CN100486046C - Ic socket - Google Patents
Ic socket Download PDFInfo
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- CN100486046C CN100486046C CNB2006100758429A CN200610075842A CN100486046C CN 100486046 C CN100486046 C CN 100486046C CN B2006100758429 A CNB2006100758429 A CN B2006100758429A CN 200610075842 A CN200610075842 A CN 200610075842A CN 100486046 C CN100486046 C CN 100486046C
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Abstract
An IC socket comprises a plurality of conductive connecting sections each having a holding section for holding one of a plurality of lead terminals of an IC; and a plurality of conductive coil springs, which are protruded from the IC socket and respectively fixed to the conductive connecting sections, the conductive springs being closer to a circuit board than the conductive connecting sections.
Description
Technical field
The present invention relates to some lead terminals of IC be located at the IC socket that the electrode on the circuit substrate is electrically connected.It especially can be suitable for resistant to elevated temperatures IC socket.
Background technology
For lead terminal and the circuit substrate given prominence to from IC are electrically connected, the past is used the IC socket always.In this IC socket, make the contact plug of giving prominence to towards the outside from the IC socket carry out soldering then by the hole that is formed on the circuit substrate, perhaps utilize the direct soldering of electric wire on contact plug, to be electrically connected.
Herein, the IC socket is running stores, also can change it.In this case, in the IC of above-mentioned structure socket, must dissolve scolding tin and just can change, therefore, it is very complicated to change technology.
And, in IC socket field, for example under 400 ℃ the condition of high temperature, need the IC socket that can be connected IC with circuit substrate sometimes.Because general circuit substrate does not have thermal endurance, therefore, is not suitable for use in the circuit substrate that is connected with this IC socket.Therefore, for example consider to use the circuit substrate that constitutes by ceramic substrate, still since ceramic substrate can only make 200 millimeters square about, price is very high simultaneously.In addition, promptly allow to use ceramic substrate, so, under 400 ℃ the condition of high temperature, can not use scolding tin.Therefore, have to carry out silver (Ag) weldering or electric welding, so, owing to have a large amount of tie points at very narrow interval, therefore, price is very high.In addition, if adopt the mode of silver (Ag) weldering or electric welding to be connected with contact plug, so, it is just no longer easy to change the IC socket.
Therefore, in order to make replacing simple for process, for example, as shown in figure 15, be used for the IC socket 100 that the pad 121 of lead terminal of giving prominence to from IC111 112 and circuit substrate 120 is electrically connected is being sold.The circuit substrate that is connected with this IC socket 100 is for example implemented ceramic coat on metal, solder pad on this ceramic coat surface, thus contact plug is contacted with this pad.
Detailed condition is as shown in the drawing, and in the inside of IC socket 100, the contact plug 102 that is made of electroconductive component embeds in the through hole 101 that runs through these IC socket 100 surfaces and the back side.Contact plug 102 has clamping section 102a at upside, and it can clamp the outstanding lead terminal 112 from above-mentioned IC111.In addition, the bottom of contact plug 102 becomes the protuberance 102b that gives prominence to from IC socket 100.By the screw 103 that runs through IC socket 100 is connected with circuit substrate 120, so the top of the protuberance 102b in some contact plugs 102 just contacts with the pad 121 of circuit substrate 120.Like this, owing to do not need to carry out the technology of silver (Ag) weldering or electric welding, therefore, the replacing of IC socket 100 also becomes and is easy to.
But in the IC of above-mentioned structure socket 100, the top of all protuberance 102b is difficult to contact with the pad 121 of circuit substrate 120 equably, therefore, so just might come in contact bad.
Therefore, in order to address this problem, for example, in Japanese publication communique " spy opens 2001-267029 communique (September 28 calendar year 2001 is open) ", avoid coming in contact bad by utilizing spring to suppress contact plug.
In other words, as shown in figure 16, in Japanese publication communique " spy opens 2001-267029 communique (September 28 calendar year 2001 open) " in the disclosed IC socket, the soldering ball 211 that makes IC encapsulation 210 is arranged on the socket main body 201 with the contact plug 230 that the pad 221 of circuit substrate 220 is electrically connected.
