KR930020640A - 배선기판 조립체와 그 전기적 접합부 형성방법 - Google Patents

배선기판 조립체와 그 전기적 접합부 형성방법 Download PDF

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KR930020640A
KR930020640A KR1019930004249A KR930004249A KR930020640A KR 930020640 A KR930020640 A KR 930020640A KR 1019930004249 A KR1019930004249 A KR 1019930004249A KR 930004249 A KR930004249 A KR 930004249A KR 930020640 A KR930020640 A KR 930020640A
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metal
insulating layer
conductor pattern
conductor
stud
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KR1019930004249A
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KR100272156B1 (ko
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류지 와따나베
오사무 마우라
구니오 미야자끼
유끼오 오오고시
아끼오 다까하시
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가나이 쯔도무
가부시기가이샤 히다찌 세이사꾸쇼
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    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
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Abstract

다층 배선 조립체는 보통 구리로된 배선패턴(4)과 교대로, 예를 들어 폴리이미드로된 절연층(3)의 적층(2)으로 구성된다. 회로패턴을 만들기 위해, 연속 배선패턴(4)이 금속 스터드 접합부(5)에 의해, 복수의 소정위치에서 사이에 놓인 절연층을 통해 서로에 접합된다.
스터드(5)는 절연층(3)의 드르홀을 통해 밑에 놓인 배선 패턴상에 스터드를 도선 결합하고, 다음에 도선 결합된 스터드의 도출 종단을 스탬핑하여 이것을 최상부 배선패턴(4)과 접촉하게 퍼지게 함으로써 적층의 조립 동안 형성된다. 예를들어 A

Description

배선기판 조립체와 그 전기적 접합부 형성방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 가층배선반 조립체의 단면도이다.
제2도는 스터드 마이크로범프(stud microbump)전기적 적합자의 스탬핑을 설명하는 도이다.
제3도는 스터드를 초기에 형성하는 배선접합 방법을 나타낸 도이다.

Claims (17)

