KR940006242A - 클린룸내 반송 시스템 - Google Patents

클린룸내 반송 시스템 Download PDF

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Publication number
KR940006242A
KR940006242A KR1019930012015A KR930012015A KR940006242A KR 940006242 A KR940006242 A KR 940006242A KR 1019930012015 A KR1019930012015 A KR 1019930012015A KR 930012015 A KR930012015 A KR 930012015A KR 940006242 A KR940006242 A KR 940006242A
Authority
KR
South Korea
Prior art keywords
wafer
transfer
conveyance
inter
clean room
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019930012015A
Other languages
English (en)
Korean (ko)
Inventor
마사나오 마나따
뎃베이 야마시따
쓰요시 다나까
다까히데 호시꼬
미쓰지 가리따
히또시 가와노
쓰또무 신야
Original Assignee
스즈끼 아끼오
신꼬덴끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스즈끼 아끼오, 신꼬덴끼 가부시끼가이샤 filed Critical 스즈끼 아끼오
Publication of KR940006242A publication Critical patent/KR940006242A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3216—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
KR1019930012015A 1992-07-03 1993-06-30 클린룸내 반송 시스템 Ceased KR940006242A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4177218A JPH0616206A (ja) 1992-07-03 1992-07-03 クリーンルーム内搬送システム
JP92-177218 1992-07-03

Publications (1)

Publication Number Publication Date
KR940006242A true KR940006242A (ko) 1994-03-23

Family

ID=16027229

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930012015A Ceased KR940006242A (ko) 1992-07-03 1993-06-30 클린룸내 반송 시스템

Country Status (4)

Country Link
US (1) US5443346A (https=)
JP (1) JPH0616206A (https=)
KR (1) KR940006242A (https=)
TW (1) TW257878B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100331966B1 (ko) * 1999-10-23 2002-04-10 윤기룡 염색된 직물의 직물권취장치
KR100568910B1 (ko) * 2002-08-16 2006-04-10 이재구 검단 및 로울링 작업용 유압식 직물송출장치

