KR930014869A - 본딩와이어 검사장치 - Google Patents

본딩와이어 검사장치 Download PDF

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Publication number
KR930014869A
KR930014869A KR1019920022047A KR920022047A KR930014869A KR 930014869 A KR930014869 A KR 930014869A KR 1019920022047 A KR1019920022047 A KR 1019920022047A KR 920022047 A KR920022047 A KR 920022047A KR 930014869 A KR930014869 A KR 930014869A
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South Korea
Prior art keywords
bonding wire
inspection device
photoelectric conversion
wire inspection
conversion element
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KR1019920022047A
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English (en)
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KR960005093B1 (ko
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겐지 스가하라
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아라이 가즈오
가부시끼가이샤 신가와
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Publication of KR930014869A publication Critical patent/KR930014869A/ko
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Publication of KR960005093B1 publication Critical patent/KR960005093B1/ko

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    • H—ELECTRICITY
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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    • G—PHYSICS
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    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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Abstract

내용 없음

Description

본딩와이어 검사장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예에 의한 본딩와이어 검사장치의 구성을 나타내는 개략 설명도.
제2도는 제1도의 개략 정면도.
제3도는 광전변환 소자의 초점 맞추기와 광선 각도의 설명도.
제4도는 결상렌즈군의 결상레벨과, 결상(화각 ; 畵角 )사이즈 설명도.
제5도는 종래의 본딩와이어 검사장치의 구성도.
제6도는 와이어 본딩된 반도체 장치의 평면도.
제7도는 제5도의 정면도.
제8도는 본딩와이어의 확대정면 설명도.
제9도는 제7도의 평면도.
* 도면의 주요부분에 대한 부호의 설명
6 : 시료 20 : 광학계
30 : 수직조명수단 40 : CCD카메라
40a : 광전변환소자 41 : XYZ테이블
42 : X테이블 45 : Y테이블
48 : Z테이블 60 : 결상레벨

Claims (2)

  1. 검사대상을 위쪽에 설치된 광학계와, 검사대상물에 조명을 조사하는 조명수단과, 상기 광학계의 결상레벨에 설치된 광전변환소자와, 이 광전변환소자만을 XY방향으로 이동시키는 XY테이블을 구비한 것을 특징으로 하는 본딩와이어 검사장치.
  2. 검사대상물 위쪽에 설치된 광학계와, 검사대상물에 조명을 조사하는 조명수단과, 상기 광학계의 결상레벨에 설치된 광전변환소자와, 이 광전변환소자만을 XYZ방향으로 이동시키는 XYZ테이블을 구비한 것을 특징으로 하는 본딩와이어 검사장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920022047A 1991-12-10 1992-11-23 본딩와이어 검사장치 KR960005093B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-349754 1991-12-10
JP3349754A JP2990550B2 (ja) 1991-12-10 1991-12-10 ボンデイングワイヤ検査装置

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KR930014869A true KR930014869A (ko) 1993-07-23
KR960005093B1 KR960005093B1 (ko) 1996-04-20

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US (1) US5293217A (ko)
JP (1) JP2990550B2 (ko)
KR (1) KR960005093B1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3005781B2 (ja) * 1992-08-04 2000-02-07 株式会社新川 ワイヤボンデイング装置のモータ制御回路
JP3370547B2 (ja) * 1997-03-17 2003-01-27 株式会社新川 ボンディングワイヤ高さ検査装置
US6545541B2 (en) * 2001-05-29 2003-04-08 Ericsson Inc. Power amplifier embedded cell bias detection, methods of detecting bias in power amplifiers and systems utilizing embedded cell bias detection
JP6450700B2 (ja) * 2016-03-29 2019-01-09 Ckd株式会社 基板検査装置
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JPH05160234A (ja) 1993-06-25
US5293217A (en) 1994-03-08
KR960005093B1 (ko) 1996-04-20

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