KR910006377A - 실라놀 함량이 낮은 가용성 축합 하이드리도실리콘 수지의 제조 방법 - Google Patents

실라놀 함량이 낮은 가용성 축합 하이드리도실리콘 수지의 제조 방법 Download PDF

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KR910006377A
KR910006377A KR1019900013802A KR900013802A KR910006377A KR 910006377 A KR910006377 A KR 910006377A KR 1019900013802 A KR1019900013802 A KR 1019900013802A KR 900013802 A KR900013802 A KR 900013802A KR 910006377 A KR910006377 A KR 910006377A
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organic layer
polymer
acid
layer
hydrolysis medium
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KR1019900013802A
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KR940011165B1 (ko
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마빈 뱅크 호워드
에릭 시푸엔테스 마틴
에일린 마틴 테레사
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노만 에드워드 루이스
다우 코닝 코포레이션
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/06Preparatory processes

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)

Abstract

내용 없음.

Description

실라놀 함량이 낮은 가용성 축합 하이드리도실리콘수지의 제조 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (5)

  1. 아릴설폰산 수화물을 함유하는 가수분해 매질을 형성시키고, 실란을 함유하는 액체를 교반된 가수분해 매질에 가한 다음, 가수분해 매질 중에서 실란의 가수분해를 촉진시켜 중합체를 형성시키고, 산 층 및 중합체를 함유하는 유기층을 포함하는 불혼화 층 내에 가수분해 매질 및 중합체를 침강시킨 다음, 산층으로부터 유기층을 분리하고, 유기층을 잔류 산 종을 중화시키기에 충분할 만큼 연기성이지만 중합체의 재배열 또는 수소화 규소의 가용매 분해에 촉매 작용을 할 정도는 아닌 중화제와 접촉시킴을 특징으로하여, 일반식 HaSiX4-a(여기서, a는 1 또는 2 이고 X는 가수분해가능한 그룹이다)의 실란을 가수분해하여 일반식 HaSiO(△-a)/2의 단위를 함유하는 중합체를 제조하는 방법.
  2. 제 1 항에 있어서, 실란을 함유하는 액체가 일반식 RaSiX4-a또는 R'RSiX2(여기서, a는 1 또는 2이고, X는 가수분해가능한 그룹이고, R은 알킬, 아릴, 불포화 탄화수소, 치환된 알킬 또는 치환된 아릴이며, R'는 R 또는 H이다)의 오가노실란 하나 이상을 추가로 포함하는 방법.
  3. 제 1 항에 있어서, 실란을 함유하는 액체가 실란 및 탄화수소 용매를 필수 성분으로 함유하는 방법.
  4. 제 3 항에 있어서, 가수분해 매질을 방향족 탄화수소 및 농황산을 합하여 형성시키는 방법.
  5. 톨루엔과 농황산을 합하여 톨루엔설폰산 수화물 가수분해 매질을 형성시키고, 톨루엔 중에 용해된 트리클로로실란을 교반된 가수분해 매질에 가한 다음, 가수분해 매질 중에서의 실란의 가수분해를 촉진시켜 중합체를 형성시키고, 가수분해 매질 및 중합체를 산층 및 중합체 및 톨루엔을 함유하는 유기층을 포함하는 불혼화층 내에 침강시킨 다음, 산층으로부터 유기층을 분리시키고 유기층을 수성황산으로 세척한 다음 유기층을 탄산 칼슘과 접촉시켜 잔류 산 종을 중화시키고, 탄산 칼륨으로부터 유기층을 분리한 다음, 중화된 유기층을 건조제와 접촉시키고, 건조제로부터 유기층을 분리하고, 용매를 증발시킴을 특징으로 하여, 일반식 HSiCI3의 실란을 가수분해시켜 일반식 HSiO3/2의 단위를 함유하는 중합체를 제조하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900013802A 1989-09-01 1990-09-01 실라놀 함량이 낮은 가용성 축합 하이드리도실리콘수지의 제조 방법 KR940011165B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/401,726 US5010159A (en) 1989-09-01 1989-09-01 Process for the synthesis of soluble, condensed hydridosilicon resins containing low levels of silanol
US401,726 1989-09-01
US401726 1989-09-01

