KR930010591A - 액정표시장치의 배선판 장착방법 - Google Patents

액정표시장치의 배선판 장착방법 Download PDF

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KR930010591A
KR930010591A KR1019920021541A KR920021541A KR930010591A KR 930010591 A KR930010591 A KR 930010591A KR 1019920021541 A KR1019920021541 A KR 1019920021541A KR 920021541 A KR920021541 A KR 920021541A KR 930010591 A KR930010591 A KR 930010591A
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wiring board
connection end
semiconductor chip
liquid crystal
epoxy resin
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KR1019920021541A
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KR0130051B1 (ko
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요시나오 오누마
야수노부 다구사
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쓰지 하루오
샤프 가부시끼가이샤
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    • G—PHYSICS
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    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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    • G02F1/1345—Conductors connecting electrodes to cell terminals
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    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
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    • H01L2224/732—Location after the connecting process
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    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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    • H01L2224/83102—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus using surface energy, e.g. capillary forces
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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

본 발명의 방법은 제1배선판상에 반도체칩을 장착하고, 비등방 전도성의 열경화성층으로 제1배선판의 접속단에 제2배선판을 접합하며, 제1열경화성 에폭시 수지로 반도체 칩의 하부표면과 주변을 피복하여 반도체칩이 밀봉되게 한 후 제2열경화성 에폭시 수지로 제1배선판의 접속부와 제2배선판을 피복한다.

Description

액정표시장치의 배선판 장착방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 열경화성 에폭시 수지에 의해 차폐된 상태에서 반도체칩과 가요성 배선판(flexiblc wire board)이 액정 표시기판과 연결된 상태를 예시한 개략도, 제2도는 제1도에 도시된 액정표시기판과 연결되는 반도체칩 및 가요성 배선판의 접속부들을 나타낸 개략도.

Claims (7)

  1. 반도체칩을 위한 제1접속단과 배선판을 위한 제2접속단을 갖는 액정표시기판상에 상기 반도체칩과 상기 배선판을 장착하는 방법에 있어서, 상기 제1접속단과 상기 제2접속단에 상기 반도체칩의 전극들을 전기적으로 연결하는 단계와, 비등방 전도성의 열경화성층을 통하여 상기 제2접속단에 상기 배선판을 접합하는 단계와, 상기 액정표시기판과 상기 반도체칩사이의 틈새로 제1열경화성 에폭시 수지를 채움으로써 상기 제1접속단이 밀봉되게 하는 단계와, 상기 제2접속단에 대한 상기 배선판의 접속부를 제2열경화성 에폭시 수지로 채워 상기 접속부가 피복되게 하는 단계 및 열을 가하여 상기 제1 및 제2열경화성 에폭시 수지를 경화시키는 단계를 포함하는 것을 특징으로 하는 액정표시장치의 배선판 장착방법.
  2. 제1항에 있어서, 열경화성 수지로 상기 제1접속단을 밀봉하는 단계를 상기 반도체칩 주위를 상기 열경화성 에폭시 수지로 채우는 단계를 포함하는 것을 특징으로 하는 액정표시장치의 배선판 장착방법.
  3. 제1항에 있어서, 상기 액정표시기판은 대향유리기판과 그 사이에 겹쳐지는 액정층을 포함하는 것을 특징으로 하는 액정표시장치의 배선판 장착방법.
  4. 제3항에 있어서, 열경화성 에폭시 수지로 상기 제1접속단을 밀봉하는 단계는 상기 대향유리기판의 쌍과 상기 반도체칩 사이의 틈새에 열경화성 에폭시 수지로 채우는 단계를 포함하는 것을 특징으로 하는 액정표시장치의 배선판 장착방법.
  5. 제1항에 있어서, 상기 제1접속단을 밀봉하고, 상기 제2접속단과 연결되는 상기 배선판의 접속부를 피복하기 위해서 동일 종류의 열경화성 에폭시 수지를 사용하는 것을 특징으로 하는 액정표시장치의 배선판 장착방법.
  6. 제1항에 있어서, 상기 비등방 전도성의 열경화성층은 열경화성 수지와 전도성물질을 함유하는 조성물로 이루어지는 것을 특징으로 하는 액정표시장치의 배선판 장착방법.
  7. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920021541A 1991-11-18 1992-11-17 액정표시판에 반도체 칩과 배선판을 장착하는 방법 KR0130051B1 (ko)

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JP3301808A JPH05144875A (ja) 1991-11-18 1991-11-18 配線基板の実装方法
JP91-301808 1991-11-18

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KR930010591A true KR930010591A (ko) 1993-06-22
KR0130051B1 KR0130051B1 (ko) 1998-04-11

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US (1) US5290197A (ko)
EP (1) EP0543635A3 (ko)
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US5657811A (en) * 1993-06-04 1997-08-19 Pcc Composites, Inc. Cast-in hermetic electrical feed-throughs
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KR0130051B1 (ko) 1998-04-11
JPH05144875A (ja) 1993-06-11
EP0543635A3 (en) 1993-11-24
EP0543635A2 (en) 1993-05-26
US5290197A (en) 1994-03-01

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