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3654597B2 (ja) 1993-07-15 2005-06-02 株式会社ルネサステクノロジ 製造システムおよび製造方法
JPH08222619A (ja) * 1995-02-14 1996-08-30 Toshiba Corp 半導体製造装置
JPH08335539A (ja) * 1995-06-06 1996-12-17 Sony Corp 生産管理装置および生産管理方法
US5615988A (en) * 1995-07-07 1997-04-01 Pri Automation, Inc. Wafer transfer system having rotational capability
US5647718A (en) * 1995-07-07 1997-07-15 Pri Automation, Inc. Straight line wafer transfer system
US5741109A (en) * 1995-07-07 1998-04-21 Pri Automation, Inc. Wafer transfer system having vertical lifting capability
US6672819B1 (en) * 1995-07-19 2004-01-06 Hitachi, Ltd. Vacuum processing apparatus and semiconductor manufacturing line using the same
US5841661A (en) * 1996-08-26 1998-11-24 Seh America, Inc. Wafer image (ADS) vision system to automated dimensioning equipment (ADE) communication interface system
US6540466B2 (en) * 1996-12-11 2003-04-01 Applied Materials, Inc. Compact apparatus and method for storing and loading semiconductor wafer carriers
JP2968742B2 (ja) 1997-01-24 1999-11-02 山形日本電気株式会社 自動保管棚及び自動保管方法
US6432203B1 (en) * 1997-03-17 2002-08-13 Applied Komatsu Technology, Inc. Heated and cooled vacuum chamber shield
JPH10270535A (ja) 1997-03-25 1998-10-09 Nikon Corp 移動ステージ装置、及び該ステージ装置を用いた回路デバイス製造方法
US5980183A (en) * 1997-04-14 1999-11-09 Asyst Technologies, Inc. Integrated intrabay buffer, delivery, and stocker system
US6280134B1 (en) * 1997-06-17 2001-08-28 Applied Materials, Inc. Apparatus and method for automated cassette handling
US6034000A (en) 1997-07-28 2000-03-07 Applied Materials, Inc. Multiple loadlock system
JPH1159829A (ja) * 1997-08-08 1999-03-02 Mitsubishi Electric Corp 半導体ウェハカセット搬送装置、半導体ウェハカセット搬送装置で用いられるストッカ、ならびに半導体ウェハカセット搬送装置で用いられるストッカ入庫作業制御方法、ストッカ出庫作業制御方法、自動搬送車制御方法、およびストッカ在庫照合方法
US6053687A (en) * 1997-09-05 2000-04-25 Applied Materials, Inc. Cost effective modular-linear wafer processing
JPH11222122A (ja) * 1998-02-03 1999-08-17 Shinko Electric Co Ltd 分岐軌道を備えた搬送設備
US6145444A (en) * 1998-12-16 2000-11-14 Wilkinson; Kerry E. Micro clean sealed tubular transporter apparatus
US6435330B1 (en) 1998-12-18 2002-08-20 Asyai Technologies, Inc. In/out load port transfer mechanism
DE19900804C2 (de) * 1999-01-12 2000-10-19 Siemens Ag Fördersystem
US7278812B2 (en) 1999-01-27 2007-10-09 Shinko Electric Co., Ltd. Conveyance system
US6763281B2 (en) 1999-04-19 2004-07-13 Applied Materials, Inc Apparatus for alignment of automated workpiece handling systems
TW469483B (en) * 1999-04-19 2001-12-21 Applied Materials Inc Method and apparatus for aligning a cassette
DE19921246C2 (de) * 1999-05-07 2003-06-12 Infineon Technologies Ag Anlage zur Fertigung von Halbleiterprodukten
DE19921245C2 (de) * 1999-05-07 2003-04-30 Infineon Technologies Ag Anlage zur Bearbeitung von Wafern
US6949143B1 (en) 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
US6303398B1 (en) 2000-05-04 2001-10-16 Advanced Micro Devices, Inc. Method and system of managing wafers in a semiconductor device production facility
EP1319243A2 (en) * 2000-09-15 2003-06-18 Applied Materials, Inc. Double dual slot load lock for process equipment
JP2002231594A (ja) * 2001-01-31 2002-08-16 Mitsubishi Electric Corp 半導体装置の生産管理システム、半導体装置の生産管理方法、および半導体装置の製造方法
US7316966B2 (en) * 2001-09-21 2008-01-08 Applied Materials, Inc. Method for transferring substrates in a load lock chamber
JP3760437B2 (ja) * 2001-10-16 2006-03-29 旭精工株式会社 紙葉類の重ね出し防止装置
JP2003188229A (ja) * 2001-12-18 2003-07-04 Hitachi Kasado Eng Co Ltd ウエハ製造システムおよびウエハ製造方法
JP4025069B2 (ja) * 2001-12-28 2007-12-19 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US6729836B2 (en) * 2002-03-13 2004-05-04 Stingel, Iii Frederick J. Automated container storage and delivery system
US7184855B2 (en) 2002-03-13 2007-02-27 Stingel Iii Frederick J Automated container storage and delivery system
JP4220173B2 (ja) * 2002-03-26 2009-02-04 株式会社日立ハイテクノロジーズ 基板の搬送方法
US20050158152A1 (en) * 2002-06-07 2005-07-21 Tetsunori Otaguro Container conveying system
US6871116B2 (en) * 2002-10-17 2005-03-22 Vertique, Inc. Determining pallet case configurations for placement by a robot
US6990721B2 (en) * 2003-03-21 2006-01-31 Brooks Automation, Inc. Growth model automated material handling system
JP2004303916A (ja) * 2003-03-31 2004-10-28 Seiko Epson Corp 製造対象物の搬送装置および製造対象物の搬送方法
US7207766B2 (en) * 2003-10-20 2007-04-24 Applied Materials, Inc. Load lock chamber for large area substrate processing system
