JP5657881B2 - Probe pin material - Google Patents
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- JP5657881B2 JP5657881B2 JP2009279730A JP2009279730A JP5657881B2 JP 5657881 B2 JP5657881 B2 JP 5657881B2 JP 2009279730 A JP2009279730 A JP 2009279730A JP 2009279730 A JP2009279730 A JP 2009279730A JP 5657881 B2 JP5657881 B2 JP 5657881B2
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- 239000000463 material Substances 0.000 title claims description 17
- 239000000523 sample Substances 0.000 title claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 15
- 239000000956 alloy Substances 0.000 claims description 15
- 238000004881 precipitation hardening Methods 0.000 claims description 10
- 229910002668 Pd-Cu Inorganic materials 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052702 rhenium Inorganic materials 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910002059 quaternary alloy Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 6
- 229910001252 Pd alloy Inorganic materials 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 229910001260 Pt alloy Inorganic materials 0.000 description 3
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 229910000575 Ir alloy Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Description
本発明は、半導体集積回路等の検査に用いるプローブピン用材料に関する。 The present invention relates to a probe pin material used for inspection of a semiconductor integrated circuit or the like .
電機・電子機器に使用される金属材料は、低い接触抵抗や耐食性に優れている等の特性が求められるため、Ａｇ−Ｐｄ−Ｃｕ合金が広く用いられている。近時においては、既存のＡｇ−Ｐｄ−Ｃｕ合金よりもさらに高い硬さの合金が求められる傾向にあり、その対策が要求されている。
また、半導体集積回路等の検査用プローブピン等のように、低い接触抵抗や耐食性の他に、硬さ（耐摩耗性）等が要求される場合があり、そのような場合には、塑性加工を施した状態で高い硬さを示すＰｔ合金やＩｒ合金等が好んで使用され、また、析出硬化するＡｕ合金やＰｔ合金が好んで使用されるようになった（例えば、特許文献１、特許文献２参照）。
Ag-Pd-Cu alloys are widely used because metal materials used in electric and electronic devices are required to have characteristics such as low contact resistance and excellent corrosion resistance. Recently, an alloy having a higher hardness than that of an existing Ag—Pd—Cu alloy tends to be required, and countermeasures are required.
In addition to low contact resistance and corrosion resistance, hardness (abrasion resistance) may be required, such as probe pins for inspection of semiconductor integrated circuits, etc. In such cases, plastic processing Pt alloy, Ir alloy, etc. which show high hardness in the state which gave it are used favorably, and Au alloy and Pt alloy which precipitate harden came to be used favorably (for example, patent documents 1, patent) Reference 2).
しかしながら、耐摩耗性を向上させる目的で、塑性加工を施した状態で高い硬さを示すＰｔ合金やＩｒ合金等を望む場合、一般的な加工自体が困難な場合が多い。特に、細線や薄板等の加工は不可能な場合があり、また、加工自体は可能であっても製造工程が多く複雑になってしまう場合が多い。さらに、これらの合金は、材料コストがＰｄ合金に比べ高価となる。
また、析出硬化するＡｕ合金やＰｄ合金等は、加工自体は容易であっても、析出硬化によって所望の硬さまで硬化しないものがある。
そこで、低い接触抵抗で耐食性に優れていて、高い硬さでかつ加工性に優れ、比較的に安価な材料が求められている。
本発明は、このような問題を解決することを課題とする。
However, in order to improve wear resistance, when a Pt alloy, Ir alloy, or the like that exhibits high hardness in a state of being subjected to plastic processing is desired, general processing itself is often difficult. In particular, processing of fine wires and thin plates may not be possible, and even if processing itself is possible, the manufacturing process is often complicated. Furthermore, these alloys are expensive in material cost compared to Pd alloys.
Further, some Au alloys, Pd alloys, and the like that are precipitation hardened may not be hardened to a desired hardness by precipitation hardening even if the processing itself is easy.
Accordingly, there is a demand for a material that is low in contact resistance and excellent in corrosion resistance, high in hardness, excellent in workability, and relatively inexpensive.
An object of the present invention is to solve such a problem.
