KR910005444A - 와이어본딩 검사장치 - Google Patents

와이어본딩 검사장치 Download PDF

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KR910005444A
KR910005444A KR1019900012666A KR900012666A KR910005444A KR 910005444 A KR910005444 A KR 910005444A KR 1019900012666 A KR1019900012666 A KR 1019900012666A KR 900012666 A KR900012666 A KR 900012666A KR 910005444 A KR910005444 A KR 910005444A
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wire
optical imaging
image
measurement
recognition
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KR1019900012666A
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KR930005496B1 (ko
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가즈유키 야마나카
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아오이 죠이치
가부시키가이샤 도시바
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
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    • H01L2224/78—Apparatus for connecting with wire connectors
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/01—Chemical elements
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    • H01L2924/01039—Yttrium [Y]

Abstract

내용 없음.

Description

와이어본딩 검사장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예에 따른 와이어본딩 검사장치의 구성을 나타낸 블록도.

Claims (2)

  1. 반도체 칩(1)과 리이드(4)간에 본딩된 와이어(2)에 대해 검사를 행하는 장치에 있어서, 와이어본딩된 상기 반도체 칩(1) 및 리이드(4)를 탑재하는 탑재수단과(11), 탑재된 반도체 칩(1) 및 리이드(4)간의 와이어(2)를 조명하는 조명수단(12), 조명된 와이어(2)의 상(像)을 광학적으로 결상시키는 광학적 결상수단(13;光學的 結像手段)이 광학적 결상수단(13)에 의해 결상된 것을 부여받아서 화상신호로 변환하여 출력하는 촬상수단(14), 이 촬상수단(14)이 출력한 화상신호를 부여받아서 상기 와이어(2)의 검사로서 와이어(2)의 형상의 인식 및 와이어(2)의 본딩위치의 계측을 하는 인식 및 계측수단(20), 상기 와이어(2)의 합부판단기준(合否判斷基準)을 기억하는 기억수단(19), 상기 인식 및 계측수단(20)이 인식·계측한 결과를 부여받아서 이를 상기 합부판단기준 기억수단(19)이 기억하고 있는 합부판단기준과 비교조합(比較照合)하여 와이어(2)에 관해 합부의 판단을 하고 그 판단결과를 출력하는 합부판단수단(17), 상기 광학적 결상수단(13)을 이동시키는 이동수단(15), 상기 와이어(2)중에서 검사될 영역이 상기 광학적 결상수단(13)에 의해 결상되도록 상기 이동수단(15)을 제어하는 이동제어수단(16, 17)을 구비하고, 상기 광학적 결상수단(13)이 결상(結像)하는 영역을 이동시키도록 되어 있는 것을 특징으로 하는 와이어본딩 검사장치.
  2. 반도체 칩(1)과 리이드(4)간에 본딩된 와이어(2)에 대해 검사를 행하는 장치에 있어서, 와이어본딩된 상기 반도체 칩(1) 및 리이드(4)를 탑재하는 탑재수단과(11), 탑재된 반도체 칩(1) 및 리이드(4)간의 와이어(2)를 조명하는 조명수단(12), 조명된 와이어(2)의 상(像)을 광학적으로 결상시키는 광학적 결상수단(13;光學的結像手段), 이 광학적 결상수단(13)에 의해 결상된 것을 부여받아서 화상신호로 변환하여 출력하는 촬상수단(14), 이 촬상수단(14)이 출력한 화상신호를 부여받아서 상기 와이어(2)의 검사로서 와이어(2)의 형상의 인식 및 와이어(2)의 본딩위치의 계측을 하는 인식 및 계측수단(20), 상기 와이어(2)의 합부판단기준(合否判斷基準)을 기억하는 기억수단(19), 상기 인식 및 계측수단(20)이 인식·계측한 결과를 부여받아서 이를 상기 합부판단기준 기억수단(19)이 기억하고 있는 합부판단기준과 비교조합(比較照合)하여 와이어(2)에 관해 합부의 판단을 하고 그 판단결과를 출력하는 합부판단수단(17), 상기 탑재수단(11)을 이동시키는 이동수단, 상기 와이어(2) 중에서 검사될 영역이, 상기 광학적 결상수단(13)에 의해 결상되도록 상기 이동수단을 제어하는 이동제어수단을 구비하고, 상기 광학적 결상수단(13)이 결상(結像)하는 영역을 이동시키도록 되어 있는 것을 특징으로 하는 와이어본딩 검사장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900012666A 1989-08-18 1990-08-17 와이어본딩 검사장치 KR930005496B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1-212712 1989-08-18
JP1-212172 1989-08-18
JP1212172A JPH07111998B2 (ja) 1989-08-18 1989-08-18 ワイヤボンディング検査装置