This contact plug 230 possesses as lower member: have the sleeve pipe 231 of the external diameter expansion section 231a that a part of external diameter broadens, freely move up and down from the below and insert plunger 232 in this sleeve pipe 231, make sleeve pipe 231 suppress and make the helical spring 233 that plunger 232 suppresses towards the below towards the top.Sleeve pipe 231 is being set up relative to the mode that socket main body 201 easy on and off move, simultaneously, the ball contact site 234 of sleeve pipe 231 upper ends contacts and is electrically connected with the following soldering ball 211 that is located at IC encapsulation 210, and the bottom of plunger 232 contacts and is electrically connected with the pad 221 of circuit substrate 220.
Like this, just can under the situation that has some contact plugs 230, avoid the loose contact of the pad 221 of a part of contact plug 230 and circuit substrate 220.
But, in above-mentioned existing Japanese publication communique " spy opens 2001-267029 communique (September 28 calendar year 2001 open) " in the disclosed IC socket, because the bottom of plunger 232 is roughly some contact with the contacting of pad 221 of circuit substrate 220 in the contact plug 230, therefore, when plunger 232 deforms because of heat, when perhaps producing oxide-film between the bottom of pad 221 and plunger 232, come in contact bad such problem easily.
Summary of the invention
The object of the present invention is to provide a kind of not only being easy to change, and can avoid the IC socket with the circuit substrate loose contact.
For achieving the above object, IC socket of the present invention possesses: have the some lead terminals that clamp IC respectively the clamping section conductivity each linking part and be fixed on the above-mentioned linking part and each spring of outstanding conductivity from this linking part towards circuit substrate.
According to above-mentioned invention, some lead terminals of IC are inserted in the clamping section of linking part in the IC socket, so it is just clamped by this clamping section.Because each spring of outstanding conductivity is fixed on the linking part from this linking part towards circuit substrate, therefore, by they are contacted with it near the electrode of circuit substrate and with the state that pushes, so each spring contacts with electrode under the state that suppresses.
Adopt the result of this mode to be, even the length of several springs is slightly different, all springs still can contact with the electrode of each circuit substrate exactly.
In addition, when each spring is suppressing under the state in electrode contacts, because spring is the face contact, therefore, can not come in contact badly, and the resistance when contacting with electrode is also very little.
Because only spring is contacted with squeezed state with the electrode of circuit substrate, and do not carry out silver (Ag) weldering or electric welding, therefore, the replacing of IC socket also is easy to.
Therefore, so just can provide a kind of and not only change easily, but also can avoid taking place IC socket with the loose contact of circuit substrate.
Other purpose of the present invention, feature and advantage can be clear fully by following explanation.Advantage of the present invention is by also understanding with reference to the description of the drawings.
Brief Description Of Drawings
Fig. 1 (a) is the schematic diagram of an execution mode of IC socket among the present invention, and it is the sectional drawing of X-X line among Fig. 4 (a).
Fig. 1 (b) is the enlarged drawing of major part in the contact plug of above-mentioned IC socket and the helical spring structure.
Fig. 2 is the side view that the state of IC is installed on the above-mentioned IC socket that is connected with substrate.
Fig. 3 is the structure oblique view of above-mentioned IC socket and IC.
Fig. 4 (a) is the structural plan figure of above-mentioned IC socket.
Fig. 4 (b) is the structural representation of above-mentioned IC socket, and it is the sectional drawing of Y-Y line among Fig. 4 (a).
Fig. 4 (c) is the sectional drawing of major part in the contact plug of above-mentioned IC socket and the helical spring mounting structure.
Fig. 5 is the structural plan figure that connects the substrate of above-mentioned IC socket.
Fig. 6 is the structure oblique view of socket conducting portion in the above-mentioned IC socket.
Fig. 7 is the front elevation of the IC socket that is connected with aforesaid substrate.
Fig. 8 (a) is the front elevation of the distortion example of spring.
Fig. 8 (b) is the front elevation of the distortion example of spring.
Fig. 9 (a) is the front elevation with contact plug of short wide part.
Fig. 9 (b) is the side view with contact plug of short wide part.
Figure 10 tilts above-mentioned contact plug and the front elevation of the IC socket installed.
Figure 11 is the front elevation that is provided with the contact plug of a bend.