US20050095087A1 (en) * 2003-10-30 2005-05-05 Sullivan Robert P. Automated material handling system
US7497414B2 (en) * 2004-06-14 2009-03-03 Applied Materials, Inc. Curved slit valve door with flexible coupling
US8292563B2 (en) * 2004-06-28 2012-10-23 Brooks Automation, Inc. Nonproductive wafer buffer module for substrate processing apparatus
TWI280220B (en) 2004-10-25 2007-05-01 Tokyo Electron Ltd Carrying system, substrate treating device, and carrying method
US20070006936A1 (en) * 2005-07-07 2007-01-11 Applied Materials, Inc. Load lock chamber with substrate temperature regulation
US8529185B2 (en) * 2005-08-31 2013-09-10 Hirata Corporation Work handling apparatus
US20070059153A1 (en) * 2005-09-14 2007-03-15 Applied Materials, Inc. Methods and apparatus for a transport lift assembly
US20080107507A1 (en) * 2005-11-07 2008-05-08 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system
US7798758B2 (en) * 2005-11-07 2010-09-21 Brooks Automation, Inc. Reduced capacity carrier, transport, load port, buffer system
US8272827B2 (en) * 2005-11-07 2012-09-25 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system
US8267634B2 (en) 2005-11-07 2012-09-18 Brooks Automation, Inc. Reduced capacity carrier, transport, load port, buffer system
US7637708B2 (en) * 2006-01-09 2009-12-29 Sumco Corporation Production system for wafer
US7845891B2 (en) * 2006-01-13 2010-12-07 Applied Materials, Inc. Decoupled chamber body
US7665951B2 (en) 2006-06-02 2010-02-23 Applied Materials, Inc. Multiple slot load lock chamber and method of operation
US7845618B2 (en) 2006-06-28 2010-12-07 Applied Materials, Inc. Valve door with ball coupling
US8124907B2 (en) * 2006-08-04 2012-02-28 Applied Materials, Inc. Load lock chamber with decoupled slit valve door seal compartment
US9048274B2 (en) * 2008-12-08 2015-06-02 Taiwan Semiconductor Manufacturing Co., Ltd. Portable stocker and method of using same
JP2010184760A (ja) * 2009-02-10 2010-08-26 Muratec Automation Co Ltd 移載システム
JP5212165B2 (ja) * 2009-02-20 2013-06-19 東京エレクトロン株式会社 基板処理装置
CN107851594B (zh) * 2015-08-28 2021-06-22 株式会社国际电气 基板处理装置以及半导体装置的制造方法
US20220380127A1 (en) * 2021-05-27 2022-12-01 Express Scripts Strategic Development, Inc. Pharmaceutical order processing systems and methods
JP7546617B2 (ja) 2022-03-22 2024-09-06 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、プログラム及び基板搬送方法
TWI848544B (zh) * 2023-02-04 2024-07-11 矽品精密工業股份有限公司 半導體封裝製程之工作系統及其運作方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58191446A (ja) * 1982-05-04 1983-11-08 Nec Corp 半導体基板搬送装置
JPS61105853A (ja) * 1984-10-30 1986-05-23 Anelva Corp オ−トロ−ダ−
JPH0641322B2 (ja) * 1985-11-19 1994-06-01 日本ファイリング株式会社 保管管理装置
JPH0638427Y2 (ja) * 1987-06-16 1994-10-05 東京エレクトロン東北株式会社 磁気浮上型ウエハ搬送装置
JPS6449237A (en) * 1987-08-20 1989-02-23 Tokyo Electron Ltd Method of conveying by robot
US4955775A (en) * 1987-12-12 1990-09-11 Tel Sagami Limited Semiconductor wafer treating apparatus
US5177514A (en) * 1988-02-12 1993-01-05 Tokyo Electron Limited Apparatus for coating a photo-resist film and/or developing it after being exposed
JPH01217938A (ja) * 1988-02-26 1989-08-31 Oki Electric Ind Co Ltd ウエハキャリアの自動搬送スシテム
ES2163388T3 (es) * 1988-05-24 2002-02-01 Unaxis Balzers Ag Instalacion de vacio.
US5024570A (en) * 1988-09-14 1991-06-18 Fujitsu Limited Continuous semiconductor substrate processing system
JP3212087B2 (ja) * 1988-10-21 2001-09-25 株式会社日立製作所 多品種搬送方法及び装置
US5061144A (en) * 1988-11-30 1991-10-29 Tokyo Electron Limited Resist process apparatus
US5110248A (en) * 1989-07-17 1992-05-05 Tokyo Electron Sagami Limited Vertical heat-treatment apparatus having a wafer transfer mechanism
FR2656599B1 (fr) * 1989-12-29 1992-03-27 Commissariat Energie Atomique Dispositif de rangement d'objets plats dans une cassette avec rayonnages intermediaires.
JP2913510B2 (ja) * 1990-05-15 1999-06-28 東京エレクトロン株式会社 搬送装置
JPH04267538A (ja) * 1991-02-22 1992-09-24 Kokusai Electric Co Ltd 多連半導体製造装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100331966B1 (ko) * 1999-10-23 2002-04-10 윤기룡 염색된 직물의 직물권취장치
KR100568910B1 (ko) * 2002-08-16 2006-04-10 이재구 검단 및 로울링 작업용 유압식 직물송출장치

Also Published As

Publication number Publication date
JPH0616206A (ja) 1994-01-25
US5443346A (en) 1995-08-22
TW257878B (https=) 1995-09-21

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