そこで本発明は、Ａｇ２５〜５０質量％、Ｐｄ２５〜５０質量％、Ｃｕ１５〜４０質量％からなるＡｇ−Ｐｄ−Ｃｕ合金に、Ｉｎ０．１〜５質量％を添加し、圧延加工および/もしくは析出硬化により硬さを向上させ、合金の機械特性の向上すなわち耐摩耗性が向上したプローブピン用の材料とした。
なお、Ｉｎの添加量を０．１〜５質量％とする理由は、硬さを向上させるためであり、０．１質量％未満では硬さの向上の効果が得られず、また、５質量％を超えると加工性を劣化させるためである。
また、Ａｇの比率を２５〜５０質量％とした理由は、Ａｇは比抵抗を下げる役割があり、２５質量％未満だとその効果が少なく、５０質量％を超えると硬さが低下するためである。
ＰｄとＣｕは析出硬化に必要な成分であり、共に硬さの値を向上させるものである。
Ｐｄの比率を２５〜５０質量％とした理由は、Ｐｄが２５質量％未満だとその効果が少なく、５０質量％を超えると比抵抗が上がってしまい、プローブピンに向かないものとなる。
Ｃｕの比率を１５〜４０質量％とした理由は、Ｃｕが１５質量％未満だとその効果が少なく、４０質量％を超えると耐食性が低下してしまい、プローブピンに向かないものとなる。
さらに、上記Ａｇ−Ｐｄ−Ｃｕ−Ｉｎの４元合金に、用途に応じて特性を改善する添加元素として、Ａｕ、Ｐｔ、Ｒｅ、Ｒｈ、Ｃｏ、Ｎｉ、Ｓｉ、Ｓｎ、ＺｎもしくはＢの少なくとも１種を０．０１〜３質量％を添加することができる。
この添加理由は、硬さをさらに向上させるためである。また、Ａｕは耐酸化性、Ｐｔは耐化学薬品性についても有用であり、Ｒｅ、ＲｈおよびＮｉは結晶粒を微細化させる効果材としても作用する。これらの添加元素の配合量は、０．０１質量％未満では硬さの向上の効果が得られず、また、３質量％を超えると加工性が劣化する。
The present invention, Ag25～50 mass%, Pd25～50 wt%, the Ag-Pd-Cu alloy composed of Cu15~40 wt%, was added In0.1~5 mass%, rolling and / or precipitation hardening improve the hardness was thus a material for probe pins having improved improved i.e. the wear resistance of the mechanical properties of the alloy.
The reason for 0.1 to 5 wt% of the added amount of In is for improving the hardness, not to obtain the effect of improving the hardness is less than 0.1 wt%, and 5 mass This is because the workability deteriorates when the content exceeds 50%.
Also, the reason for the 25 to 50% by weight the proportion of Ag is, Ag has a role to lower the resistivity, less the effect when it is less than 25 mass%, in order to decrease the hardness exceeds 50 wt% is there.
Pd and Cu are components necessary for precipitation hardening, and both improve the hardness value.
The reason why the Pd ratio is 25 to 50% by mass is that if Pd is less than 25% by mass , the effect is small, and if it exceeds 50% by mass , the specific resistance increases and it is not suitable for the probe pin .
The reason why the Cu ratio is 15 to 40% by mass is that if Cu is less than 15% by mass , the effect is small, and if it exceeds 40% by mass , the corrosion resistance is lowered and it is not suitable for the probe pin .
Furthermore, at least one of Au, Pt, Re, Rh, Co, Ni, Si, Sn, Zn, or B is added as an additive element that improves the characteristics according to the application to the quaternary alloy of Ag—Pd—Cu—In. 0.01-3 mass % of seeds can be added.
The reason for this addition is to further improve the hardness. Au is also useful for oxidation resistance, Pt is useful for chemical resistance, and Re, Rh, and Ni also act as effect materials for refining crystal grains. If the blending amount of these additive elements is less than 0.01% by mass , the effect of improving the hardness cannot be obtained, and if it exceeds 3% by mass , the workability deteriorates.
このようにした本発明は、プローブピンとしての使用に適する低い接触抵抗でかつ耐食性に優れ、しかも高い硬さでかつ加工性に優れた材料とすることができる。 The present invention thus configured can be a material having low contact resistance and excellent corrosion resistance suitable for use as a probe pin , and having high hardness and excellent workability.
