Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Techwin Co LtdfiledCriticalSamsung Techwin Co Ltd
Priority to MYPI20005591ApriorityCriticalpatent/MY124980A/en
Publication of MY124980ApublicationCriticalpatent/MY124980A/en
A LEAD FRAME FOR A SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE LEAD FRAME.IN THE MANUFACTURE OF THE LEAD FRAME, A PROTECTIVE LAYER IS FORMED WITH NICKEL (Ni) OR Ni ALLOY ON A METAL SUBSTRATE (31), IN INTERMEDIATE LAYER (33) IS THEN FORMED WITH PALLADIUM (PD) OR PD ALLOY ON THE PROTECTIVE LAYER. THEN, PD AND GOLD (AU) ARE ALTERNATELY PLATED ON THE SURFACE OF THE INTERMEDIATE LAYER TO FORM AN OUTERMOST LAYER (34) INCLUDING BOTH PD AND AU PARTICLES THEREON.(FIG 8,9C)
MYPI20005591A2000-11-292000-11-29Lead frame and method for plating the same
MY124980A
(en)