SG11201408151XA - Electric contact and socket for electric parts - Google Patents
Electric contact and socket for electric partsInfo
- Publication number
- SG11201408151XA SG11201408151XA SG11201408151XA SG11201408151XA SG11201408151XA SG 11201408151X A SG11201408151X A SG 11201408151XA SG 11201408151X A SG11201408151X A SG 11201408151XA SG 11201408151X A SG11201408151X A SG 11201408151XA SG 11201408151X A SG11201408151X A SG 11201408151XA
- Authority
- SG
- Singapore
- Prior art keywords
- lllll
- layer
- llll
- electrical
- socket
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12875—Platinum group metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
Abstract
(i2) mwu ft iz s-5 iv x m £ titz s issaj n d9) mm IHMMi _ r4T» SI^HIB 2013# 12 fll2 0(12.12.2013) w , PO tpCT (10) WO 2013/183484 A1 (51) G01R 1/067 (2006.01) B23K35/26 (2006.01) C22C13/00 (2006.01) G01R 31/26 (2006.01) (21) (22) g&ttHQ: (25) (26) @(8&M©Wl§: (30) fiBfcftf '— 1 £: 4#Jg| 2012-128666 2012 ^6^ 6 0 (06.06.2012) JP (71) ttSJSi A: > ~3 7 X(ENPLAS CORPORA TION) [JP/JP]; T3320034 ±w3£!ftJII • 2TI 3 Of 1 Saitama(JP). (72) 'Mil ¥3A(ODA, Takahiro); T 3330844 if sRjnprfi±w*i TI 19#5 m Saitama (JP). (74) ft S A : {£ Sr , M- (SANO, Hiroshi et al.); T 1040042 Afp v 1 TI 2 #9-^ A TlMFt*jl/9® Tokyo (JP). (8i) (^ro&i^PBy, IS ^ PJ ft): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) (asrofci^isy > ±T(Dmm(Dfcm% 11^ nlfb): ARIPO (BW, GM, KE, GH, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), 3. — =j V 7 (AM, AZ, BY, KG, KZ, RU, TJ, TM), 3 — • V / ^ (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI H01R 13/03 (2006.01) H01R 13/24 (2006.01) H01R 33/76 (2006.01) PCT/JP2013/064708 2013 ^ 5 M 28 0(28.05.2013) (54) Title: ELECTRICAL CONTACTOR AND SOCKET FOR ELECTRICAL PART H ( > 54 mfiSPnnffl n X J *T V V- = [03] •t 00 •t oo i-H cn i-H o CJ o & 31... 32... 33... 34... BASIS MATERIAL Ni DEPOSIT (SUBSTRATE LAYER) Pd DEPOSIT Ag DEPOSIT (57) Abstract: [Problem] An electrical contactor which is prevented from adhering to a terminal of an electrical part after a continuity test and thus exhibits improved durability; and a socket for an electrical part, using the electrical contactor. [Solution] This electrical contactor comprises: the first layer made of a material in which Sn can be dissolved and diffused by heating; and the second layer which is formed on the outside of the first layer and which is made of a material such that the dissolution/diffusion of Sn in this material by heating is slower than that in the first layer. (57) [ISffl] #iIgiL?iCDf&\"£\ rmObw^-1 t Jb<s y # < d t £ i#jitLT, >TVVO m£bu?L&ztiz& y s ntfjgit 1 mt, %% Mi ic«fc y s BE£ 1 Jicj: y Ji<t WO 2013/183484 Al I lllll llllllll II llllll III lllll lllll lllll III III III lllll lllll lllll lllll llll llll lllllll llll llll (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). - (&&£ 21 &(3))
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012128666 | 2012-06-06 | ||
PCT/JP2013/064708 WO2013183484A1 (en) | 2012-06-06 | 2013-05-28 | Electrical contactor and socket for electrical part |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201408151XA true SG11201408151XA (en) | 2015-01-29 |
Family
ID=49711877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201408151XA SG11201408151XA (en) | 2012-06-06 | 2013-05-28 | Electric contact and socket for electric parts |
Country Status (9)
Country | Link |
---|---|
US (1) | US10096923B2 (en) |
EP (1) | EP2860533B1 (en) |
JP (2) | JP6502667B2 (en) |
CN (1) | CN104364660B (en) |
MY (1) | MY176738A (en) |
PH (1) | PH12014502715A1 (en) |
SG (1) | SG11201408151XA (en) |
TW (1) | TWI590533B (en) |
WO (1) | WO2013183484A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014182976A (en) * | 2013-03-21 | 2014-09-29 | Enplas Corp | Electric contact and socket for electric component |
JP6330689B2 (en) * | 2015-02-19 | 2018-05-30 | 株式会社オートネットワーク技術研究所 | Electrical contact pair and connector terminal pair |
US9847468B1 (en) * | 2016-06-20 | 2017-12-19 | Asm Technology Singapore Pte Ltd | Plated lead frame including doped silver layer |
JP6733491B2 (en) * | 2016-10-20 | 2020-07-29 | 株式会社オートネットワーク技術研究所 | Connection terminal and method of manufacturing connection terminal |
JP2018107011A (en) * | 2016-12-27 | 2018-07-05 | 株式会社エンプラス | Electric contact and socket for electric component |