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KR910005444A true KR910005444A (ko) 1991-03-30
KR930005496B1 KR930005496B1 (ko) 1993-06-22

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US (1) US5138180A (ko)
EP (1) EP0413349B1 (ko)
JP (1) JPH07111998B2 (ko)
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DE (1) DE69014013T2 (ko)

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KR100317599B1 (ko) * 2000-02-17 2001-12-24 서경석 와이어 본딩 위치 인식방법
KR100460047B1 (ko) * 2001-09-21 2004-12-04 주식회사 칩팩코리아 반도체패키지의 본딩검사방법
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KR100364559B1 (ko) * 1998-09-17 2002-12-12 주식회사 뷰웰 반도체 리드 검사장치
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US7505619B2 (en) * 2002-09-27 2009-03-17 Kla-Tencor Technologies Corporation System and method for conducting adaptive fourier filtering to detect defects in dense logic areas of an inspection surface
EP2346748B1 (en) * 2008-11-12 2020-04-22 Silgan Dispensing Systems Corporation Spray devices and methods for using the same
SG2013084975A (en) * 2013-11-11 2015-06-29 Saedge Vision Solutions Pte Ltd An apparatus and method for inspecting asemiconductor package
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JP7166234B2 (ja) * 2019-09-30 2022-11-07 三菱電機株式会社 半導体製造検査装置

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US4200393A (en) * 1976-06-07 1980-04-29 Tokyo Shibaura Elecric Co., Ltd. Method of positioning a semiconductor member by examining it and a die bonding apparatus using the same
DE2643810C2 (de) * 1976-09-29 1983-08-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Einjustieren
JPS57155743A (en) * 1981-03-20 1982-09-25 Fujitsu Ltd Inspection device for semiconductor bonding wire
JPS59150433A (ja) * 1983-02-05 1984-08-28 Fujitsu Ltd ワイヤ検査装置
JPS59171129A (ja) * 1983-03-17 1984-09-27 Fujitsu Ltd 自動配線検査装置
JPH0671039B2 (ja) * 1984-04-26 1994-09-07 富士通株式会社 ダイボンディング状態の検査装置
JPS6362242A (ja) * 1986-09-02 1988-03-18 Toshiba Corp ワイヤボンディング装置
JPH0666370B2 (ja) * 1987-04-14 1994-08-24 株式会社東芝 半導体デバイス用外観検査装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100317599B1 (ko) * 2000-02-17 2001-12-24 서경석 와이어 본딩 위치 인식방법
KR100460047B1 (ko) * 2001-09-21 2004-12-04 주식회사 칩팩코리아 반도체패키지의 본딩검사방법
KR20200000072U (ko) 2018-06-29 2020-01-08 안진상 차광막

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DE69014013D1 (de) 1994-12-15
KR930005496B1 (ko) 1993-06-22
EP0413349A2 (en) 1991-02-20
EP0413349A3 (en) 1992-02-12
US5138180A (en) 1992-08-11
JPH0376137A (ja) 1991-04-02
DE69014013T2 (de) 1995-04-20
EP0413349B1 (en) 1994-11-09
JPH07111998B2 (ja) 1995-11-29

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