Publications (2)

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KR910006377A true KR910006377A (ko) 1991-04-29
KR940011165B1 KR940011165B1 (ko) 1994-11-24

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US (1) US5010159A (ko)
EP (1) EP0419076B1 (ko)
JP (1) JPH0641518B2 (ko)
KR (1) KR940011165B1 (ko)
CA (1) CA2024241C (ko)
DE (1) DE69020278T2 (ko)

Families Citing this family (122)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2035367A1 (en) * 1990-02-22 1991-08-23 Ronald H. Baney Precursor polymer for ceramic coatings
US5091162A (en) * 1990-10-01 1992-02-25 Dow Corning Corporation Perhydrosiloxane copolymers and their use as coating materials
US5063267A (en) * 1990-11-28 1991-11-05 Dow Corning Corporation Hydrogen silsesquioxane resin fractions and their use as coating materials
US5210168A (en) * 1992-04-02 1993-05-11 Dow Corning Corporation Process for forming siloxane bonds
US5436029A (en) * 1992-07-13 1995-07-25 Dow Corning Corporation Curing silicon hydride containing materials by exposure to nitrous oxide
CA2104340A1 (en) * 1992-08-31 1994-03-01 Grish Chandra Hermetic protection for integrated circuits
US5310583A (en) * 1992-11-02 1994-05-10 Dow Corning Corporation Vapor phase deposition of hydrogen silsesquioxane resin in the presence of nitrous oxide
US5380555A (en) * 1993-02-09 1995-01-10 Dow Corning Toray Silicone Co., Ltd. Methods for the formation of a silicon oxide film
US5387480A (en) 1993-03-08 1995-02-07 Dow Corning Corporation High dielectric constant coatings
US5441765A (en) * 1993-09-22 1995-08-15 Dow Corning Corporation Method of forming Si-O containing coatings
KR100361043B1 (ko) 1993-12-27 2003-04-10 가와사키 마이크로 엘렉트로닉스 가부시키가이샤 반도체장치의절연막및절연막형성용도포액및절연막의제조방법
US5501875A (en) 1994-12-27 1996-03-26 Dow Corning Corporation Metal coated silica precursor powders
CA2175433A1 (en) * 1995-05-11 1996-11-12 Gregg Alan Zank Ceramic matrix composites using modified hydrogen silsesquioxane resin
US5516867A (en) * 1995-05-12 1996-05-14 Dow Corning Corporation Modified hydrogen silsesquioxane resin
JPH11512474A (ja) * 1995-09-12 1999-10-26 ゲレスト インコーポレーテツド ベータ−置換オルガノシルセスキオキサンおよびその使用法
US6770726B1 (en) 1995-09-12 2004-08-03 Gelest, Inc. β-substituted organosilsesquioxane polymers
US5985229A (en) * 1995-09-21 1999-11-16 Toagosei Co., Ltd. Solid silica derivative and process for producing the same
US5693701A (en) 1995-10-26 1997-12-02 Dow Corning Corporation Tamper-proof electronic coatings
US5753374A (en) 1995-11-27 1998-05-19 Dow Corning Corporation Protective electronic coating
US5609925A (en) 1995-12-04 1997-03-11 Dow Corning Corporation Curing hydrogen silsesquioxane resin with an electron beam
US5780163A (en) * 1996-06-05 1998-07-14 Dow Corning Corporation Multilayer coating for microelectronic devices
US5693565A (en) * 1996-07-15 1997-12-02 Dow Corning Corporation Semiconductor chips suitable for known good die testing
US5807611A (en) * 1996-10-04 1998-09-15 Dow Corning Corporation Electronic coatings
