ES2171088T3 - Procedimiento para producir un sustrato exento de plomo. - Google Patents
Procedimiento para producir un sustrato exento de plomo.Info
- Publication number
- ES2171088T3 ES2171088T3 ES99927895T ES99927895T ES2171088T3 ES 2171088 T3 ES2171088 T3 ES 2171088T3 ES 99927895 T ES99927895 T ES 99927895T ES 99927895 T ES99927895 T ES 99927895T ES 2171088 T3 ES2171088 T3 ES 2171088T3
- Authority
- ES
- Spain
- Prior art keywords
- alloy
- layer
- individual layers
- silver
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Contacts (AREA)
Abstract
Procedimiento para producir un sustrato exento de plomo con un cuerpo base de cobre o de una aleación de cobre, una capa de soldadura, aplicada sobre al menos una parte del cuerpo base, a base de metales del grupo del oro, aleación de oro, plata, aleación de plata, paladio y aleación de paladio y con una única capa intermedia de níquel o aleación de níquel, dispuesta entre el cuerpo base y esta capa de soldadura, estando formada la capa de soldadura por al menos dos capas individuales de distinto metal y siendo electrodepositadas la capa intermedia y las capas individuales, caracterizado porque una de las dos capas individuales superiores está formada por plata o aleación de plata y porque la otra de las dos capas individuales superiores está formada por oro o aleación de oro, estando formada la capa individual superior con un espesor de capa en el intervalo de 0,3 m a2,5m.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19825805 | 1998-06-10 | ||
DE1998150526 DE19850526C2 (de) | 1998-11-03 | 1998-11-03 | Substrat mit metallischer Beschichtung und seine Verwendung |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2171088T3 true ES2171088T3 (es) | 2002-08-16 |
Family
ID=26046713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES99927895T Expired - Lifetime ES2171088T3 (es) | 1998-06-10 | 1999-06-07 | Procedimiento para producir un sustrato exento de plomo. |
Country Status (9)
Country | Link |
---|---|
US (1) | US6352634B1 (es) |
EP (1) | EP1047523B1 (es) |
JP (1) | JP3730120B2 (es) |
CA (1) | CA2293628A1 (es) |
DE (1) | DE59900741D1 (es) |
ES (1) | ES2171088T3 (es) |
MY (1) | MY118571A (es) |
PT (1) | PT1047523E (es) |
WO (1) | WO1999064198A1 (es) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG107600A1 (en) * | 2002-06-27 | 2004-12-29 | Agency Science Tech & Res | Multilayer substrate metallization for ic interconnection |
KR101059361B1 (ko) * | 2003-01-16 | 2011-08-24 | 파나소닉 주식회사 | 리드 프레임 및 반도체 발광장치 |
JP2005314749A (ja) * | 2004-04-28 | 2005-11-10 | Shinei Hitec:Kk | 電子部品及びその表面処理方法 |
JP4820616B2 (ja) * | 2005-10-20 | 2011-11-24 | パナソニック株式会社 | リードフレーム |
DE102006023998B4 (de) * | 2006-05-22 | 2009-02-19 | Infineon Technologies Ag | Elektronische Schaltungsanordnung und Verfahren zur Herstellung einer solchen |
DE102007048299A1 (de) * | 2007-10-08 | 2009-04-09 | Behr Gmbh & Co. Kg | Mehrschichtlot |
SG11201408151XA (en) * | 2012-06-06 | 2015-01-29 | Enplas Corp | Electric contact and socket for electric parts |
US8822036B1 (en) * | 2013-03-06 | 2014-09-02 | Ut-Battelle, Llc | Sintered silver joints via controlled topography of electronic packaging subcomponents |
JP2014182976A (ja) * | 2013-03-21 | 2014-09-29 | Enplas Corp | 電気接触子及び電気部品用ソケット |