本発明の実施例を表１に示す。
各実施例では、Ｐｄ４元合金をガス溶解し、インゴット（高さ１０×幅２０×長さ３０）を作製した。その後、還元雰囲気中（Ｈ2とＮ2の混合雰囲気中）で溶体化処理（８００℃×１ｈｒ）を施したインゴットを高さ２×幅１０×長さ２０に切断し、断面減少率が約７５％になるように圧延したものを試験片とし、析出硬化の条件はＨ2とＮ2の混合雰囲気中にて３００〜５００℃×１ｈｒで行った。
また、試験片の硬さ測定は、試料の表面を研磨して平滑にした後、ビッカース硬さ試験機でＨＶ０．２にて測定した。表１に、各実施例の組成一覧と圧延加工後および析出硬化後の硬さを示す。
In each example, Pd quaternary alloy was dissolved in gas to produce an ingot (height 10 × width 20 × length 30). After that, the ingot subjected to the solution treatment (800 ° C. × 1 hr) in a reducing atmosphere (in a mixed atmosphere of H 2 and N 2 ) was cut into 2 × height 10 × length 20 and the reduction rate of the cross section was about The test piece was rolled to 75%, and the conditions for precipitation hardening were 300 to 500 ° C. × 1 hr in a mixed atmosphere of H 2 and N 2 .
Moreover, the hardness of the test piece was measured at HV0.2 with a Vickers hardness tester after the surface of the sample was polished and smoothed. Table 1 shows the composition list of each example and the hardness after rolling and precipitation hardening.
表１に示す結果より、例えば、比較例１の２５Ａｇ−５０Ｐｄ−２５Ｃｕ合金に比べて、実施例７のＩｎを０．１質量％、Ａｕを３．０質量％、Ｎｉを１．０質量％およびＺｎを０．３質量％添加した合金は、圧延加工材、およびＨ2とＮ2の混合雰囲気中で３８０℃×１ｈｒで行った析出硬化材として、共に硬さの向上を確認することができた。
また、比較例２の３０Ａｇ−３０Ｐｄ−４０Ｃｕ合金に比べて、実施例１８のＩｎを１．０質量％、Ｓｉを０．０１質量％およびＳｎを０．５質量％添加した合金は、圧延加工材、およびＨ2とＮ2の混合雰囲気中で３４０℃×１ｈｒで行った析出硬化材として、共に硬さの向上が確認できた。
また、比較例３の３０Ａｇ−４０Ｐｄ−３０Ｃｕ合金に比べて、実施例１のＩｎを３．０質量％添加した合金は、圧延加工材、およびＨ2とＮ2の混合雰囲気中で３６０℃×１ｈｒで行った析出硬化材として、共に硬さの向上が確認できた。
さらに、比較例４〜６の各Ｐｄ合金に対して、同程度のＰｄ合金にＩｎを０．１〜５質量％添加した合金、又は、同程度のＰｄ合金にＩｎを０．１〜５質量％添加し、さらにＡｕ、Ｐｔ、Ｒｅ、Ｒｈ、Ｃｏ、Ｎｉ、Ｓｉ、Ｓｎ、ＺｎもしくはＢの少なくとも１種を０．０１〜３質量％添加した各合金においては、圧延加工材および析出硬化材として、共に硬さの向上を確認することができた。
From the results shown in Table 1, for example, in comparison with the 25Ag-50Pd-25Cu alloy of Comparative Example 1, 0.1 mass % of In, 3.0 mass % of Au, and 1.0 mass % of Ni in Example 7 It is confirmed that the alloy added with 0.3% by mass of Zn and Zn is confirmed to have improved hardness as a rolled material and as a precipitation hardening material performed at 380 ° C. × 1 hr in a mixed atmosphere of H 2 and N 2. did it.
Further, compared with the 30Ag-30Pd-40Cu alloy of Comparative Example 2, the alloy of Example 18 with 1.0% by mass of In , 0.01% by mass of Si , and 0.5% by mass of Sn is rolled. As a precipitation hardening material performed at 340 ° C. × 1 hr in a mixed atmosphere of H 2 and N 2 , it was confirmed that the hardness was improved.
Further, as compared with 30Ag-40Pd-30Cu alloy of Comparative Example 3, the alloy with the addition of In of Example 1 3.0% by mass, rolling material, and H 2 and 360 ° C. × in a mixed atmosphere of N 2 As a precipitation hardening material performed for 1 hr, it was confirmed that the hardness was improved.
Furthermore, the alloy for each Pd alloy of Comparative Example 4-6, and the In the comparable Pd alloy was added 0.1 to 5 wt%, or 0.1 to 5 mass In the comparable Pd alloy %, And in each alloy to which at least one of Au, Pt, Re, Rh, Co, Ni, Si, Sn, Zn or B is added in an amount of 0.01 to 3% by mass , a rolled material and a precipitation hardening material As a result, it was confirmed that the hardness was improved.