US5711987A (en) * 1996-10-04 1998-01-27 Dow Corning Corporation Electronic coatings
US5776235A (en) * 1996-10-04 1998-07-07 Dow Corning Corporation Thick opaque ceramic coatings
US6020410A (en) * 1996-10-29 2000-02-01 Alliedsignal Inc. Stable solution of a silsesquioxane or siloxane resin and a silicone solvent
US20100273011A1 (en) * 1996-12-20 2010-10-28 Bianxiao Zhong Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates
WO2009111196A1 (en) * 2008-03-04 2009-09-11 Dow Corning Corporation Silicone composition, silicone adhesive, coated and laminated substrates
US5707681A (en) * 1997-02-07 1998-01-13 Dow Corning Corporation Method of producing coatings on electronic substrates
EP1826231A3 (en) * 1997-04-21 2007-09-12 AlliedSignal Inc. Organohydridosiloxane Resins With High Organic Content
US6218497B1 (en) 1997-04-21 2001-04-17 Alliedsignal Inc. Organohydridosiloxane resins with low organic content
US6043330A (en) * 1997-04-21 2000-03-28 Alliedsignal Inc. Synthesis of siloxane resins
US6015457A (en) * 1997-04-21 2000-01-18 Alliedsignal Inc. Stable inorganic polymers
US6143855A (en) 1997-04-21 2000-11-07 Alliedsignal Inc. Organohydridosiloxane resins with high organic content
US6743856B1 (en) 1997-04-21 2004-06-01 Honeywell International Inc. Synthesis of siloxane resins
US5973095A (en) * 1997-04-21 1999-10-26 Alliedsignal, Inc. Synthesis of hydrogensilsesquioxane and organohydridosiloxane resins
US5866197A (en) * 1997-06-06 1999-02-02 Dow Corning Corporation Method for producing thick crack-free coating from hydrogen silsequioxane resin
TW392288B (en) 1997-06-06 2000-06-01 Dow Corning Thermally stable dielectric coatings
US6018002A (en) * 1998-02-06 2000-01-25 Dow Corning Corporation Photoluminescent material from hydrogen silsesquioxane resin
US6218020B1 (en) 1999-01-07 2001-04-17 Alliedsignal Inc. Dielectric films from organohydridosiloxane resins with high organic content
US6177199B1 (en) 1999-01-07 2001-01-23 Alliedsignal Inc. Dielectric films from organohydridosiloxane resins with low organic content
KR100600630B1 (ko) 1998-04-24 2006-07-13 쇼쿠바이가세고교 가부시키가이샤 저유전율 실리카계 피막 형성용 도포액 및 저유전율피막으로 도포된 기재
GB9812425D0 (en) 1998-06-10 1998-08-05 Dow Corning Electroless metal disposition on silyl hyride functional resin
US5906859A (en) * 1998-07-10 1999-05-25 Dow Corning Corporation Method for producing low dielectric coatings from hydrogen silsequioxane resin
JP2000143810A (ja) * 1998-11-18 2000-05-26 Dow Corning Asia Ltd 水素シルセスキオキサン樹脂の製造方法
EP1059322A3 (en) * 1999-06-09 2002-05-29 Dow Corning Corporation Silicone resins and process for synthesis
US6281285B1 (en) * 1999-06-09 2001-08-28 Dow Corning Corporation Silicone resins and process for synthesis
US6440550B1 (en) * 1999-10-18 2002-08-27 Honeywell International Inc. Deposition of fluorosilsesquioxane films
US6287477B1 (en) 1999-10-18 2001-09-11 Honeywell International Inc. Solvents for processing silsesquioxane and siloxane resins