Figure 12 is the front elevation that is provided with the contact plug of several bends.
Figure 13 (a) is the sectional drawing of other execution mode of IC socket among the present invention.
Figure 13 (b) is the major part enlarged drawing of contact plug in the IC socket of Figure 13 (a), helical spring and columnar part structure.
Figure 14 (a) has the major part enlarged drawing of columnar part structure that contact plug is inserted the tubular through hole of its central part.
Figure 14 (b) is the upward view of state of watching the structure of Figure 14 (a) from the circuit substrate side.
Figure 14 (c) makes columnar part contact with pad and makes major part enlarged drawing under the helical spring contraction state.
Figure 15 is the structure section figure of existing IC socket.
Figure 16 is the structure section figure of existing other IC socket.
Concrete execution mode
(execution mode 1)
As described below, referring to figs. 1 through Figure 12 an embodiment of the invention are described.In addition, even the IC socket of present embodiment for example also can be connected with circuit substrate under 400 ℃ the condition of high temperature, and the replacing of IC socket is also simple.
As shown in Figure 2, the IC socket 10 in the present embodiment is used for being electrically connected from outstanding lead terminal 21 of IC20 and pad 31 as circuit substrate 30 electrodes.
As shown in Figure 3, for example, some lead terminals 21 of an above-mentioned IC20 side and central authorities not shown in the figures from the side are outstanding towards the below, and as Fig. 4 (a) shown in, these lead terminals 21 insertions are formed in the lead terminal patchhole 11 on IC socket 10 surfaces.
On the other hand, as shown in Figure 5, circuit substrate 30 with above-mentioned lead terminal 21 man-to-man correspondence positions on form pad 31 respectively, extend wiring figure 32 respectively from each pad 31.This circuit substrate 30 is by implementing glass coating or ceramic coat on for example anti-400 ℃ metal, the mode of solder pad 31 forms then.
Shown in Fig. 4 (b), in the inner space portion 12 of the inside of above-mentioned IC socket 10 formation as cylindrical recess.In this inner space portion 12, except forming the above-mentioned lead terminal patchhole 11 that extends towards the surface of IC socket 10 from the upper end of this inner space portion 12, simultaneously, also shown in Fig. 4 (c), form the outstanding hole 12d that uses of contact plug that extends towards the back side of IC socket 10 from the lower end of this inner space portion 12.
Above-mentioned clamping section 14a forms by a banded metallic plate is bent to the shape that slightly is the U word, and the part of each plate by making free end one side is in contact with one another, and just can be clamped in the lead terminal 21 of above-mentioned IC20 between them.In addition, at the 14c of pedestal portion of the bottom formation level of the clamping section 14a that slightly is the U word shape, simultaneously, make and the top is that the contact plug 14b of wedge angle hangs down from the end of the 14c of this pedestal portion by metallic plate.
Shown in Fig. 4 (c), the above-mentioned pedestal 14c of portion is put on the 12c of the bottom of inner space portion 12.
Therefore, in the present embodiment, shown in Fig. 4 (b), in order can to put the 14c of pedestal portion of socket conducting portion 14 on the 12c of the bottom of inner space portion 12, form double-deckers: as the 10a of upper layer main body portion of upper strata socket main body and the main part 10b of lower floor as lower floor's socket main body as the IC socket 10 of IC socket main body.In other words, when in the inner space portion 12 that socket conducting portion 14 is packed into the time, make 10a of upper layer main body portion and the main part 10b of lower floor be in released state.And after on the bottom 12c that the 14c of pedestal portion of socket conducting portion 14 is put inner space portion 12 in the main part 10b of lower floor, by covering the upper layer main body 10a of portion, just socket conducting portion 14 can be contained in the inner space portion 12 of IC socket 10.
Herein, shown in Fig. 4 (c) and Fig. 1 (a), Fig. 1 (b), on the socket conducting portion 14 in the present embodiment, helical spring 15 is wound onto on the contact plug 14b of socket conducting portion 14.This helical spring 15 for example is made of gold-plated line, thus the resistance decreasing when it is contacted with pad 31.In addition, in the present invention, helical spring 15 is not limited to gold-plated line, also can use other lead.