Claims (2)
Ａｇ２５〜５０質量％、Ｐｄ２５〜５０質量％、Ｃｕ１５〜４０質量％からなるＡｇ−Ｐｄ−Ｃｕ合金に、Ｉｎ０．１〜５質量％を添加し、圧延加工および/もしくは析出硬化により硬さを向上させたことを特徴とするプローブピン用材料。 In a probe pin material having three elements of Ag—Pd—Cu as basic components,
Ag25~50 wt%, Pd25～50 wt%, the Ag-Pd-Cu alloy composed of Cu15~40 wt%, was added In0.1~5 mass%, improved hardness by rolling and / or precipitation hardening A material for a probe pin characterized by having been made.
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| JP2009279730A JP5657881B2 (en) | 2009-12-09 | 2009-12-09 | Probe pin material |
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| JP5657881B2 true JP5657881B2 (en) | 2015-01-21 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI794355B (en) * | 2017-12-27 | 2023-03-01 | 日商德力本店股份有限公司 | Precipitation hardening ag-pd-cu-b-based alloy |
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| US20130292008A1 (en) * | 2010-12-09 | 2013-11-07 | Tokuriki Honten Co., Ltd. | Material for Electrical/Electronic Use |
| JP5767484B2 (en) * | 2011-02-01 | 2015-08-19 | ササキジェム株式会社 | Silver base alloy |
| JP4878401B1 (en) * | 2011-05-17 | 2012-02-15 | 石福金属興業株式会社 | Probe pin material, probe pin and manufacturing method thereof |
| WO2013099682A1 (en) * | 2011-12-27 | 2013-07-04 | 株式会社徳力本店 | Pd ALLOY FOR ELECTRIC/ELECTRONIC DEVICES |
| WO2013183484A1 (en) * | 2012-06-06 | 2013-12-12 | 株式会社エンプラス | Electrical contactor and socket for electrical part |
| US9804198B2 (en) | 2012-08-03 | 2017-10-31 | Yamamoto Precious Metal Co., Ltd. | Alloy material, contact probe, and connection terminal |
| CN104685083A (en) * | 2012-09-28 | 2015-06-03 | 株式会社德力本店 | Ag-Pd-Cu-Co alloy for uses in electrical/electronic devices |
| US10385424B2 (en) | 2016-01-29 | 2019-08-20 | Deringer-Ney, Inc. | Palladium-based alloys |
| EP3594756B1 (en) * | 2018-07-10 | 2021-05-12 | Blancpain SA | Timepiece component with arboured portion made of non-magnetic alloy |
| JP7141098B2 (en) * | 2018-10-02 | 2022-09-22 | 石福金属興業株式会社 | Materials for probe pins and probe pins |
| JP6734486B2 (en) * | 2018-11-06 | 2020-08-05 | 株式会社徳力本店 | Pd alloy for electric/electronic equipment, Pd alloy material, probe pin and manufacturing method |
| JP7260910B2 (en) * | 2019-11-22 | 2023-04-19 | 石福金属興業株式会社 | Materials for probe pins and probe pins |
| EP3960890A1 (en) * | 2020-09-01 | 2022-03-02 | Heraeus Deutschland GmbH & Co. KG | Palladium copper silver ruthenium alloy |
| JP7429011B2 (en) | 2020-12-21 | 2024-02-07 | 石福金属興業株式会社 | Probe pin materials and probe pins |
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| JPS59107050A (en) * | 1982-12-09 | 1984-06-21 | Tanaka Kikinzoku Kogyo Kk | Sliding contact material |
| JPS59182932A (en) * | 1983-03-31 | 1984-10-17 | Tanaka Kikinzoku Kogyo Kk | Sliding contact material |
| JPS59229445A (en) * | 1983-06-08 | 1984-12-22 | Tanaka Kikinzoku Kogyo Kk | Sliding contact material |
| JPS60131718A (en) * | 1983-12-20 | 1985-07-13 | 田中貴金属工業株式会社 | Slide contact unit |
| JPS60138868A (en) * | 1983-12-27 | 1985-07-23 | 田中貴金属工業株式会社 | Slide contact unit |
| JP3048472B2 (en) * | 1992-08-19 | 2000-06-05 | 東京エレクトロン株式会社 | Probe device and probe needle |
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| TWI794355B (en) * | 2017-12-27 | 2023-03-01 | 日商德力本店股份有限公司 | Precipitation hardening ag-pd-cu-b-based alloy |
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