US6472076B1 (en) 1999-10-18 2002-10-29 Honeywell International Inc. Deposition of organosilsesquioxane films
US6143360A (en) * 1999-12-13 2000-11-07 Dow Corning Corporation Method for making nanoporous silicone resins from alkylydridosiloxane resins
US20050003215A1 (en) * 2000-02-16 2005-01-06 Nigel Hacker Synthesis of siloxane resins
US6759098B2 (en) 2000-03-20 2004-07-06 Axcelis Technologies, Inc. Plasma curing of MSQ-based porous low-k film materials
US6913796B2 (en) * 2000-03-20 2005-07-05 Axcelis Technologies, Inc. Plasma curing process for porous low-k materials
US6558755B2 (en) 2000-03-20 2003-05-06 Dow Corning Corporation Plasma curing process for porous silica thin film
US6576300B1 (en) 2000-03-20 2003-06-10 Dow Corning Corporation High modulus, low dielectric constant coatings
US7011868B2 (en) * 2000-03-20 2006-03-14 Axcelis Technologies, Inc. Fluorine-free plasma curing process for porous low-k materials
SG92708A1 (en) * 2000-04-28 2002-11-19 Dow Corning Process for synthesis of silicone resin
US6399210B1 (en) 2000-11-27 2002-06-04 Dow Corning Corporation Alkoxyhydridosiloxane resins
KR100343938B1 (en) 2000-11-29 2002-07-20 Samsung Electronics Co Ltd Preparation method of interlayer insulation membrane of semiconductor
US6623711B2 (en) * 2001-03-27 2003-09-23 Samsung Electronics Co., Ltd. Siloxane-based resin and method for forming insulating film between interconnect layers in semiconductor devices by using the same
US6596834B2 (en) 2001-09-12 2003-07-22 Dow Corning Corporation Silicone resins and porous materials produced therefrom
US6756085B2 (en) * 2001-09-14 2004-06-29 Axcelis Technologies, Inc. Ultraviolet curing processes for advanced low-k materials
US20030096090A1 (en) * 2001-10-22 2003-05-22 Boisvert Ronald Paul Etch-stop resins
KR100488347B1 (ko) * 2002-10-31 2005-05-10 삼성전자주식회사 실록산계 수지 및 이를 이용한 반도체 층간 절연막의형성방법
US20050260420A1 (en) * 2003-04-01 2005-11-24 Collins Martha J Low dielectric materials and methods for making same
KR100506695B1 (ko) * 2003-06-02 2005-08-08 삼성전자주식회사 실록산계 수지 및 이를 이용한 반도체 층간 절연막
JP4465233B2 (ja) 2003-06-30 2010-05-19 三星電子株式会社 多官能性環状シロキサン化合物、この化合物から製造されたシロキサン系重合体及びこの重合体を用いた絶縁膜の製造方法
KR100507967B1 (ko) * 2003-07-01 2005-08-10 삼성전자주식회사 실록산계 수지 및 이를 이용한 반도체 층간 절연막
EP1660561B1 (en) * 2003-07-03 2014-02-12 Dow Corning Corporation Photosensitive silsesquioxane resin
KR100504291B1 (ko) * 2003-07-14 2005-07-27 삼성전자주식회사 게르마늄을 포함하는 실록산계 수지 및 이를 이용한반도체 층간 절연막 형성 방법
WO2005010077A1 (ja) 2003-07-29 2005-02-03 Toagosei Co., Ltd. 珪素含有高分子化合物及びその製造方法並びに耐熱性樹脂組成物及び耐熱性皮膜
KR20050024721A (ko) * 2003-09-01 2005-03-11 삼성전자주식회사 신규 실록산계 수지 및 이를 이용한 반도체 층간 절연막
KR100979355B1 (ko) * 2003-10-09 2010-08-31 삼성전자주식회사 다반응성 환형 실리케이트 화합물, 상기 화합물로부터제조된 실록산계 중합체 및 상기 중합체를 이용한 절연막제조방법
JP5010098B2 (ja) * 2003-11-24 2012-08-29 三星電子株式会社 分子多面体型シルセスキオキサンを用いた半導体層間絶縁膜の形成方法
KR101007807B1 (ko) * 2003-12-13 2011-01-14 삼성전자주식회사 다반응성 선형 실록산 화합물, 상기 화합물로부터 제조된실록산 중합체 및 상기 중합체를 이용한 절연막 제조방법
WO2006033775A1 (en) 2004-09-17 2006-03-30 Dow Corning Corporation Siloxane composition, agglomerate, and method of preparing agglomerate