Above-mentioned helical spring 15 upper end one side of contact plug 14b in above-mentioned socket conducting portion 14 is fixed on this contact plug 14b, and like this, contact plug 14b and helical spring 15 just are electrically connected together.In addition, when the free end of helical spring 15 under the state that stretches, it is outstanding from the top of contact plug 14b.
Herein, in the present embodiment, for above-mentioned helical spring 15 being fixed on the contact plug 14b of socket conducting portion 14, at the slot part 14d of the bottom of contact plug 14b formation as groove.Therefore, so just can be installed in helical spring 15 on the socket conducting portion 14 at an easy rate.
In addition, be used for that this IC socket 10 is fixed on bolt 16 on the circuit substrate 30 and run through four jiaos of the IC socket 10 shown in Fig. 4 (a) and corresponding with this position of circuit substrate 30 shown in Figure 5 and in the bolt hole 33 that wears.
Below the installation method that the IC socket 10 of above-mentioned structure is installed on the circuit substrate 30 is described.
At first, the IC socket 10 shown in Fig. 4 (b) is in be separated into the state of 10a of upper layer main body portion and the main part 10b of lower floor.Then, it is outstanding with among the 12d of hole that the contact plug 14b of socket conducting portion 14 is inserted the contact plug as the lower interior part spatial portion 12b downside of recess that is present among the main part 10b of lower floor, and the 14c of pedestal portion of socket conducting portion 14 is put on the bottom 12c of lower interior part spatial portion 12b.Then, make the upper strata inner space portion 12a of the clamping section 14a embedding of socket conducting portion 14, make the 10a of upper layer main body portion cover the main part 10b of lower floor as the recess of the 10a of upper layer main body portion.
Below, as shown in Figure 7,, and after running through IC socket 10 and circuit substrate 30, be screwed together with nut 17 from the upside inserting bolt 16 of IC socket 10.Like this, helical spring 15 contacts with the pad 31 of circuit substrate 30, and, by with the screwing togather of nut 17, spring 15 shrinks under the state that suppresses pad 31, simultaneously, the top of contact plug 14b will contact with pad 31.
Then, as Fig. 2 and shown in Figure 3, the lead terminal 21 of IC20 is inserted in the lead terminal patchhole 11 on the surface that is present in IC socket 10.Like this, the lead terminal 21 of IC20 is electrically connected by the pad 31 of IC socket 10 with circuit substrate 30.
At this moment, shown in Fig. 1 (b), when the top of the contact plug 14b of socket conducting portion 14 contacted with the pad 31 of circuit substrate 30, helical spring 15 also contacted with 31 of pads, therefore, so just can avoid loose contact.
In addition, in the above description, be that example is illustrated with helical spring 15 as spring, still not limited thereto in the present invention, can also use other spring.
For example, also can use as Fig. 8 (a), wire form springs 45a, 45b shown in Fig. 8 (b) are as spring.That is to say that wire form springs 45a is made of the arc wire form springs that is installed on the contact plug 14b.And wire form springs 45b is made of the wire form springs that is installed in the V-shape on the contact plug 14b.
On the other hand, the contact plug 14b in the above-mentioned explanation has rigidity, but in the present invention, not limited thereto, contact plug 14b also can have elasticity.
For example, shown in Fig. 9 (b), can set in advance angle of bend θ at mid portion by the banded dull and stereotyped contact plug 14b that is constituted of rubber-like.Like this, when contact plug 14b contact pad 31, because contact plug 14b bending, therefore, the contact of the top of contact plug 14b and pad 31 increases.In addition, in this case, shown in Fig. 9 (a), preferably be provided with short wide 41 at the sweep of contact plug 14b in advance, make the narrowed width of contact plug 41b.Like this, contact plug 14b will become and be easy to bending.
In addition, as shown in figure 10, not only can be vertically mounted on contact plug 14b on the IC socket 10, it is mounted obliquely within on the IC socket 10.Like this, when contact plug 14b contacted with pad 31, contact plug 14b was also flexible towards the side that tilts, and therefore, compares with the mode of vertical installation contact plug 14b, adopts this mode, and the contact of contact plug 14b and pad 31 is higher.
