレーム及びそれを用いた半導体パッケージ
JP3841768B2 (ja) 2003-05-22 2006-11-01 新光電気工業株式会社 パッケージ部品及び半導体パッケージ
US7049683B1 (en) * 2003-07-19 2006-05-23 Ns Electronics Bangkok (1993) Ltd. Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound
DE10348715B4 (de) * 2003-10-16 2006-05-04 Infineon Technologies Ag Verfahren zum Herstellen eines Flachleiterrahmens mit verbesserter Haftung zwischen diesem und Kunststoff sowie Flachleiterrahmen
US7095096B1 (en) 2004-08-16 2006-08-22 National Semiconductor Corporation Microarray lead frame
KR20060030356A (ko) * 2004-10-05 2006-04-10 삼성테크윈 주식회사 반도체 리이드 프레임과, 이를 포함하는 반도체 패키지와,이를 도금하는 방법
US7846775B1 (en) 2005-05-23 2010-12-07 National Semiconductor Corporation Universal lead frame for micro-array packages
KR101241735B1 (ko) 2008-09-05 2013-03-08 엘지이노텍 주식회사 리드 프레임 및 그 제조방법
US8110500B2 (en) 2008-10-21 2012-02-07 International Business Machines Corporation Mitigation of plating stub resonance by controlling surface roughness
KR20100103015A (ko) * 2009-03-12 2010-09-27 엘지이노텍 주식회사 리드 프레임 및 그 제조방법
KR101113891B1 (ko) 2009-10-01 2012-02-29 삼성테크윈 주식회사 리드 프레임 및 리드 프레임 제조 방법
KR101385887B1 (ko) 2009-11-09 2014-04-15 스미도모쥬기가이고교 가부시키가이샤 크라이오펌프, 및 진공배기방법
JP5553638B2 (ja) 2010-02-19 2014-07-16 住友重機械工業株式会社 コールドトラップ、及び真空排気装置
JP6366032B2 (ja) * 2013-11-29 2018-08-01 大口マテリアル株式会社 リードフレームおよびその製造方法
JP6345342B2 (ja) * 2015-04-15 2018-06-20 三菱電機株式会社 半導体装置
KR102529295B1 (ko) 2015-11-05 2023-05-08 후루카와 덴키 고교 가부시키가이샤 리드 프레임재 및 그 제조방법
DE102016117841A1 (de) 2016-09-21 2018-03-22 HYUNDAI Motor Company 231 Packung mit aufgerauter verkapselter Oberfläche zur Förderung einer Haftung
JP6479265B2 (ja) 2016-12-27 2019-03-06 古河電気工業株式会社 リードフレーム材およびその製造方法ならびに半導体パッケージ
JP7014695B2 (ja) 2018-10-18 2022-02-01 Ｊｘ金属株式会社 導電性材料、成型品及び電子部品
JP6805217B2 (ja) 2018-10-18 2020-12-23 Ｊｘ金属株式会社 導電性材料、成型品及び電子部品
KR102918295B1 (ko) 2021-07-16 2026-01-26 후루카와 덴키 고교 가부시키가이샤 리드 프레임재와 그 제조 방법 및 반도체 패키지

