KR920010862A - 반도체 장치 및 이것에 사용되는 리드프레임 - Google Patents

반도체 장치 및 이것에 사용되는 리드프레임 Download PDF

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Publication number
KR920010862A
KR920010862A KR1019910018795A KR910018795A KR920010862A KR 920010862 A KR920010862 A KR 920010862A KR 1019910018795 A KR1019910018795 A KR 1019910018795A KR 910018795 A KR910018795 A KR 910018795A KR 920010862 A KR920010862 A KR 920010862A
Authority
KR
South Korea
Prior art keywords
inner lead
heat sink
semiconductor chip
lead
semiconductor devices
Prior art date
Application number
KR1019910018795A
Other languages
English (en)
Korean (ko)
Inventor
마사또 다나까
가쓰야 후까세
Original Assignee
이노우에 사다오
산꼬오 덴기 고오교오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이노우에 사다오, 산꼬오 덴기 고오교오 가부시끼가이샤 filed Critical 이노우에 사다오
Publication of KR920010862A publication Critical patent/KR920010862A/ko
Priority to KR2019950026696U priority Critical patent/KR960000942Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1019910018795A 1990-11-30 1991-10-25 반도체 장치 및 이것에 사용되는 리드프레임 KR920010862A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950026696U KR960000942Y1 (ko) 1990-11-30 1995-09-28 반도체장치의 리드프레임

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP90-340501 1990-11-30
JP2340501A JP2962575B2 (ja) 1990-11-30 1990-11-30 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR2019950026696U Division KR960000942Y1 (ko) 1990-11-30 1995-09-28 반도체장치의 리드프레임

Publications (1)

Publication Number Publication Date
KR920010862A true KR920010862A (ko) 1992-06-27

Family

ID=18337573

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910018795A KR920010862A (ko) 1990-11-30 1991-10-25 반도체 장치 및 이것에 사용되는 리드프레임

Country Status (2)

Country Link
JP (1) JP2962575B2 (ja)
KR (1) KR920010862A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100743335B1 (ko) * 1999-06-30 2007-07-26 가부시키가이샤 히타치세이사쿠쇼 반도체 장치

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5402778B2 (ja) * 2010-03-30 2014-01-29 株式会社デンソー 半導体モジュールを備えた半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100743335B1 (ko) * 1999-06-30 2007-07-26 가부시키가이샤 히타치세이사쿠쇼 반도체 장치
KR100864781B1 (ko) * 1999-06-30 2008-10-22 가부시키가이샤 히타치세이사쿠쇼 반도체 장치
KR100878939B1 (ko) * 1999-06-30 2009-01-19 가부시키가이샤 히타치세이사쿠쇼 반도체 장치
KR100885606B1 (ko) * 1999-06-30 2009-02-24 가부시키가이샤 히타치세이사쿠쇼 반도체 장치

Also Published As

Publication number Publication date
JP2962575B2 (ja) 1999-10-12
JPH04207062A (ja) 1992-07-29

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application
WICV Withdrawal of application forming a basis of a converted application