On the other hand, because contact plug 14b has elasticity, therefore, as shown in figure 11, can on contact plug 14b, set in advance bend 42.Like this, because this bend 42 is flexible along the direction of principal axis of contact plug 14b, therefore, can improve the contact of contact plug 14b and pad 31.In addition, this bend 42 does not exist only in a place on contact plug 14b, as shown in figure 12, the bend 42 in some places can also be set.Like this, just can increase the elastic force of contact plug 14b.
As mentioned above, in the IC of present embodiment socket 10, some lead terminals 21 of IC20 are inserted in the IC socket 10 among the clamping section 14a as the socket conducting portion 14 of linking part, and like this, it is just clamped by this clamping section 14a.30 outstanding each helical springs 15 with conductivity are fixed on the socket conducting portion 14 from this socket conducting portion 14 towards circuit substrate, therefore, by making it near the pad 31 of circuit substrate 30 and contact with it under squeezed state, like this, each helical spring 15 just contacts with pad 31 suppressing under the state.
Like this, even the length of several helical springs 15 is slightly different, can guarantee that still all helical springs 15 contact with the pad 31 of each circuit substrate 30.That is, by the elasticity of spring, owing to be difficult for the position deviation that generation causes because of vibration or thermal deformation etc., therefore, the change of contact tails off.
Because the pad 31 of helical spring 15 and circuit substrate 30 is contacted with squeezed state, do not carry out silver (Ag) yet and weld or electric welding, therefore, the replacing of IC socket 10 also is easy to.
Therefore, so just can provide a kind of and not only change easily, but also can avoid taking place IC socket 10 with the loose contact of circuit substrate 30.
In addition, in the present invention, 0000 can on socket conducting portion 14, not establish contact plug 14b as linking part yet.That is to say,, still can provide a kind of IC socket 10 that can avoid taking place with circuit substrate 30 loose contacts even if helical spring 15 directly is connected with the clamping section 14a of socket conducting portion 14.
In addition, in the IC of present embodiment socket 10, socket conducting portion 14 has respectively towards the outstanding contact plug 14b of circuit substrate 30, and simultaneously, each helical spring 15 is fixed on the contact plug 14b, and 30 outstanding from contact plug 14b towards circuit substrate.
Like this, even under the situation of existing IC socket 10 outstanding several contact plugs 14b, because helical spring 15 is fixed on the contact plug 14b, and 30 outstanding from this contact plug 14b towards circuit substrate, therefore, it can avoid taking place the loose contact with circuit substrate 30.
In addition, when contacting with pad 31 under the state that helical spring 15 and wire form springs 45a, 45b as each spring are suppressing, they become spring and contact with some points of contact plug 14b on pad 31.Therefore, for example, even take place as contact plug 14b because of thermal deformation, perhaps the such degradation phenomena of generation oxide-film between pad 31 and contact plug 14b still can not come in contact bad on the whole.
Especially using under the situation of helical spring 15 as spring and since each helical spring 15 when under suppressing state, contact with pad 31 helical spring 15 be that face contacts, therefore, can not come in contact bad on the whole really.That is to say,, therefore, be not subject to the influence of above-mentioned deterioration, can link together steadily in the long term because contact plug 14b is in two local connections of point and face with helical spring 15.So just can improve the contact reliability of IC20 and circuit substrate 30.
In this structure, just can guarantee that all contact plug 14b contact with pad 31 equably owing to need not accurately to set the length of contact plug 14b, therefore, can reach the purpose of reduction manufacturing cost.
In addition, in the IC of present embodiment socket 10, the clamping section 14a and the contact plug 14b of socket conducting portion 14 are integrally formed.
So, have the clamping section 14a of the lead terminal 12 that can connect IC20 and the body socket conducting portion 14 of the contact plug 14b that contacts with circuit substrate 30 by use, just can reach the purpose that reduces number of spare parts.
In addition, in the IC of present embodiment socket 10, the IC socket main body is made of the bilayer that is separable into 10a of upper layer main body portion and the main part 10b of lower floor, forms inner space, upper strata 12a of portion and the lower interior part spatial portion 12b that holds socket conducting portion 14 in 10a of upper layer main body portion and the main part 10b of lower floor respectively.