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5730355A (en) * 1980-07-29 1982-02-18 Tanaka Denshi Kogyo Kk Plating structure for semiconductor material
JPS59136957A (ja) * 1983-01-27 1984-08-06 Seiko Epson Corp フイルムキヤリアのフレキシブルテ−プ製造方法
US4529667A (en) * 1983-04-06 1985-07-16 The Furukawa Electric Company, Ltd. Silver-coated electric composite materials
JPH0612796B2 (ja) * 1984-06-04 1994-02-16 株式会社日立製作所 半導体装置
JPS63160367A (ja) * 1986-12-24 1988-07-04 Hitachi Ltd 樹脂封止型半導体装置
JPS63249361A (ja) * 1987-04-06 1988-10-17 Nippon Mining Co Ltd 半導体リ−ドフレ−ム
JPS6418246A (en) * 1987-07-14 1989-01-23 Shinko Electric Ind Co Lead frame for semiconductor device
JPS6465898A (en) * 1987-09-04 1989-03-13 Fujitsu Ltd Manufacture of multilayer printed board
JPH02129325A (ja) * 1988-11-08 1990-05-17 Sumitomo Metal Mining Co Ltd 高力銅合金
JPH02209759A (ja) * 1989-02-09 1990-08-21 Shinko Electric Ind Co Ltd リードフレーム
JPH02308555A (ja) * 1989-05-24 1990-12-21 Toshiba Corp 電子部品の封止構造およびその封止方法
KR920000127A (ko) * 1990-02-26 1992-01-10 미다 가쓰시게 반도체 패키지와 그것을 위한 리드프레임

Also Published As

Publication number Publication date
EP0579464B1 (en) 1998-06-03
EP0579464A2 (en) 1994-01-19
EP0579464A3 (https=) 1994-03-23
SG46235A1 (en) 1998-02-20
JPH0629439A (ja) 1994-02-04
DE69318894T2 (de) 1998-09-24
US5585195A (en) 1996-12-17
DE69318894D1 (de) 1998-07-09
JP3228789B2 (ja) 2001-11-12

Similar Documents

Publication Publication Date Title
KR940006254A (ko) 수지용 인서트 부재
SG60018A1 (en) Lead frame method for partial noble plating of said lead frame and semiconductor device having said lead frame
KR890006851A (ko) 부식 방지 처리 공정
CA2383171A1 (en) Metal casting moulded body comprising a cast-in hard material body
TW340139B (en) Process for plating palladium or palladium alloy onto iron-nickel alloy substrate
IT8323534A0 (it) Procedimento per l'asportazione elettrolitica di strati di nichel,cromo o oro, ottenuti per via galvanica, da superfici di rame o leghe di rame, e apparecchiature per la sua esecuzione.
EP1116904A3 (en) Metal gasket
KR930009046A (ko) 리드프레임
EP0926720A3 (en) Tape carrier manufacture
ES2171088T3 (es) Procedimiento para producir un sustrato exento de plomo.
ITVI940010A0 (it) Procedimento per la realizzazione di elementi decorativi in oro o al- tri metalli preziosi ed elementi ottenuti con detto procedimento
EP1625618A4 (en) SEMICONDUCTOR SEALING WITH GOLD / SILVER / COPPER ALLOY FILLING METAL
KR910003775A (ko) 반도체장치의 땜납 도포방법
KR940022818A (ko) 리드프레임 처리 방법
CA2017845A1 (en) Composite metal plated article excellent in mold-releasability
KR970077583A (ko) 리드 프레임과, 이 리드 프레임을 이용한 반도체 팩키지
JPS61218150A (ja) 半導体装置、それに用いるリ−ドフレ−ムおよびその製造方法
Shamray et al. Influence of Cooling Rate and Alloying on the Structure and Some Properties of Aluminum--Germanium Alloys
Bacon Gold alloy
Qiu IC leadframe and its stamping die
KR910700553A (ko) 전기적으로 상호접속된 물품들의 어셈블리
JPS6445074A (en) Flexible connector
Zwicker et al. Relaxation and Corrosion Behaviour of Copper Alloys
DE69105869D1 (de) Vorrichtung, die an einem Sessel oder dgl. montiert werden kann.
Whang et al. Effect of Silicon Addition in Rapidly Solidified Tungsten Alloys

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

J2X1 Appeal (before the patent court)

Free format text: APPEAL AGAINST DECISION TO DECLINE REFUSAL

PJ2001 Appeal

St.27 status event code: A-3-3-V10-V12-crt-PJ2001

PB0901 Examination by re-examination before a trial

St.27 status event code: A-6-3-E10-E12-rex-PB0901

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000