JP6881972B2 (en) * | 2016-12-27 | 2021-06-02 | 株式会社エンプラス | Sockets for electrical contacts and electrical components |
CN112510434A (en) * | 2019-09-16 | 2021-03-16 | 康普技术有限责任公司 | Coaxial connector with axially floating inner contact |
KR102080832B1 (en) * | 2019-10-02 | 2020-02-24 | 황동원 | Spring contact and test socket with the spring contact |
JP6892621B1 (en) * | 2020-09-10 | 2021-06-23 | 千住金属工業株式会社 | Method for forming nuclear materials, electronic components and bump electrodes |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5568849A (en) * | 1978-11-17 | 1980-05-23 | Matsushita Electric Ind Co Ltd | Commutator of small dc motor |
US4529667A (en) * | 1983-04-06 | 1985-07-16 | The Furukawa Electric Company, Ltd. | Silver-coated electric composite materials |
US5139891A (en) * | 1991-07-01 | 1992-08-18 | Olin Corporation | Palladium alloys having utility in electrical applications |
JPH0555656A (en) * | 1991-08-29 | 1993-03-05 | Toyota Motor Corp | Electrode structure of piezoelectric element |
JP2895793B2 (en) * | 1995-02-24 | 1999-05-24 | マブチモーター株式会社 | Sliding contact material, clad composite material, commutator made of the same, and small DC motor using the commutator |
US5849424A (en) * | 1996-05-15 | 1998-12-15 | Dowa Mining Co., Ltd. | Hard coated copper alloys, process for production thereof and connector terminals made therefrom |
PT1047523E (en) * | 1998-06-10 | 2002-06-28 | Heraeus Gmbh W C | METHOD FOR THE PRODUCTION OF A LEAD FREE SUBSTRATE |
US6150041A (en) * | 1999-06-25 | 2000-11-21 | Delphi Technologies, Inc. | Thick-film circuits and metallization process |
JP3880877B2 (en) * | 2002-03-29 | 2007-02-14 | Dowaホールディングス株式会社 | Plated copper or copper alloy and method for producing the same |
CN100486046C (en) * | 2005-04-20 | 2009-05-06 | 爱斯佩克株式会社 | Ic socket |
JP4632358B2 (en) * | 2005-06-08 | 2011-02-16 | 三菱マテリアル株式会社 | Chip type fuse |
JP4653586B2 (en) | 2005-07-29 | 2011-03-16 | 株式会社東芝 | Electronics |
US8016624B2 (en) | 2005-09-22 | 2011-09-13 | Enplas Corporation | Electric contact and socket for electrical part |
JP2007271472A (en) * | 2006-03-31 | 2007-10-18 | Kanai Hiroaki | Dissimilar metal junction probe pin and its manufacturing method |
JP2008078032A (en) * | 2006-09-22 | 2008-04-03 | Alps Electric Co Ltd | Connecting device |
JP4834022B2 (en) * | 2007-03-27 | 2011-12-07 | 古河電気工業株式会社 | Silver coating material for movable contact parts and manufacturing method thereof |
JP4834023B2 (en) * | 2007-03-27 | 2011-12-07 | 古河電気工業株式会社 | Silver coating material for movable contact parts and manufacturing method thereof |
JP2009122087A (en) * | 2007-10-25 | 2009-06-04 | Micronics Japan Co Ltd | Alignment technique of probe card, probe system, and electronic device |
US20090246911A1 (en) * | 2008-03-27 | 2009-10-01 | Ibiden, Co., Ltd. | Substrate for mounting electronic components and its method of manufacture |
JP4808794B2 (en) * | 2008-03-28 | 2011-11-02 | パナソニック株式会社 | Semiconductor inspection equipment |
JP5657881B2 (en) * | 2009-12-09 | 2015-01-21 | 株式会社徳力本店 | Probe pin material |
JP5036892B2 (en) * | 2010-05-10 | 2012-09-26 | 株式会社神戸製鋼所 | Contact probe |
-
2013
- 2013-05-28 WO PCT/JP2013/064708 patent/WO2013183484A1/en active Application Filing
- 2013-05-28 EP EP13801082.2A patent/EP2860533B1/en active Active
- 2013-05-28 JP JP2014519931A patent/JP6502667B2/en active Active
- 2013-05-28 CN CN201380029941.1A patent/CN104364660B/en active Active
- 2013-05-28 SG SG11201408151XA patent/SG11201408151XA/en unknown
- 2013-05-28 MY MYPI2014703636A patent/MY176738A/en unknown
- 2013-05-28 US US14/405,974 patent/US10096923B2/en active Active
- 2013-05-31 TW TW102119291A patent/TWI590533B/en active
-
2014
- 2014-12-04 PH PH12014502715A patent/PH12014502715A1/en unknown
-
2018
- 2018-04-09 JP JP2018074933A patent/JP2018112561A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN104364660A (en) | 2015-02-18 |
PH12014502715B1 (en) | 2015-02-02 |
WO2013183484A1 (en) | 2013-12-12 |
TWI590533B (en) | 2017-07-01 |
EP2860533A1 (en) | 2015-04-15 |
CN104364660B (en) | 2018-09-21 |
EP2860533B1 (en) | 2020-12-02 |
TW201409852A (en) | 2014-03-01 |
MY176738A (en) | 2020-08-20 |
PH12014502715A1 (en) | 2015-02-02 |
EP2860533A4 (en) | 2016-05-25 |
JP2018112561A (en) | 2018-07-19 |
JPWO2013183484A1 (en) | 2016-01-28 |
US10096923B2 (en) | 2018-10-09 |
US20150126081A1 (en) | 2015-05-07 |
JP6502667B2 (en) | 2019-04-17 |
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