Like this, when in the inner space portion 12 that socket conducting portion 14 is packed into, because IC socket 10 can be separated into the 10a of upper layer main body portion and the main part 10b of lower floor is two-layer, therefore, can be contained in socket conducting portion 14 among inner space, upper strata 12a of portion and the lower interior part spatial portion 12b at an easy rate.
In addition, in the IC of present embodiment socket 10, on the contact plug 14b of socket conducting portion 14, form the slot part 14d that is used for fixing helical spring 15 and wire form springs 45a, 45b.
So, when helical spring 15 and wire form springs 45a, 45b being fixed on contact plug 14b when going up, helical spring 15 and wire form springs 45a, 45b embed among the slot part 14d, like this, just can be fixed on helical spring 15 and wire form springs 45a, 45b on the contact plug 14b at an easy rate.
In addition, not limited thereto in the present embodiment, for example, helical spring 15 and wire form springs 45a, 45b also can be weldingly fixed on the contact plug 14b.
In the IC of present embodiment socket 10, contact plug 14b preferably has elasticity.Like this, just can at contact plug 14b in the pad 31 of circuit substrate 30 contacts, improve the contact of the pad 31 of contact plug 14b and circuit substrate 30.
In addition, in the IC of present embodiment socket 10, helical spring 15 and wire form springs 45a, 45b are preferably made by gold-plated line.
Because the resistance of gold-plated line is less, therefore, so just can further dwindle the resistance when contacting with pad 31.
(execution mode 2)
Below with reference to Figure 13 and Figure 14, other execution mode of the present invention is described.For convenience of explanation, have the identical symbol of mark on the parts of identical function with each parts shown in the aforementioned embodiments 1, and omitting its explanation.
Shown in Figure 13 (a), Figure 13 (b), the IC socket 50 of present embodiment and the difference of the IC socket 10 in the aforementioned embodiments 1 are that columnar part 51 is fixed on an end of the circuit substrate 30 of helical spring 15.
In other words, in the IC socket 10 in aforementioned embodiments 1, helical spring 15 itself is exactly a connector, but in the IC socket 50 in the present embodiment, connector is mounted in the columnar part 51 on helical spring 15 tops.In addition, columnar part 51 may not be a cylinder accurately, also can implement chamfering to it.Above-mentioned columnar part 51 is fixed on the helical spring 15, and like this, helical spring 15 is electrically connected with columnar part 51.In addition, identical with aforementioned embodiments 1, the upper end of the contact plug 14b in socket conducting portion 14 for example is fixed on the contact plug 14b helical spring 15 by modes such as welding, so contact plug 14b just is electrically connected together with helical spring 15.
The result is shown in Figure 13 (b), and columnar part 51 contacts with 31 of pads.Therefore, compare contact area with helical spring 15 and increase, even, also be difficult to come in contact bad because of the distortion under the condition of high temperature changes.
In addition, though above-mentioned columnar part 51 is fixed on the top of helical spring 15 by methods such as for example welding, and is also not limited thereto, for example, shown in Figure 14 (a), Figure 14 (b), also can adopt the columnar part of fixing by coiling helical spring 15 52.
In other words, columnar part 52 has the 52a of connector portion and spring holder around the 52b of portion, and above-mentioned helical spring is coiled in the surface of above-mentioned spring holder around the 52b of portion, so columnar part 52 just is fixed on the helical spring 15.
In this way, columnar part 52 exactly with pad 31 vertical contacts, even the variation that causes because of the distortion under the condition of high temperature takes place, also be difficult to come in contact bad.
Because the top of the above-mentioned connector 52a of portion on circuit substrate 30 is planar, therefore, columnar part 52 just contacts with 31 of pads.Therefore, compare contact area with helical spring 15 and increase, even generation also is difficult to come in contact bad because of the variation that the distortion under the condition of high temperature causes.
In addition, shown in Figure 14 (a), Figure 14 (b), on columnar part 52, be provided with as the through hole 52c that above-mentioned contact plug 14b is inserted the cylindrical hole of central part.The internal diameter of this through hole 52c is more roomy than the plate of contact plug 14b, and like this, contact plug 14b just can form loose fit with through hole 52c.