  1. 절연층(3)의 일측의 제1전도체(4,13)가 상기 절연층(3)을 통해 연장되며 상기 제1전도체(4,13)위에 놓인 드루홀(31)을 통해, 상기 드루홀(31)을 통해, 상기 드루홀(31)을 통해 연장한 금속 접합부(5)에 의해, 상기 절연층(3)의 대향측에서 제2전도체(4)에 전기적으로 접속되어지는 배선기판 조립체 제작중 전기적 접합부를 만드는 방법에 있어서, 상기 금속접합부는, (a)상기 드루홀(31)을 통해 연장하도록 상기 제1전도체(4,13)상으로 금속스터드(5)를 결합시키고, (b)상기 금속 스터드(5)의 노출 종단(53)이 상기 제2전도체(4)와 원주 접촉하여 퍼지도록 그 종단을 평평하게 하는 것으로 형성되는 것을 특징으로 하는 방법.
  2. 제1항에 있어서, 상기 금속 스터드(5)는 금속도선(64)의 종단을 상기 제1전도체(4,13)상으로 도선 결합하고 상기 도선 결합된 종단을 상기 금속도선(64)의 나머지에서 분리하여 형성되는 것을 특징으로 하는 방법.
  3. 제1항 또는 2항에 있어서, 열 및 초음파가 상기 금속스터드를 상기 제1전도체(4,13)상에 결합하도록 인가되는 것을 특징으로 하는 방법.
  4. 제1항 내지 3항중 어느 한 항에 있어서, 상기 금속 스터드(5)의 상기 노출 종단(53)은 스탬핑 또는 롤링에 의해 평평해지는 것을 특징으로 하는 방법.
  5. 제1항 내지 4항중 어느 한 항에 있어서, 상기 금속 스터드(5)의 노출 종단(53)의 평평한 부분을 상기 제2전도체(4)와 겹치는 외부 플랜지(54)를 형성하는 것을 특징으로 하는 방법.
  6. 내용없음.
  7. 제1도전체 패턴(4,13)을 형성하고; (i)절연층(3)을 상기 제1전도체 패턴(4,13)상에 중첩하고, 제2전도체패턴(4)은 상기 절연층(3) 위에 형성되며, 드루홀(31)은 상기 제1전도체 패턴위에 있는 복수의 소정 접합위치에서 상기 절연층(3)을 통해 형성되고; (ⅱ) 상기 복수의 소정위치에서 상기 제1및 제2전도체 패턴(4,13;4)사이를 전기적으로 접속하도록 상기 드루홀(3)에 금속 접합부(5)를 형성하는 것으로 이루어진 배선기판 조립체를 만드는 방법에 있어서, 상기 금속 접합부는, (a)상기 드루홀(31)의 상기 제1전도체 패턴(4,13)상으로 금속 스터드(5)를 결합시키고, (b)상기 결합된 스터드(5)를 스탬핑하여 상기 제2전도체 패턴(4)과 겹치게 접촉하여 이들 종단(53)을 외부 플랜지(54)안으로 평평하게 함으로써 형성되는 것을 특징으로 하는 방법.
  8. 제7항에 있어서, 상기 제1전도체 패턴은 조립체 기판(1)의 접합단자(13)로 구성되는 것을 특징으로 하는 방법.
  9. 제7항 또는 8항에 있어서, 상기 조립체를 다층 조립체(2)로 형성하기 위해 최소한 하나의 다른 절연층(4)이 다른 절연 패턴(4)을 가져, 상기 제2전도체 패턴에 관련하여 단계(ⅰ) 내지(ⅱ)를 반복하는 것을 이루어진 방법.
  10. 제7항 내지 9항중 어느 한 항에 있어서, 단계(a)에서 상기 금속 스터드(5)는 금속도선(64)의 종단을 상기 제1전도체 패턴(4,13)상에 결합시키고, 상기 결합된 종단(66)을 상기 도선(64)의 나머지에서 분리하여 상기 스터드(5′)를 형성하므로써 결합되는 것을 특징으로 하는 방법.
  11. 제7항 내지 10항중 어느 한 항에 있어서, 상기 금속스터드(5)는이하인 저항치를 갖는 것을 특징으로 하는 방법.
  12. 제1전도체 패턴(13,4), 상기 제1전도체 패턴상에 중접된 절연층(3) 그리고 상기 절연층(3)에 중첩된 다른 전도체 패턴(4)로 구성되고, 상기 전도체 패턴 사이의 금속 접합부는 상기 절연층의 드루홀(31)을 통해 연장한 배선기판 조립체에 있어서, 상기 금속 접합부는 상기 제1전도체 패턴상에 금속 결합된 제1종단과 다른 전도체 패턴(4)과 겹쳐 접촉한 평평한 외부 플랜지(54)를 갖는 제2종단(53)을 구비한 금속 스터드(5)인 것을 특징으로 하는 배선기판 조립체.
  13. 제12항에 있어서, 상기 제1전도체 패턴(13)은 상기 조립체의 굳은 기판(1)상에 있는 것을 특징으로 하는 배선기판 조립체.
  14. 제13항에 있어서, 상기 굳은 기판(1)은 세라믹 또는 Si로 되어 있는 것을 특징으로하는 배선기판 조립체.
  15. 제12항에 있어서, 상기 제1전도체 패턴은 이전의 절연층(3)상의 전도체 패턴(4)인 것을 특징으로 하는 배선기판 조립체.
  16. 제12항 내지 15항중 어느 한 항에 있어서, 상기 금속 스터드(5)는이하인 저항치를 갖는 것을 특징으로 하는 조립체.
  17. 기판(1) 그리고 각각 절연층(3)과 절연층(3)에 패턴된 배선층(4)으로 구성되는 결합층(2)의 기판에 중첩된 복수의 배선기판으로 구성되고, 연속한 상기 배선층(4)은 상기 절연층(3)을 통해 연장한 금속 접착부(5)에 의해 복수의 소정 위치에서 전기적으로 함께 접합되어 있는 다층 배선 조립체에 있어서, 상기 금속 접합부는이하인 저항치를 갖는 금속 스터드(5)로 형성되고, 각 상기 금속 스터드(5)는 열, 압력 및 초음파의 인가에 의해 상기 배선층(4)중 하나에 금속적으로 결합된 제1종단과 다른 배선층(14)과 중첩되어 접촉하여 외부 플랜지(54)를 구성하는 기계적으로 평평하게 퍼진 부분을 갖는 제2종단(53)을 구비하는 것을 특징으로 하는 다층배선 조립체.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930004249A 1992-03-19 1993-03-19 배선기판 조립체와 그 전기적 접합부 형성방법 KR100272156B1 (ko)

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US5497545A (en) 1996-03-12
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