KR910006733A - 이방 도전성 시트를 사용한 전기적 검사 장치 및 이방 도전성 시트의 제조방법 - Google Patents

이방 도전성 시트를 사용한 전기적 검사 장치 및 이방 도전성 시트의 제조방법 Download PDF

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Publication number
KR910006733A
KR910006733A KR1019900015511A KR900015511A KR910006733A KR 910006733 A KR910006733 A KR 910006733A KR 1019900015511 A KR1019900015511 A KR 1019900015511A KR 900015511 A KR900015511 A KR 900015511A KR 910006733 A KR910006733 A KR 910006733A
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KR
South Korea
Prior art keywords
anisotropic conductive
conductive sheet
sheet
molding material
electrical inspection
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KR1019900015511A
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English (en)
Inventor
싱이찌 쯔야마
유이찌 하루따
Original Assignee
고바야시 사또시
가부시끼가이샤 소우겐 인터내쇼널
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 고바야시 사또시, 가부시끼가이샤 소우겐 인터내쇼널 filed Critical 고바야시 사또시
Publication of KR910006733A publication Critical patent/KR910006733A/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

내용 없음

Description

이방 도전성 시트를 사용한 전기적 검사 장치 및 이방 도전성 시트의 제조방법.
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 본 발명의 전기적 검사 장치에 사용하는 RCR 시트의 일부를 도시한 중단 정면도.
제2도는 본 발명의 전기적 검사 장치에 사용하는 RCR 시트의 일부를 도시한 평면도.
제3도는 RCR시트의 제조장치의 한 예를 도시한 개략도.

Claims (2)

  1. 다수의 검사 전극과, 검사대상인 기판과의 사이에 이방 도전성 시트를 개재시켜서 당해 기판의 전기적 검사를 행하는 전기적 검사 장치에 있어서, 상기 이방 도전성 시트는 시트의 두께방향으로 퍼지는 복수의 도전부가 절연부에 의하여 상호 절연된 상태에서 배치되어지고, 각 도전부는 적어도 시트의 일면측에서 절연부의 표면으로부터 돌출하는 돌출부중에 형성되며, 또한 절연성으로 탄성을 갖는 고분자 물질중에 도전성 입자가 조밀하게 충전되어지는 것을 특징으로하는 이방 도전성 시트를 사용한 전기적 검사장치.
  2. 제1항에 기재한 이방 도전성 시트를 제조하는 방법에 있어서 성형면이 평탄하든가 혹은 이방 도전성 시트 돌출부의 돌출높이에 비하여 미미한을 갖는 상하 한쌍의 금형을 사용하고, 이 금형의 캐비티내에 자성을 갖는 도전성 입자와 고분자 재료의 혼합물로 된 성형 재료층을 형성하며 상기 금형의 상형 성형면과 상기 성형재료층의 상면 사이에 틈이 형성된 상태에서 당해 성형재료층에 강도분포를 갖는 자장을 당해 층의 두께방향에 걸어서 그 자력에 의하여 도전성 입자를 이동시키면서 성형재료를 유동시키고 그 외형을 변화시켜 경화하여 제1항에 개재한 이방 도전성 시트를 제조하는 것을 특징으로 하는 이방 도전성 시트의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900015511A 1989-09-29 1990-09-28 이방 도전성 시트를 사용한 전기적 검사 장치 및 이방 도전성 시트의 제조방법 KR910006733A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25221489 1989-09-29
JP1-252214 1989-09-29

Publications (1)

Publication Number Publication Date
KR910006733A true KR910006733A (ko) 1991-04-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900015511A KR910006733A (ko) 1989-09-29 1990-09-28 이방 도전성 시트를 사용한 전기적 검사 장치 및 이방 도전성 시트의 제조방법

Country Status (5)

Country Link
US (2) US5132058A (ko)
EP (1) EP0420690B1 (ko)
JP (3) JP3038859B2 (ko)
KR (1) KR910006733A (ko)
DE (1) DE69027171T2 (ko)

Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2720688B2 (ja) * 1992-01-31 1998-03-04 ジェイエスアール株式会社 回路基板の検査方法
US20050062492A1 (en) * 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
US6058497A (en) * 1992-11-20 2000-05-02 Micron Technology, Inc. Testing and burn-in of IC chips using radio frequency transmission
US5983363A (en) 1992-11-20 1999-11-09 Micron Communications, Inc. In-sheet transceiver testing
JP2833402B2 (ja) * 1993-03-02 1998-12-09 ジェイエスアール株式会社 被検査電極板の検査方法
US5786701A (en) * 1993-07-02 1998-07-28 Mitel Semiconductor Limited Bare die testing
US5596282A (en) * 1993-12-10 1997-01-21 Texas Instruments Incorporated Tester for integrated circuits
KR0140034B1 (ko) * 1993-12-16 1998-07-15 모리시다 요이치 반도체 웨이퍼 수납기, 반도체 웨이퍼의 검사용 집적회로 단자와 프로브 단자와의 접속방법 및 그 장치, 반도체 집적회로의 검사방법, 프로브카드 및 그 제조방법
JP3442137B2 (ja) * 1993-12-17 2003-09-02 日本発条株式会社 導電性接触子ユニット
JPH07174788A (ja) * 1993-12-17 1995-07-14 Nhk Spring Co Ltd 導電性接触子
US5646203A (en) * 1994-03-31 1997-07-08 Toppan Moore Co., Ltd. Microcapsule-containing oil-based coating liquid, ink, coated sheet, and method of preparing the same
US6577148B1 (en) 1994-08-31 2003-06-10 Motorola, Inc. Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer
US5543724A (en) * 1994-10-03 1996-08-06 Motorola, Inc. Method and apparatus for locating conductive features and testing semiconductor devices
JP2632136B2 (ja) * 1994-10-17 1997-07-23 日本電子材料株式会社 高温測定用プローブカード
JP2002509639A (ja) * 1994-11-15 2002-03-26 フォームファクター，インコーポレイテッド 超小型電子素子の相互接続要素
US5497103A (en) * 1995-01-25 1996-03-05 International Business Machines Corporation Test apparatus for circuitized substrate
US5678545A (en) * 1995-05-04 1997-10-21 Stratbucker; Robert A. Anisotropic adhesive multiple electrode system, and method of use
US5938597A (en) * 1995-05-04 1999-08-17 Stratbucker; Robert A. Electrocardiograph bioelectric interface system and method of use
US6327487B1 (en) 1995-05-04 2001-12-04 Robert A. Stratbucker Bioelectric interface
US5661042A (en) * 1995-08-28 1997-08-26 Motorola, Inc. Process for electrically connecting electrical devices using a conductive anisotropic material
US5764071A (en) * 1996-01-05 1998-06-09 International Business Machines Corporation Method and system for testing an electronic module mounted on a printed circuit board
US6181149B1 (en) * 1996-09-26 2001-01-30 Delaware Capital Formation, Inc. Grid array package test contactor
JPH10197591A (ja) * 1997-01-09 1998-07-31 Jsr Corp 回路基板検査装置
US6064218A (en) * 1997-03-11 2000-05-16 Primeyield Systems, Inc. Peripherally leaded package test contactor
EP0910985A1 (en) 1997-10-20 1999-04-28 Robert Allen Stratbucker Electrocardiograph bioelectric interface system and method of use
EP0922960A1 (en) * 1997-12-12 1999-06-16 Padar Tecnologie di Riccioni Roberto S.a.s. Microcircuit testing device
US6119255A (en) 1998-01-21 2000-09-12 Micron Technology, Inc. Testing system for evaluating integrated circuits, a burn-in testing system, and a method for testing an integrated circuit
US6174449B1 (en) 1998-05-14 2001-01-16 Micron Technology, Inc. Magnetically patterned etch mask
JP3730428B2 (ja) * 1998-12-22 2006-01-05 富士通株式会社 半導体装置試験用コンタクタの製造方法
JP2000206169A (ja) * 1999-01-11 2000-07-28 Hioki Ee Corp 回路基板検査装置
JP2000258495A (ja) * 1999-03-12 2000-09-22 Oki Electric Ind Co Ltd 半導体デバイス試験装置
JP3285568B2 (ja) * 1999-05-24 2002-05-27 日本電産リード株式会社 基板の配線検査装置および配線検査方法
US6714121B1 (en) 1999-08-09 2004-03-30 Micron Technology, Inc. RFID material tracking method and apparatus
JP3427086B2 (ja) * 2000-02-23 2003-07-14 Ｎｅｃエレクトロニクス株式会社 Ｉｃソケット
US6462568B1 (en) * 2000-08-31 2002-10-08 Micron Technology, Inc. Conductive polymer contact system and test method for semiconductor components
WO2002103848A2 (en) * 2001-06-14 2002-12-27 Paricon Technologies Corporation Apparatus and methods to pre-stress anisotropic conductive elastomer meterials