Therefore, shown in Figure 14 (c), by this through hole 52c is set, when helical spring 15 shrank, the top of the contact plug 14b of socket conducting portion 14 just was inserted in this columnar part 52.So spring shrinks when the columnar part contact electrode, so contact plug inserts in the columnar part hole, therefore, columnar part is parallel with contact plug to be moved.Therefore, columnar part just contacts with pad is vertical exactly.
Though above-mentioned columnar part 52 has through hole 52c cylindraceous, and is also not limited thereto,, be not limited to cylindric so long as contact plug 14b can become loose fit with through hole.For example, it also can be prismatic tube.And, also can have the recess of wall of tube.
In addition, in the present embodiment, on columnar part 52, be provided with through hole 52c, but be not limited to through hole, so long as the hole that contact plug 14b inserts gets final product.
In addition, above-mentioned through hole 52c is formed at the center of columnar part 52, but also not limited thereto, also can be formed at off-centered position.
In the IC socket 50 in the present embodiment, the surface of columnar part 51,52 is preferably by gold-plated.
Like this, because gold-plated resistance is little, therefore, can further reduce the resistance when contacting with pad 31.
In the present embodiment, helical spring 15 preferably also is gold-plated line.
So,, therefore, can further reduce the resistance of contact plug 14b and columnar part 51,52 because the resistance of gold-plated line is little.
As mentioned above, in IC socket of the present invention, each linking part preferably all has towards the outstanding contact plug of circuit substrate, and simultaneously, each spring also preferably all is fixed on the above-mentioned contact plug, and outstanding from this contact plug towards circuit substrate.
So,, because spring is fixed on the contact plug, and outstanding, therefore, still can avoid taking place phenomenon with the circuit substrate loose contact from this contact plug towards circuit substrate even from outstanding several contact plugs of existing IC socket.
Particularly suppressing under the state when contacting when each spring with electrode, because constituting spring contacts with some points of contact plug, so, even for example contact plug is out of shape because of heat, perhaps between electrode and contact plug, produce oxide-film, also can not come in contact bad on the whole.
In addition, in IC socket of the present invention, the columnar part of conductivity preferably is fixed on the top of the circuit substrate side of spring.Like this, compare with spring, the contact area of the electrode of it and circuit substrate increases.
The result is, even generation also is difficult to come in contact bad because of the variation that the distortion under the condition of high temperature causes.
In addition, be preferably in and form the hole of inserting linking part on the columnar part, simultaneously, spring preferably is coiled in the surface of above-mentioned columnar part.
Like this, spring shrinks when columnar part contacts with electrode, so contact plug inserts in the columnar part hole, therefore, columnar part is parallel with contact plug to be moved.Therefore, columnar part just contacts with pad is vertical exactly.
Like this, the installation accuracy of IC socket improves, even generation also is difficult to come in contact bad because of the variation that the distortion under the condition of high temperature causes.
In addition, in IC socket of the present invention, the clamping section of linking part and contact plug are preferably integrally formed.
Like this, have the clamping section of the lead terminal that can connect IC and the one linking part of the contact plug that contacts with circuit substrate by use, just can reach the purpose that reduces number of spare parts.
In addition, in IC socket of the present invention, the IC socket main body preferably is made of separable bilayer for upper strata IC socket main body and lower floor's socket main body, forms the recess that holds linking part on above-mentioned upper strata IC socket main body and lower floor's socket main body respectively.
So, because when being contained in linking part in the recess, the IC socket main body can be separated into upper strata IC socket main body and lower floor's socket main body two-layer, therefore, just can be at an easy rate linking part be packed in the recess.
In addition, in IC socket of the present invention, be preferably in and form the groove that is used for fixing spring on the contact plug of linking part.
Like this, when being fixed on spring on the contact plug, by just being fixed on spring on the contact plug at an easy rate in the spring embedded groove.
In addition, in IC socket of the present invention, spring preferably is made of gold-plated line.
Because the resistance of gold-plated line is less, therefore, so just can further reduce the resistance when contacting with electrode.
In addition, the surface of columnar part is preferably by gold-plated.So just can further reduce the resistance when contacting with electrode.
In IC socket of the present invention, contact plug preferably has elasticity.So just can when contacting with circuit substrate, contact plug improve the contact of contact plug and circuit substrate.