CN112659677B (zh) * | 2020-12-24 | 2022-09-16 | 林雅烈 | 用于制造饰品的金属材料、其制备方法及首饰制备方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4529667A (en) * | 1983-04-06 | 1985-07-16 | The Furukawa Electric Company, Ltd. | Silver-coated electric composite materials |
JPH0714962A (ja) * | 1993-04-28 | 1995-01-17 | Mitsubishi Shindoh Co Ltd | リードフレーム材およびリードフレーム |
US5360991A (en) * | 1993-07-29 | 1994-11-01 | At&T Bell Laboratories | Integrated circuit devices with solderable lead frame |
US5436082A (en) | 1993-12-27 | 1995-07-25 | National Semiconductor Corporation | Protective coating combination for lead frames |
KR100275381B1 (ko) * | 1998-04-18 | 2000-12-15 | 이중구 | 반도체 패키지용 리드프레임 및 리드프레임도금방법 |
-
1999
- 1999-06-07 EP EP99927895A patent/EP1047523B1/de not_active Expired - Lifetime
- 1999-06-07 ES ES99927895T patent/ES2171088T3/es not_active Expired - Lifetime
- 1999-06-07 WO PCT/EP1999/003910 patent/WO1999064198A1/de active IP Right Grant
- 1999-06-07 MY MYPI99002303A patent/MY118571A/en unknown
- 1999-06-07 PT PT99927895T patent/PT1047523E/pt unknown
- 1999-06-07 JP JP2000553245A patent/JP3730120B2/ja not_active Expired - Fee Related
- 1999-06-07 CA CA002293628A patent/CA2293628A1/en not_active Abandoned
- 1999-06-07 US US09/445,196 patent/US6352634B1/en not_active Expired - Lifetime
- 1999-06-07 DE DE59900741T patent/DE59900741D1/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1047523B1 (de) | 2002-01-09 |
DE59900741D1 (de) | 2002-02-28 |
EP1047523A1 (de) | 2000-11-02 |
PT1047523E (pt) | 2002-06-28 |
WO1999064198A1 (de) | 1999-12-16 |
US6352634B1 (en) | 2002-03-05 |
MY118571A (en) | 2004-12-31 |
CA2293628A1 (en) | 1999-12-16 |
JP3730120B2 (ja) | 2005-12-21 |
JP2002517327A (ja) | 2002-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR950004511A (ko) | 집적회로 패키지, 리드프레임 및 제조물품 | |
EP0935286A4 (en) | COPPER CIRCUIT JUNCTION SUBSTRATE AND PROCESS FOR PRODUCING THE SAME | |
ES2171088T3 (es) | Procedimiento para producir un sustrato exento de plomo. | |
CA2336558A1 (en) | Die assembly and method of making die assembly | |
KR970067815A (ko) | 다층 구조의 도금층을 구비한 반도체 리드 프레임 | |
KR910011448A (ko) | 열전도성 복합재 | |
CA2069363A1 (en) | Thermal annealing of palladium alloys | |
TW200639992A (en) | Low cost lead-free preplated leadframe having improved adhesion and solderability | |
TW360927B (en) | Method and materials for through-mask electroplating and selective base removal | |
KR880008444A (ko) | 반도체 장치 | |
MY138109A (en) | Electronic part and surface treatment method of the same | |
CA2173739A1 (en) | Active Metal Metallization of Mini-Igniters by Silk Screening | |
WO2003015217A3 (de) | Elektrischer kontakt | |
EP0756325A3 (de) | Halbleitervorrichtung mit einem Träger | |
ES2084483T3 (es) | Procedimiento para presoldar una base de contacto para un dispositivo de conmutacion, y semiproducto para su empleo como base de contacto. | |
KR900001624A (ko) | 금속재료 상의 솔더피막 형성방법 | |
KR930009046A (ko) | 리드프레임 | |
CN110870085A (zh) | 具有表面安装在框架支承结构上的结构元件的光电装置和用于这种装置的可反射的复合材料 | |
RU2003100523A (ru) | Изделие с покрытием | |
KR101167650B1 (ko) | 반도체 장치용 리드 프레임 | |
JP2001015188A5 (es) | ||
KR970077583A (ko) | 리드 프레임과, 이 리드 프레임을 이용한 반도체 팩키지 | |
RU2002126596A (ru) | Слоистый электрический контакт | |
MY124980A (en) | Lead frame and method for plating the same | |
TH78708A (th) | กรอบตัวนำและวิธีการชุบกรอบตัวนำ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
Ref document number: 1047523 Country of ref document: ES |