JP4767450B2 (ja) * 2001-08-09 2011-09-07 ポリマテック株式会社 コネクタおよびその製造方法
US7059874B2 (en) * 2002-03-19 2006-06-13 Paricon Technologies, Inc. Anisotropic conductive elastomer based electrical interconnect with enhanced dynamic range
DE10221100C1 (de) * 2002-05-03 2003-06-05 Neuhaus Elektronik Gmbh Elektrisch leitfähige Dichtung sowie Verfahren und Vorrichtung zu deren Herstellung
CN100359659C (zh) * 2003-02-18 2008-01-02 Jsr株式会社 各向异性导电连接器、探测部件和晶片检测设备以及晶片检测方法
US20050012514A1 (en) * 2003-07-16 2005-01-20 Sun Microsystems, Inc. Test system including an apparatus for conveying signals between a first circuit board and a second circuit board
EP1695100A4 (en) * 2003-12-18 2009-12-30 Lecroy Corp RESISTANCE PROBE TIPS
JP3705288B2 (ja) * 2004-02-24 2005-10-12 Ｊｓｒ株式会社 回路基板検査用アダプターおよび回路基板検査装置
US7282932B2 (en) * 2004-03-02 2007-10-16 Micron Technology, Inc. Compliant contact pin assembly, card system and methods thereof
KR20070033469A (ko) 2004-07-15 2007-03-26 제이에스알 가부시끼가이샤 회로 기판의 검사 장치 및 회로 기판의 검사 방법
JP2006194620A (ja) 2005-01-11 2006-07-27 Tokyo Electron Ltd プローブカード及び検査用接触構造体
DE102005019920A1 (de) * 2005-04-27 2006-11-16 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Erzeugung einer partiell ausgeformten elektrisch leitfähigen Struktur
JP4590314B2 (ja) * 2005-06-22 2010-12-01 三菱電機株式会社 ウェハキャリア
JP2007005246A (ja) * 2005-06-27 2007-01-11 Sumitomo Electric Ind Ltd 多孔質樹脂基材及び多層基板
JPWO2007026877A1 (ja) * 2005-09-02 2009-03-12 Jsr株式会社 回路基板の検査装置および回路基板の検査方法
JP2007071699A (ja) * 2005-09-07 2007-03-22 Rika Denshi Co Ltd 垂直型プローブカード
US7585174B2 (en) * 2006-06-08 2009-09-08 Lotes Co., Ltd. Conductive component, electrical connector, and chip module
JP5008005B2 (ja) 2006-07-10 2012-08-22 東京エレクトロン株式会社 プローブカード
US9579483B2 (en) * 2006-12-29 2017-02-28 St. Jude Medical, Atrial Fibrillation Division, Inc. Pressure-sensitive conductive composite contact sensor and method for contact sensing
US8623265B2 (en) * 2007-02-06 2014-01-07 World Properties, Inc. Conductive polymer foams, method of manufacture, and articles thereof
US20090226696A1 (en) * 2008-02-06 2009-09-10 World Properties, Inc. Conductive Polymer Foams, Method of Manufacture, And Uses Thereof
JP2010518227A (ja) * 2007-02-06 2010-05-27 ワールド プラパティーズ、 インコーポレイテッド 導電性ポリマー発泡体、その作製方法、およびその使用
US8356657B2 (en) * 2007-12-19 2013-01-22 Teledyne Scientific & Imaging, Llc Heat pipe system
US9011752B2 (en) * 2008-03-03 2015-04-21 Nokia Corporation Electromagnetic wave transmission lines using magnetic nanoparticle composites
JP5113905B2 (ja) * 2008-04-25 2013-01-09 株式会社アドバンテスト 試験システムおよびプローブ装置
JP5542313B2 (ja) * 2008-06-18 2014-07-09 協立化学産業株式会社 パターン形成方法
CN102686652A (zh) * 2009-12-29 2012-09-19 罗杰斯公司 导电聚合物泡沫、其制造方法及其用途
JP2011150838A (ja) * 2010-01-20 2011-08-04 Jsr Corp 回路接続部材、導電性粒子および導電性粒子の製造方法
JP2012208038A (ja) * 2011-03-30 2012-10-25 Fujikura Rubber Ltd 感圧抵抗部材および感圧センサ
US9777197B2 (en) 2013-10-23 2017-10-03 Sunray Scientific, Llc UV-curable anisotropic conductive adhesive
US9365749B2 (en) * 2013-05-31 2016-06-14 Sunray Scientific, Llc Anisotropic conductive adhesive with reduced migration
DE102014204655A1 (de) 2014-03-13 2015-09-17 Robert Bosch Gmbh Inspektionseinheit für eine elektrische Schaltung sowie Herstellungsverfahren derselben
DE102015212565A1 (de) * 2015-07-06 2017-01-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur reversiblen Kontaktierung
JP2018073577A (ja) 2016-10-27 2018-05-10 株式会社エンプラス 異方導電性シート及びその製造方法
KR20180049839A (ko) * 2016-11-03 2018-05-14 솔브레인멤시스(주) 이방 도전성 시트
JP6918518B2 (ja) * 2017-02-27 2021-08-11 デクセリアルズ株式会社 電気特性の検査冶具
JP2019060817A (ja) * 2017-09-28 2019-04-18 日本特殊陶業株式会社 電子部品検査装置用配線基板
TWI651740B (zh) * 2017-11-02 2019-02-21 弘鄴科技有限公司 應用於電子元件之線材導體成型方法
JP7405337B2 (ja) * 2018-10-11 2023-12-26 積水ポリマテック株式会社 電気接続シート、及び端子付きガラス板構造
KR20230151389A (ko) * 2022-04-25 2023-11-01 주식회사 아이에스시 도전성 입자의 제조방법, 도전성 입자 및 전기접속용 커넥터