In addition, the concrete execution mode or the embodiment that are set forth in detailed description of the present invention just annotate technology contents of the present invention, the present invention only is confined to above-mentioned concrete example and the narrow definition carried out, can carry out various changes within the scope of aim of the present invention and following claims.
Claims (13)
1. IC socket, it is characterised in that it possesses: have the some lead terminals that clamp IC respectively the clamping section conductivity each linking part and be fixed on the above-mentioned linking part and from this linking part towards circuit substrate each spring of outstanding conductivity, and above-mentioned spring so that above-mentioned linking part and above-mentioned spring and the contacted mode of foregoing circuit substrate be fixed on the above-mentioned linking part.
2. IC socket as claimed in claim 1, it is characterised in that aforementioned each linking part has respectively towards the outstanding contact plug of circuit substrate, simultaneously, aforementioned each spring is fixed on the above-mentioned contact plug and is outstanding from this contact plug towards circuit substrate.
3. IC socket as claimed in claim 1, it is characterised in that the columnar part of conductivity is fixed on the top of the circuit substrate side of aforementioned spring.
4. IC socket as claimed in claim 2, it is characterised in that the columnar part of conductivity is fixed on the top of the circuit substrate side of aforementioned spring.
5. IC socket as claimed in claim 3, it is characterised in that, forms the hole that aforementioned linking part is inserted on aforementioned columnar part, aforementioned spring is wound onto the surface of above-mentioned columnar part simultaneously.
6. IC socket as claimed in claim 4, it is characterised in that, forms the hole that aforementioned linking part is inserted on aforementioned columnar part, aforementioned spring is wound onto the surface of above-mentioned columnar part simultaneously.
7. as the described IC socket of one of claim 1～6, it is characterized in that the clamping section and the contact plug of aforementioned linking part are integrally formed.
8. as the described IC socket of one of claim 1～6, it is characterized in that, the IC socket main body is made of the separable bilayer of upper strata IC socket main body and lower floor's socket main body, forms the recess that holds aforementioned linking part in above-mentioned upper strata IC socket main body and lower floor's socket main body respectively.
9. as the described IC socket of one of claim 2～6, it is characterized in that, on the contact plug of aforementioned linking part, form the groove that is used for fixing aforementioned spring.
10. as the described IC socket of one of claim 1～6, it is characterized in that aforementioned spring is made by gold-plated line.
11., it is characterized in that the surface of aforementioned columnar part is by gold-plated as the described IC socket of one of claim 3～6.
12., it is characterized in that aforementioned contact plug has elasticity as the described IC socket of one of claim 2～6.
13. IC socket, it is characterised in that it possesses: have the some lead terminals that clamp IC respectively the clamping section conductivity each linking part, be fixed on the above-mentioned linking part and from this linking part towards circuit substrate outstanding conductivity each spring and be fixed on the columnar part of conductivity on top of circuit substrate one side of above-mentioned spring, and so that above-mentioned linking part and above-mentioned columnar part and the contacted mode of foregoing circuit substrate, above-mentioned columnar part is fixed on the above-mentioned spring and above-mentioned spring is fixed on the above-mentioned linking part.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005122953 | 2005-04-20 | ||
| JP122953/2005 | 2005-04-20 | ||
| JP55429/2006 | 2006-03-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1858941A CN1858941A (en) | 2006-11-08 |
| CN100486046C true CN100486046C (en) | 2009-05-06 |
Family
ID=37297816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100758429A Active CN100486046C (en) | 2005-04-20 | 2006-04-20 | Ic socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100486046C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI20115775A0 (en) * | 2011-07-29 | 2011-07-29 | Salcomp Oyj | ELECTRICAL CONTACT DEVICE |
| JP5886032B2 (en) * | 2011-12-26 | 2016-03-16 | 株式会社エンプラス | Socket for electrical parts |
| MY176738A (en) * | 2012-06-06 | 2020-08-20 | Enplas Corp | Electric contact and socket for electric parts |
| CN105742859A (en) * | 2016-04-08 | 2016-07-06 | 黄永怀 | Columnar electrical connector |
-
2006
- 2006-04-20 CN CNB2006100758429A patent/CN100486046C/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN1858941A (en) | 2006-11-08 |
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