US8088547B2 (en) * 2004-11-02 2012-01-03 Dow Corning Corporation Resist composition
US7756384B2 (en) * 2004-11-08 2010-07-13 Dow Corning Corporation Method for forming anti-reflective coating
KR20060068348A (ko) * 2004-12-16 2006-06-21 삼성코닝 주식회사 실록산계 중합체 및 상기 중합체를 이용한 절연막 제조방법
US7833696B2 (en) 2004-12-17 2010-11-16 Dow Corning Corporation Method for forming anti-reflective coating
JP2008547194A (ja) * 2005-06-15 2008-12-25 ダウ・コーニング・コーポレイション 水素シルセスキオキサンを硬化させていき、ナノスケールのトレンチ中において密にさせる方法
JP5043317B2 (ja) * 2005-08-05 2012-10-10 東レ・ダウコーニング株式会社 環状ジハイドロジェンポリシロキサン、ハイドロジェンポリシロキサン、それらの製造方法、シリカ系ガラス成形体およびその製造方法、光学素子およびその製造方法
US8356407B2 (en) * 2005-09-29 2013-01-22 Dow Corning Corporation Method of releasing high temperature films and/or devices from metallic substrates
JP4783117B2 (ja) * 2005-10-21 2011-09-28 東レ・ダウコーニング株式会社 シリカ系ガラス薄層付き無機質基板、その製造方法、コーテイング剤および半導体装置
KR101324052B1 (ko) 2006-02-13 2013-11-01 다우 코닝 코포레이션 반사방지 코팅 재료
KR101216060B1 (ko) * 2006-06-28 2012-12-28 도쿄 오카 고교 가부시키가이샤 전자 유인성 관능 그룹을 갖는 염기 첨가제를 함유한 실세스퀴옥산 수지 시스템
US8148043B2 (en) * 2006-06-28 2012-04-03 Dow Corning Corporation Silsesquioxane resin systems with base additives bearing electron-attracting functionalities
WO2008018981A2 (en) 2006-08-04 2008-02-14 Dow Corning Corporation Silicone resin and silicone composition
KR20090057397A (ko) * 2006-09-21 2009-06-05 제이에스알 가부시끼가이샤 실리콘 수지 조성물 및 트렌치 아이솔레이션의 형성 방법
JP2008101206A (ja) * 2006-09-21 2008-05-01 Jsr Corp シリコーン樹脂、シリコーン樹脂組成物およびトレンチアイソレーションの形成方法
JP2008266119A (ja) * 2006-11-24 2008-11-06 Jsr Corp シリコーン樹脂、シリコーン樹脂組成物およびトレンチアイソレーションの形成方法
KR101361593B1 (ko) * 2006-12-20 2014-02-21 다우 코닝 코포레이션 경화된 실리콘 수지 조성물의 다층으로 피복되거나 적층된 유리 기판
WO2008079179A1 (en) * 2006-12-20 2008-07-03 Dow Corning Corporation Glass substrates coated or laminated with cured silicone resin compositions
KR20100126295A (ko) 2008-01-08 2010-12-01 다우 코닝 도레이 캄파니 리미티드 실세스퀴옥산 수지
CN101910253B (zh) * 2008-01-15 2013-04-10 陶氏康宁公司 倍半硅氧烷树脂
CN101959939B (zh) * 2008-03-04 2013-02-06 陶氏康宁公司 硼硅氧烷组合物,硼硅氧烷粘合剂,涂布和层压的基底
CN101990551B (zh) * 2008-03-04 2012-10-03 陶氏康宁公司 倍半硅氧烷树脂
KR101541939B1 (ko) * 2008-03-05 2015-08-04 다우 코닝 코포레이션 실세스퀴옥산 수지
KR20110013509A (ko) * 2008-05-27 2011-02-09 다우 코닝 코포레이션 접착 테이프 및 접합 유리
TW201004795A (en) * 2008-07-31 2010-02-01 Dow Corning Laminated glass
JP5632387B2 (ja) * 2008-12-10 2014-11-26 ダウ コーニング コーポレーションDow Corning Corporation 湿式エッチング可能な反射防止膜
US8809482B2 (en) 2008-12-10 2014-08-19 Dow Corning Corporation Silsesquioxane resins
KR101224514B1 (ko) 2010-07-05 2013-01-22 한국과학기술연구원 환형 실세스퀴옥산을 이용한 실록산계 저유전막 및 이의 제조방법
WO2012064534A1 (en) 2010-11-09 2012-05-18 Dow Corning Corporation Hydrosilylation cured silicone resins plasticized by organophosphorous compounds
TW201339249A (zh) 2012-01-09 2013-10-01 Dow Corning 作為硬罩幕抗反射塗覆材料之以二叔丁氧基雙乙醯氧基矽烷為主之倍半矽氧烷樹脂及其製造方法
WO2013109684A1 (en) 2012-01-18 2013-07-25 Dow Corning Corporation Silicon-rich antireflective coating materials and method of making same
