KR960012393A - 본딩 와이어 검사방법 - Google Patents

본딩 와이어 검사방법 Download PDF

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Publication number
KR960012393A
KR960012393A KR1019950024520A KR19950024520A KR960012393A KR 960012393 A KR960012393 A KR 960012393A KR 1019950024520 A KR1019950024520 A KR 1019950024520A KR 19950024520 A KR19950024520 A KR 19950024520A KR 960012393 A KR960012393 A KR 960012393A
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South Korea
Prior art keywords
wire
optical system
inspection method
bonding wire
wire inspection
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KR1019950024520A
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English (en)
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KR100197178B1 (ko
Inventor
히로미 도미야마
세도루 나가이
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후지야마 겐지
가부시키가이샤 신가와
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Publication of KR960012393A publication Critical patent/KR960012393A/ko
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Publication of KR100197178B1 publication Critical patent/KR100197178B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/789—Means for monitoring the connection process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

목적 : 배경에 영향받지 않고 와이어를 검출한다.
구성 : 저조사 각도 링모양 조명기의 조명을 수평면에 대하여 7~12°로 조사하고, 또한 광학계의 초점심도를 얕게하고, 광학계의 합초점에 있어서의 와이어 중심부에 암부(33)를 출현시켜, 이 암부(33)를 검출함으로써 와이어 높이 및 또는 와이어 궤적을 검출한다.

Description

본딩 와이어 검사방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 본딩 와이어 검사방법의 1실시예를 나타내는 정면도.

Claims (1)

  1. 반도체칩의 패드와 리드프레임의 리드에 본딩된 와이어를 조명수단의 저조사 각도 링모양 조명기로 조사하고, 광학계를 통과시켜 촬영장치에서 촬상하여 와이어를 검사하는 본딩 와이어 검사방법에 있어서, 상기 저조사 각도 링모양의 조명기의 조명을 수평면에 대하여 7~12°로 조사하고, 또한 광학계의 초점심도를 얕게하고, 광학계의 합초점에 있어서의 와이어 중심부에 암부를 출현시켜, 이 암부를 검출함으로써 와이어 높이 및 또는 와이어 궤적을 검출하는 것을 특징으로 하는 본딩 와이어 검사방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950024520A 1994-09-09 1995-08-09 본딩 와이어 검사방법 KR100197178B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24079094A JP3235009B2 (ja) 1994-09-09 1994-09-09 ボンディングワイヤ検査方法
JP94-240790 1994-09-09

Publications (2)

Publication Number Publication Date
KR960012393A true KR960012393A (ko) 1996-04-20
KR100197178B1 KR100197178B1 (ko) 1999-06-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950024520A KR100197178B1 (ko) 1994-09-09 1995-08-09 본딩 와이어 검사방법

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US (1) US5576828A (ko)
JP (1) JP3235009B2 (ko)
KR (1) KR100197178B1 (ko)
TW (1) TW300329B (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3802957B2 (ja) * 1996-12-19 2006-08-02 富士機械製造株式会社 光沢を有する球冠状突起の撮像，位置特定方法およびシステム
US5926557A (en) * 1997-02-26 1999-07-20 Acuity Imaging, Llc Inspection method
US6201892B1 (en) * 1997-02-26 2001-03-13 Acuity Imaging, Llc System and method for arithmetic operations for electronic package inspection
US5828449A (en) * 1997-02-26 1998-10-27 Acuity Imaging, Llc Ring illumination reflective elements on a generally planar surface
US7145162B2 (en) * 2003-10-31 2006-12-05 Asm Assembly Automation Ltd. Wire loop height measurement apparatus and method
JP4365292B2 (ja) * 2004-09-02 2009-11-18 株式会社カイジョー ワイヤボンディングにおけるボール圧着厚の測定方法
US7344273B2 (en) 2005-03-22 2008-03-18 Binary Works, Inc. Ring light with user manipulable control
GB2479489A (en) * 2007-04-23 2011-10-12 Belron Hungary Kft Zug Branch Optical investigation device
JP5680005B2 (ja) 2012-02-24 2015-03-04 株式会社東芝 コネクタの嵌合状態を検査する検査方法および検査装置、並びにコネクタを有する電気機器の組立方法
SG2013084975A (en) * 2013-11-11 2015-06-29 Saedge Vision Solutions Pte Ltd An apparatus and method for inspecting asemiconductor package
US9781362B1 (en) * 2016-03-22 2017-10-03 Omnivision Technologies, Inc. Flare-reducing imaging system and associated image sensor
TWI697656B (zh) * 2017-12-20 2020-07-01 日商新川股份有限公司 線形狀檢查裝置以及線形狀檢查方法
TWI732506B (zh) * 2019-04-22 2021-07-01 日商新川股份有限公司 線形狀測量裝置、線三維圖像產生方法以及線形狀測量方法
KR20220049482A (ko) * 2020-10-14 2022-04-21 이미지 이큅먼트 피티이. 엘티디. 오버랩된 본드 와이어의 루프 길이 측정
CN112179920B (zh) * 2020-11-29 2021-04-13 惠州高视科技有限公司 一种芯片焊线缺陷的检测方法及系统
KR20230158581A (ko) 2021-07-29 2023-11-20 야마하 로보틱스 홀딩스 가부시키가이샤 3차원 화상 생성 장치 및 3차원 화상 생성 방법

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Publication number Priority date Publication date Assignee Title
JP2688361B2 (ja) * 1988-08-02 1997-12-10 正己 山川 光電センサ
US5030008A (en) * 1988-10-11 1991-07-09 Kla Instruments, Corporation Method and apparatus for the automated analysis of three-dimensional objects
JP2981942B2 (ja) * 1991-12-02 1999-11-22 株式会社新川 ボンデイングワイヤ検査方法

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Publication number Publication date
JPH0875429A (ja) 1996-03-22
US5576828A (en) 1996-11-19
JP3235009B2 (ja) 2001-12-04
TW300329B (ko) 1997-03-11
KR100197178B1 (ko) 1999-06-15

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