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2584441A (en) * 1946-05-03 1952-02-05 Rca Corp Viewing screen
US4209481A (en) * 1976-04-19 1980-06-24 Toray Industries, Inc. Process for producing an anisotropically electroconductive sheet
US4292261A (en) * 1976-06-30 1981-09-29 Japan Synthetic Rubber Company Limited Pressure sensitive conductor and method of manufacturing the same
DE2703759A1 (de) * 1977-01-29 1978-08-03 Bosch Gmbh Robert Kontaktkoerper zur verwendung in einem elektrischen stromkreis
JPS5951112B2 (ja) * 1979-02-08 1984-12-12 信越ポリマ−株式会社 コネクタ−の製造方法
JPS5740874A (en) * 1980-08-22 1982-03-06 Shinetsu Polymer Co Pressure contact holding type connector
US4571542A (en) * 1982-06-30 1986-02-18 Japan Synthetic Rubber Co., Ltd. Method and unit for inspecting printed wiring boards
US4500757A (en) * 1982-07-07 1985-02-19 Engineering Research Applications, Inc. Momentary digital encoding device for keyboards
DK291184D0 (da) * 1984-06-13 1984-06-13 Boeegh Petersen Allan Fremgangsmaade og indretning til test af kredsloebsplader
JPS61250906A (ja) * 1985-04-26 1986-11-08 ジェイエスアール株式会社 導電性エラストマ−シ−ト
US4737112A (en) * 1986-09-05 1988-04-12 American Telephone And Telegraph Company, At&T Bell Laboratories Anisotropically conductive composite medium
US4927368A (en) * 1986-10-13 1990-05-22 Sharp Kabushiki Kaisha Connector
US4863757A (en) * 1987-02-06 1989-09-05 Key-Tech, Inc. Printed circuit board
JP2528112B2 (ja) * 1987-03-13 1996-08-28 キヤノン株式会社 電気的接続部材及びそれを用いた電気回路部材
US4838347A (en) * 1987-07-02 1989-06-13 American Telephone And Telegraph Company At&T Bell Laboratories Thermal conductor assembly
US4778635A (en) * 1987-09-18 1988-10-18 American Telephone And Telegraph Company Method and apparatus for fabricating anisotropically conductive material
DE3838413A1 (de) * 1988-11-12 1990-05-17 Mania Gmbh Adapter fuer elektronische pruefvorrichtungen fuer leiterplatten und dergl.

Also Published As

Publication number Publication date
DE69027171D1 (de) 1996-07-04
JP3038859B2 (ja) 2000-05-08
JP3332006B2 (ja) 2002-10-07
EP0420690A2 (en) 1991-04-03
JPH03183974A (ja) 1991-08-09
JP3087294B2 (ja) 2000-09-11
EP0420690A3 (en) 1992-03-11
US5317255A (en) 1994-05-31
JPH11353948A (ja) 1999-12-24
DE69027171T2 (de) 1996-10-10
JPH03196416A (ja) 1991-08-27
EP0420690B1 (en) 1996-05-29
US5132058A (en) 1992-07-21

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