TWI676817B (zh) 2014-04-09 2019-11-11 美商道康寧公司 光學元件及形成光學元件之方法
KR102301276B1 (ko) 2014-04-09 2021-09-14 다우 실리콘즈 코포레이션 소수성 용품
US10597495B2 (en) 2016-02-19 2020-03-24 Dow Silicones Corporation Aged polymeric silsesquioxanes
FI129480B (en) * 2018-08-10 2022-03-15 Pibond Oy Silanol-containing organic-inorganic hybrid coatings for high-resolution patterning
US20240141210A1 (en) 2020-05-07 2024-05-02 Dow Silicones Corporation Silicone hybrid pressure sensitive adhesive and methods for its preparation and use on uneven surfaces
EP4146761A1 (en) 2020-05-07 2023-03-15 Dow Silicones Corporation Silicone hybrid pressure sensitive adhesive and methods for its preparation and use in protective films for (opto)electronic device fabrication
EP4217435A1 (en) 2020-09-22 2023-08-02 Dow Silicones Corporation Curable silicone-(meth)acrylate composition and methods for its preparation and use
CN116261565A (zh) 2020-10-13 2023-06-13 美国陶氏有机硅公司 具有醛官能团的有机硅化合物的制备
CN118019747A (zh) 2021-10-06 2024-05-10 陶氏环球技术有限责任公司 丙基亚胺官能化有机硅化合物和伯氨基丙基官能化有机硅化合物的制备
WO2023060155A1 (en) 2021-10-06 2023-04-13 Dow Global Technologies Llc Preparation of propylimine-functional organosilicon compounds and primary aminopropyl-functional organosilicon compounds
WO2023060153A1 (en) 2021-10-06 2023-04-13 Dow Global Technologies Llc Preparation of amino-functional organosilicon compounds
WO2023091868A2 (en) 2021-11-22 2023-05-25 Dow Global Technologies Llc Preparation of organosilicon compounds with carbinol functionality
WO2023183682A1 (en) 2022-03-21 2023-09-28 Dow Global Technologies Llc Preparation of organosilicon compounds with carboxy functionality
WO2023201146A1 (en) 2022-04-13 2023-10-19 Dow Global Technologies Llc Preparation of organosilicon compounds with vinylester functionality
WO2023201138A1 (en) 2022-04-13 2023-10-19 Dow Global Technologies Llc Preparation of polyether-functional organosilicon compounds

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE538964A (ko) *
US2452416A (en) * 1944-04-26 1948-10-26 Gen Electric Process of making dimethyl silicone products
US2901460A (en) * 1956-02-07 1959-08-25 Gen Electric Halosilane hydrolysis with tetrahydrofuran and water
GB929374A (en) * 1959-07-16 1963-06-19 Wacker Chemie Gmbh Process for hydrolysing chlorosilanes
GB935709A (en) * 1959-12-08 1963-09-04 Gen Electric Improvements relating to organopolysiloxanes
FR1472047A (fr) * 1965-06-29 1967-03-10 Soc Ind Des Silicones Polycondensats de silanes et procédé de préparation desdits polycondensats
US3615272A (en) * 1968-11-04 1971-10-26 Dow Corning Condensed soluble hydrogensilsesquioxane resin

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CA2024241C (en) 1996-08-27
US5010159A (en) 1991-04-23
JPH0641518B2 (ja) 1994-06-01
KR940011165B1 (ko) 1994-11-24
CA2024241A1 (en) 1991-03-02
DE69020278T2 (de) 1996-01-04
JPH03119028A (ja) 1991-05-21
DE69020278D1 (de) 1995-07-27
EP0419076B1 (en) 1995-06-21

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